ON4800
Abstract: ball tracking
Text: SPECIFICATIONS DESKTOP R55 Weight Ball Tracking force Ball load Ball rotation Ball speed Housing material Transducer Mounting position 2” Marcus MECHANICAL 650gms Thermoset Phenolic, 57mm, 21/4” 15gms Nominal Continuous - No seal IP40/NEMA 1 200N Maximum downward pressure (20kg) @ 20ºc
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650gms
15gms
IP40/NEMA
RS232
ON4800
ball tracking
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trackball
Abstract: trackball ch DT225 track ball usb trackball trackball ch in
Text: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL USB INPUT: OUTPUT: MECHANICAL 5V @ 25mA max USB1.1 BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 2.25” Continuous 12g 460g 5 Million 2.38in (60.45mm)
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DT2257X20V00-Blk
DT225
trackball
trackball ch
track ball
usb trackball
trackball ch in
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trackball ch
Abstract: DT225 trackball trackball dt225 DT225 Gray Desktop trackball ch in 460g DT2253X20V00
Text: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL PS/2 INPUT: OUTPUT: MECHANICAL BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 5V @ 25mA max CMOS/TTL 2.25” Continuous 12g 460g 5 Million 2.38in
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DT2253X20V00
DT225
trackball ch
trackball
trackball dt225
DT225 Gray Desktop
trackball ch in
460g
DT2253X20V00
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PDF
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Untitled
Abstract: No abstract text available
Text: Precision Ceramic Resistors Ball Grid Arrays Make Possible Precision Ceramic Precision Ceramic HC-Precision Series Ball Grid Arrays atio tolerances to ±0.05% Ball Grid Arrays bsolute tolerances to ±0.1% CHC-Precision Series oHS compliant terminations available
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Untitled
Abstract: No abstract text available
Text: Precision Ceramic Precision Ceramic Ball Grid Arrays Ball Grid Arrays Precision CHC-Precision SeriesCeramic HC-Precision Ball Grid Arrays tolerances to ±0.05% • RatioSeries atio tolerances to ±0.05% Absolute tolerances to ±0.1% bsolute tolerances to ±0.1%
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lexan ls2
Abstract: KRD Polycarbonate T9902127 lexan 3 way switch diagram T9902128 T9902125 PHR-4 A3900126 4 pin usb connector details
Text: O50 Series OPTICAL TRACKERBALL • Specifications Mechanical Weight Ball Tracking Force 210 grams Epoxy Resin, 50.8 mm 10 grams Nominal Continuous – Free Running 80 grams Nominal Continuous – Friction / Scraper Ring 10 - 160 grams Nominal Continuous – Variable Friction Ring/Removable Ball
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O50-70020A:
DS01010
lexan ls2
KRD Polycarbonate
T9902127
lexan
3 way switch diagram
T9902128
T9902125
PHR-4
A3900126
4 pin usb connector details
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PDF
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R1507F20V00-B
Abstract: track ball trackball trackball ch usb trackball
Text: 2.36in 59.94mm 2.11in (53.59mm) 0.90in (22.86mm) 2.08in (52.83mm) Ball Diameter 1.50in (38.10mm) 0.61in (15.49mm) 2.36in (59.94mm) 0.85in (21.59mm) 0.11in (2.79mm) R0.125in (3.18mm) 2.08in (52.83mm) 0.27in (6.86mm) Ø1.54in (39.12mm) 2.11in (53.59mm) 0.38in
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125in
R1507F20V00-B
R150-1
R1507F20V00-B
track ball
trackball
trackball ch
usb trackball
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PDF
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track ball
Abstract: trackball trackball ch usb trackball
Text: 2.36in 59.94mm 2.11in (53.59mm) 0.90in (22.86mm) 2.08in (52.83mm) Ball Diameter 1.50in (38.10mm) 0.61in (15.49mm) 2.36in (59.94mm) 0.85in (21.59mm) 0.11in (2.79mm) R0.125in (3.18mm) 2.08in (52.83mm) 0.27in (6.86mm) Ø1.54in (39.12mm) 2.11in (53.59mm) 0.38in
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125in
R1507F20V00
R150-1
track ball
trackball
trackball ch
usb trackball
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trackball ch
Abstract: trackball LP100
Text: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)
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4-30x3/4
LP1007EXXH00-R
LP100
trackball ch
trackball
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100-133BX
Abstract: trackball ch in trackball trackball ch LP100
Text: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) SPECIFICATIONS
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100-133BX)
500mA
12VDC
100-133BX
100-133BX
trackball ch in
trackball
trackball ch
LP100
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trackball ch
Abstract: track ball trackball LP100 ball tracking
Text: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)
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4-30x3/4
LP1003EXXH00
LP100
trackball ch
track ball
trackball
ball tracking
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trackball
Abstract: trackball ch LP100 LP1003EXXH00-B
Text: 0.69in 17.53mm 0.69in (17.53mm) Ball Diameter 1.00in (25.40mm) R 0.22in (5.59mm) 1.75in (44.45mm) O 0.12in (3.05mm) 1.75in (44.45mm) 1.30in (33.02mm) 0.91in (23.11mm) 0.28in (7.11mm) 0.13in (3.30mm) 1.08in (27.43mm) 0.30in (7.62mm) 0.67in (17.02mm) 0.37in (9.40mm)
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4-30x3/4
LP1003EXXH00-B
LP100
trackball
trackball ch
LP1003EXXH00-B
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LCU130582
