The Band-It® Clamping System
Abstract: bandit TIE-DEX bandit BAND-IT IDEX idex
Text: Banding Tools The BAND-IT Clamping System Fast, Cost-Effective Shielding Termination The BAND-IT® clamping system provides quick, easy, cost-effective and highly reliable termination of braided metallic shielding or fabric braid. Combined with Glenair's vast selection of
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Untitled
Abstract: No abstract text available
Text: Interconnect Cable Assembly Tools Band-It Shield Termination Tools, Connector-to-Backshell Holding Tools, Fiber Optic Termination Kits and More! United States United Kingdom Germany France Nordic Italy Spain Japan To Most People
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GCB1000,
GCB2000
GCB3000
GTK1000
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Nut nas 1791
Abstract: glenair 85049 torque MIL-C-29600 GTSQ150 A10086 bandit TIE-DEX A37099 85049 torque A31186 calibration of crimping tools standards
Text: Interconnect Cable Assembly Tools Band-It Shield Termination Tools, Connector-to-Backshell Holding Tools, Fiber Optic Termination Kits and More! United States United Kingdom Germany France Nordic Italy Spain Japan To Most People
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GCB1000,
GCB2000
GCB3000
GTK1000
Nut nas 1791
glenair 85049 torque
MIL-C-29600
GTSQ150
A10086
bandit TIE-DEX
A37099
85049 torque
A31186
calibration of crimping tools standards
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Untitled
Abstract: No abstract text available
Text: High Temperature, Precision 2.5 V, Micropower Voltage Reference ADR225 Data Sheet PIN CONFIGURATION Extreme high temperature operation −40°C to +210°C, 8-lead FLATPACK −40°C to +175°C, 8-lead SOIC Temperature coefficient 30 ppm/°C, 8-lead FLATPACK
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ADR225
ADR225HRZN
ADR225HFZ
D11525-0-7/13
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Untitled
Abstract: No abstract text available
Text: High Temperature, Low Drift, Micropower 2.5 V Reference ADR225 Data Sheet PIN CONFIGURATION Extreme high temperature operation −40°C to +210°C, 8-lead FLATPACK −40°C to +175°C, 8-lead SOIC Temperature coefficient 30 ppm/°C, 8-lead FLATPACK 10 ppm/°C, 8-lead SOIC
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ADR225
3-26-2013-A
ADR225HRZN
ADR225HFZ
ADR225
D11525-0-9/13
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Untitled
Abstract: No abstract text available
Text: High Temperature, Low Drift, Micropower 2.5 V Reference ADR225 Data Sheet PIN CONFIGURATION Extreme high temperature operation −40°C to +210°C, 8-lead FLATPACK −40°C to +175°C, 8-lead SOIC Temperature coefficient 40 ppm/°C, 8-lead FLATPACK 10 ppm/°C, 8-lead SOIC
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ADR225
Dow24
3-26-2013-A
ADR225HRZN
ADR225HFZ
D11525-0-11/13
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STA002
Abstract: STA003T
Text: STA003T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio except 44.1KHz Audio - All features specified for Layer III 2 channels in ISO/IEC13818-3.2(MPEG 2 Audio) except
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STA003T
ISO/IEC13818-3
05KHz
025KHz
STA002
STA003T
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STA002
Abstract: STA003T FC-016
Text: STA003T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio except 44.1KHz Audio - All features specified for Layer III 2 channels in ISO/IEC13818-3.2 (MPEG 2 Audio) except
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STA003T
ISO/IEC13818-3
05KHz
025KHz
STA002
STA003T
FC-016
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diode DLA5
Abstract: STA002 STA003T
Text: STA003T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio except 44.1KHz Audio - All features specified for Layer III 2 channels in ISO/IEC13818-3.2 (MPEG 2 Audio) except
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STA003T
ISO/IEC13818-3
05KHz
025KHz
diode DLA5
STA002
STA003T
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buzzer KC 1206
Abstract: x0605 x0605 transistor gendex CX80501-32 transistor c914 CX810 K16102 x0605 ma CB2E
Text: DATA SHEET CX805-30 Baseband Processor for Multiband GSM and GPRS Applications APPLICATIONS DESCRIPTION • • • The Skyworks CX805-30 Baseband Processors BPs are highly integrated, dual core processors optimized for use in Global System for Mobile communications (GSM™) and General
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CX805-30
376-3000FAX
376-3100SALES
buzzer KC 1206
x0605
x0605 transistor
gendex
CX80501-32
transistor c914
CX810
K16102
x0605 ma
