S 576 B
Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ
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BGA-576P-M01
576-pin
BGA-576P-M01)
BGA576001SC-2-1
S 576 B
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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BGA-576
Abstract: BGA576 576-pin
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)
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BGA-576P-M01
576-pin
BGA-576P-M01)
BGA576001SC-2-1
BGA-576
BGA576
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BGA576
Abstract: NM6404 BGA-576 risc NM6403 60Mbyte
Text: Press-Release Contact person: Ekaterina Lazutkina E-mail: sales@module.ru Ph: +7 495 152-9698 Fax: +7 495 152-4661 http://www.module.ru FOR IMMEDIATE RELEASE NeuroMatrix NM6404 RISC/DSP Processor Moscow, Russia, May 22, 2006 - Research Center Module RC Module announces
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NM6404
NM6404
32/64-bit
64-bit
NM6403
MC431
BGA576
BGA-576
risc
60Mbyte
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CE51484
Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.
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CG/CE46
CG/CE51
S-19176
ASIC-TB-20033-9/95
CE51484
micron 100 ball BGA
BGA256
BGA 256 PACKAGE power dissipation
CG51114
BGA352
BGA576
CE51364
CG51284
BGA-576
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TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution
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1000-pin
FDH-BGA352
15MHz)
TR6878
H1/1999
fcBGA PACKAGE thermal resistance
EBGA672
FCBGA-160
BGA PACKAGE thermal profile
FR4 GLASS EPOXY stiffener
fbga 12 x 12 thermal resistance
BGA-560P-M01
fine BGA thermal profile
BGA-576
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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Yamaichi ic354
Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Text: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3
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LGA-80P-M02
IC280-080-252
LGA-80P-M04
LGA-144P-M02
IC280-144-249
LGA-176P-M01
IC280-176-254
F0606
Yamaichi ic354
IC354
IC51-2084-1052-36
IC234-1004-023P
YAMAICHI ic234
IC51-0484-806
648-0482211
QP1-120050-272
IC51-1004-809
IC234-1444-053P
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BGA576
Abstract: BGA-576 9698 NM6403 VLIW architecture COLLISION AVOIDANCE
Text: Press Release Editorial contact person: Ms. Elena Yakovleva E-mail: eyakovl@module.ru Ph: +7 095 152-9698 Fax: +7 095 152-4661 Web: http://www.module.ru FOR IMMEDIATE RELEASE Digital Signal Memory SoC with Industry’s Highest Performance ADCs/DACs. Moscow, Russia, October 21, 2002 – Research Center “Module”, a leading developer of
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1-64-bit
NM6403
BGA576
BGA-576
9698
VLIW architecture
COLLISION AVOIDANCE
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wavecom Q24 plus
Abstract: wavecom q24 classic Q2438F Q24 plus sim 300 processor gsm modem Wavecom Q24 WMP150 M1306B wavecom WMP100 WMP100
Text: Designed by Franklin Partners Groupe Mediagérance. Wavecom S.A. may, at any time and without notice, make changes or improvements to the products and services offered and/or cease producing or commercializing them. 97414 WIRELESS CPUs v3.qxd 4/09/06 9:31
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M1306
M2106
52MHz
wavecom Q24 plus
wavecom q24 classic
Q2438F
Q24 plus
sim 300 processor gsm modem
Wavecom Q24
WMP150
M1306B
wavecom WMP100
WMP100
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Untitled
Abstract: No abstract text available
Text: T-BGA576-4040-1.27B6
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T-BGA576-4040-1
27B6T-BGA576-4040-1
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Untitled
Abstract: No abstract text available
Text: P—BGA576—4040—1.27A6 Unit: m July 2005
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P-BGA576-4040-1
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4040
Abstract: P-BGA576-4040-1
Text: U n it m P—BGA576—4040—1.27A6 ►— [A] mm 0. 635 1, 585 ^-0 -0 O O O O O O O O O O 0-01 o o o o o o o o o o o o o o f ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo oooooooooooooo ooooooooooooooo oooooooooooooo
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P-BGA576-4040-1
Q0000&
E3E4Z5E6E7SBE930
4040
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