Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CE51364 Search Results

    SF Impression Pixel

    CE51364 Price and Stock

    Siemens CE51364-2031

    ELECTRONIC COMPONENT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components CE51364-2031 65
    • 1 $32.5
    • 10 $32.5
    • 100 $30
    • 1000 $30
    • 10000 $30
    		Buy Now

    CE51364 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576 PDF