CB2E
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dla001
Abstract: STA013B FC12 B2H18
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
dla001
FC12
B2H18
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Untitled
Abstract: No abstract text available
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
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application note sta013
Abstract: STA013B STA013T TQFP44 LFBGA64 STA013 MPEG2 sdi
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequenciessyntax extension,
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STA013
STA013B
STA013T
application note sta013
STA013T
TQFP44
LFBGA64
STA013
MPEG2 sdi
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LFBGA64
Abstract: STA013 STA013B STA013T TQFP44
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequenciessyntax extension,
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STA013
STA013B
STA013T
LFBGA64
STA013
STA013T
TQFP44
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68 1103
Abstract: STA013 dla001 application note sta013
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
68 1103
dla001
application note sta013
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LFBGA64
Abstract: STA013 STA013B STA013T TQFP44
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
LFBGA64
STA013
STA013T
TQFP44
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XTAL 14.7456MHZ R
Abstract: application note sta013 Crystal Oscillator 14.31818MHz BF-14 STA013 STA013T TQFP44 DRIVER SCR
Text: STA013/STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequenciessyntax extension,
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STA013/STA013T
XTAL 14.7456MHZ R
application note sta013
Crystal Oscillator 14.31818MHz
BF-14
STA013
STA013T
TQFP44
DRIVER SCR
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sckr56
Abstract: No abstract text available
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequenciessyntax extension,
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STA013
STA013B
STA013T
sckr56
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STA013
Abstract: STA013T TQFP44
Text: STA013/STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequenciessyntax extension,
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STA013/STA013T
STA013
STA013T
TQFP44
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LFBGA64
Abstract: application note sta013 STA013 STA013B STA013T TQFP44 D99AU1019 BF11
Text: STA013 STA013B STA013T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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STA013
STA013B
STA013T
LFBGA64
application note sta013
STA013
STA013T
TQFP44
D99AU1019
BF11
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dla001
Abstract: No abstract text available
Text: STA003T MPEG 2.5 LAYER III AUDIO DECODER SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio except 44.1KHz Audio - All features specified for Layer III 2 channels in ISO/IEC13818-3.2 (MPEG 2 Audio) except
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STA003T
ISO/IEC13818-3
05KHz
025KHz
STA003T013TR
STA003
dla001
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12to-34
Abstract: tea5757 FM RADIO WITH IC Tea5757 FM radio wave transmitter with a MOSFET TEA5757H TEA5759 AV7100 str radio QFP44 fm radio with TEA5757H
Text: Philips Semiconductors Preliminary specification Self Tuned Radio STR TEA5757; TEA5759 FEATURES • High selectivity with distributed IF gain • The tuning system has an optimized 1C partitioning both from application (omitting interferences) and flexibility
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TEA5757;
TEA5759
12to-34
tea5757
FM RADIO WITH IC Tea5757
FM radio wave transmitter with a MOSFET
TEA5757H
TEA5759
AV7100
str radio
QFP44
fm radio with TEA5757H
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Untitled
Abstract: No abstract text available
Text: STA 013 MPEG 2.5 LAYER III AUDIO DECODER • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2(MPEG 2 Audio) - Lower sampling frequencies syntax extension,
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OCR Scan
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STA013
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Untitled
Abstract: No abstract text available
Text: S T A 0 1 3 /S T A 0 1 3 T MPEG 2.5 LAYER III AUDIO DECODER • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio - All features specified for Layer III in ISO/IEC 13818-3.2(MPEG 2 Audio)
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STA013/STA013T
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