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    BGA 576 SOCKET Search Results

    BGA 576 SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BGA 576 SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-576-12-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-12-005 24 X 24


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-576-15-007414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-15-007 29 X 29


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-576-15-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 576-15-005 30 X 30


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


    Original     		PDF 1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    bga 576 socket

    Abstract: 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327
    Text: BGA NP276 Series Arrays Socket Series No. of Leads Material PEI Glass Filled UL94V-0 Beryllium Copper Gold over Nickel Design No. Positioning Pin Identification Depopulated Versions Available Quad Flat Packages ∅ ∅ ∅ ± Speciality Test Products ∅


    Original     		PDF NP276 10mA/20mV UL94V-0 NP276-372 NP276-11935 NP276-37206-AC03143 NP276-15334-* NP276-37206-A -AC09608 bga 576 socket 7400 NP276-37206-AC03134 NP276-62525-A marcon+capacitor+5840 AC-06524 AC-09801 65227 NP276-37206AC-03134 NP276-37206-AC03327

    bga 576 socket

    Abstract: IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket
    Text: IC280 Series Clamshell Ball Grid Array (FBGA / CSP / LGA) Specifications Part Number (Details) 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute for 1.00mm pitch 500V AC for 1 minute for 0.80mm pitch 100V AC for 1 minute for 0.75mm pitch


    Original     		PDF IC280 10mA/20mV IC280 696pins IC280-69605 00x37 bga 576 socket IC280-169-127 IC280-196-126 IC280-225-185 IC280-256-211 IC280-324-186 IC280-72919 4200-005 IC280-868-108 LGA socket

    ic280 yamaichi

    Abstract: IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335
    Text: IC280 Series Clamshell Ball Grid and Fine Ball Grid Array (BGA / FBGA) Part Number (Details) Specifications 1,000MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m Ω max. at 10mA/20mV max. or


    Original     		PDF IC280 10mA/20mV IC280-72949 80x26 ic280 yamaichi IC280-169-127 IC280-196-126 IC280-72918 IC280-72919 X2335

    camera-link to hd-SDI converter

    Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
    Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    bga 576 socket

    Abstract: BGA576 LS-BGA576A-31
    Text: Top View 31.00mm [1.220"] 0.90mm [0.035"] 0.90mm [0.035"] 1.27mm typ. 31.00mm [1.220"] 29.21mm [1.150"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] Ø 0.20mm [0.008"] ±0.0005" 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.


    Original     		PDF FR4/G10 24x24 LS-BGA576A-31 bga 576 socket BGA576

    XC3S250E TQ144 STARTER KIT BOARD

    Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
    Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    hc335

    Abstract: 1517P WF484
    Text: 1. HardCopy III Device Family Overview HIII51001-3.1 Introduction This chapter provides an overview of features available in the HardCopy III device family. More details about these features can be found in their respective chapters. HardCopy III devices are Altera’s low-cost, high-performance, low-power ASICs with


    Original     		PDF HIII51001-3 hc335 1517P WF484

    hc335

    Abstract: EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325
    Text: 3. Mapping Stratix III Device Resources to HardCopy III Devices HIII53003-3.1 This chapter discusses the available options for mapping from a Stratix III device to a HardCopy ® III device. The Quartus II software limits resources to those available to both the Stratix III FPGA


    Original     		PDF HIII53003-3 avai10, hc335 EP3SE110F1152 EP3SE110 EP3SL110F780 1517-pin HC325WF484N hc335ff1152n HC335FF1517N Altera Stratix II BGA 484 pinout HC325

    WMP100

    Abstract: sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem
    Text: Smart wireless. Smart business. Wireless Microprocessor WMP 50/100/500 Smart Devices Creative Software Services Wireless Microprocessor® The Wireless Microprocessor® is a certified processing and radio solution in a BGA package designed for GSM/GPRS cellular communication in the M2M


    Original     		PDF WMP50 WMP100 sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem

    SF-BGA576D-B-05

    Abstract: No abstract text available
    Text: 32.725mm [1.288"] 2.50mm [0.098"] 23.00mm [0.906"] 2.50mm [0.098"] 2.74mm [0.108"] A1 2.36mm [0.093"] 32.725mm [1.288"] 2.54mm [0.100"] 27.725mm [1.092"] 23.00mm [0.906"] 1.00mm typ. [0.039"] Top View 5.08mm [0.200"] 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		PDF 725mm 025mm FR4/G10 Sn63Pb37 SF-BGA576D-B-05

    SF-BGA576D-B-05F

    Abstract: No abstract text available
    Text: 32.725mm [1.288"] 2.50mm [0.098"] 23.00mm [0.906"] 2.50mm [0.098"] 2.74mm [0.108"] A1 2.36mm [0.093"] 32.725mm [1.288"] 2.54mm [0.100"] 27.725mm [1.092"] 23.00mm [0.906"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]


    Original     		PDF 725mm FR4/G10 SF-BGA576D-B-05F

    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		PDF NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842

    Untitled

    Abstract: No abstract text available
    Text: Ij BGA TM Characteristics Insulation Resistance: W ithstanding Voltage: IC280 - 576 06 1,000MQminimum at 500 VDC Contact Resistance: 700 VAC for 1 Minute 30mQ max. at 10mA/20mV Initial Operating Temperature: -40"C ~ +150‘C Socket Series No. of Leads Material


    OCR Scan     		PDF IC280 000MQminimum 10mA/20mV

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 15X15

    16X16

    Abstract: bga 576 socket bga 24x24 576
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00


    OCR Scan     		PDF 16X16 C-1640240 bga 576 socket bga 24x24 576

    Untitled

    Abstract: No abstract text available
    Text: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]


    OCR Scan     		PDF 16X16 17X17

    Untitled

    Abstract: No abstract text available
    Text: Product Index 1381 - FS 5 Energy Way, P.0. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com inch/ mm PART# DESCRIPTION. PAGE


    OCR Scan     		PDF