Abstract: No abstract text available
Text: 1310nm Laser Diode LCU130582E/F •Features Un-cooled Laser diode with MQW structure Wide operation temperature range Dew point below -40oC Both ball lens and flat window cap available ■External dimensions Unit : mm ■Absolute Maximum Ratings(Tc=25℃)
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1310nm
LCU130582E/F
-40oC
laser-comp85
lcu130582
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49R9
Abstract: alumina ball
Text: Precision Ceramic Ball Grid Arrays CHC-Precision Series • Ratio tolerances to ±0.05% • Absolute tolerances to ±0.1% • RoHS compliant terminations available • Superior TaNFilm resistors on ceramic substrate • Same footprint as the industry standard SOIC-N package
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smartphone MOTHERBOARD CIRCUIT diagram
Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code
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02-DT-0704-00
smartphone MOTHERBOARD CIRCUIT diagram
AP-DOC-070
Micron 512MB nand FLASH mcp
J9 G3
MARKING G3
MICRON mcp
QUALCOMM Reference manual
A0-A21
DM270
Flash MCp nand DRAM 107-ball
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PDF
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DM270
Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
Text: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code
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02-DT-0704-00
DM270
2Gb NAND FLASH Toshiba
QUALCOMM Reference manual
Diskonchip
toshiba 107ball
marking G3
smartphone MOTHERBOARD CIRCUIT diagram
Micron 512MB nand FLASH mcp
M-Systems diskonchip mcp
toshiba MLC nand flash
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PDF
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PLL VCO MIL-PRF-38535
Abstract: No abstract text available
Text: PC7410M16 RISC Microprocessor Multichip Package Datasheet - Preliminary Specification Features • • • • • • PC7410 RISC Microprocessor Dedicated 2 MB SSRAM L2 Cache, Configured as 256Kx72 21 mm x 25 mm, 255 Ceramic Ball Grid Array Maximum Core Frequency = 400 MHz
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PC7410M16
PC7410
256Kx72
PC7410M16
0879C
PLL VCO MIL-PRF-38535
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PDF
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Untitled
Abstract: No abstract text available
Text: VFB1012D Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount Voltage Divider features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at
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VFB1012D
08-Jan-09
VMN-PT0161-0904
08-Jan-09
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TMS 320 C 6X processor
Abstract: No abstract text available
Text: PC755BM8 RISC Microprocessor Multichip Package Datasheet - Preliminary Specification Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz
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PC755BM8
PC755BM8
complianc49
0882D
TMS 320 C 6X processor
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BA185
Abstract: Philips BA102 TRUEFFS BA109 HITACHI calypso freescale BA231 BA260 Diskonchip toshiba mcp Micron 512MB NOR FLASH
Text: DiskOnChip-Based MCP Including DiskOnChip G3, NOR, and PSRAM Data Sheet, August 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code
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2-DT-0704-10
BA185
Philips BA102
TRUEFFS
BA109 HITACHI
calypso freescale
BA231
BA260
Diskonchip
toshiba mcp
Micron 512MB NOR FLASH
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PDF
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BGA 64 PACKAGE thermal resistance
Abstract: No abstract text available
Text: VFB1515N Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount 3R Resistor Network features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at
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VFB1515N
04-Mar-09
VMN-PT0162-0904
BGA 64 PACKAGE thermal resistance
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Untitled
Abstract: No abstract text available
Text: VFB2028N Ultra-High-Precision Z-Foil Ball Grid Array BGA Surface-Mount Resistor 4R Network features • Temperature coefficient of resistance (TCR) – Absolute: ± 0.05 ppm/°C typical (0 °C to + 60 °C) – Tracking: 0.1 ppm/°C typical • Power coefficient of resistance (PCR) tracking (“∆R due to self heating”): 5 ppm at
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VFB2028N
17-Mar-09
VMN-PT0163-0903
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1838-3502
Abstract: 1832.3312 HP 306 1832.3311 1833.3402 5E4 Switch 1835.3118 T-10555 d 1833 hp 250
Text: SERIES 1830 - SINGLE POLE AND DOUBLE POLE ROCKER SWITCHES UP TO 20 4 A 250 V~ PRODUCT ADVANTAGES ◆ Switching principle with long life endurance due to a low friction contact system (ball), proven a 100 million times over ◆ Attractive rocker switches with
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connector32
1838-3502
1832.3312
HP 306
1832.3311
1833.3402
5E4 Switch
1835.3118
T-10555
d 1833
hp 250
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ELPIDA 512MB NOR FLASH
Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
Text: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code
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97-DT-0304-00
ELPIDA 512MB NOR FLASH
nand mcp elpida
MCP NOR FLASH SDRAM elpida
Diskonchip
MS08-D9SD7-B3
marking G3
QUALCOMM Reference manual
nec 4 Banks x 1m x 32Bit Synchronous DRAM
emblaze
qualcomm 1100
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