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    BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Search Results

    BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical Visit Murata Manufacturing Co Ltd
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


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    25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola PDF

    Untitled

    Abstract: No abstract text available
    Text: MPR603EHS-01 IBM Order Number MPC603EEC/D (Motorola Order Number) 6/95 Advance Information PowerPC 603e ™ RISC Microprocessor Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    MPR603EHS-01 MPC603EEC/D A25/862-1, R0260, PDF

    TIL 143

    Abstract: MPR603EHS-01 IBM25PPC603
    Text: MPR603EHS-01 IBM Order Number MPC603EEC/D (Motorola Order Number) 6/95 Advance Information PowerPC 603e RISC Microprocessor Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    MPR603EHS-01 MPC603EEC/D 603eTM TIL 143 MPR603EHS-01 IBM25PPC603 PDF

    Aavid Thermalloy cold plate

    Abstract: BGA and QFP Package ibm Nippon capacitors PID7v-603e
    Text: G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e™ RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


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    G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. Aavid Thermalloy cold plate BGA and QFP Package ibm Nippon capacitors PDF

    BGA PACKAGE thermal resistance

    Abstract: PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set PDF

    TEA 1732

    Abstract: D1433
    Text: MPC603E7VEC/D Motorola Order Number S A 1 4-2031 -00 (IBM Order Number) 7/96 Advance Information PowerPC 603e RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


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    MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v PID7v-603e) PID6-603psig, TEA 1732 D1433 PDF

    754-compliant

    Abstract: DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors
    Text: G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e™ RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


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    G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 754-compliant DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors PDF

    BGA PACKAGE thermal resistance

    Abstract: PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604 PDF

    transistor mw 131

    Abstract: ALPha r09 Nippon capacitors
    Text: Freescale Semiconductor, Inc. G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


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    G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v PID7v-603e) transistor mw 131 ALPha r09 Nippon capacitors PDF

    BGA PACKAGE thermal resistance

    Abstract: cmos 4008 304X MPC604 604 semiconductor Nippon capacitors
    Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of


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    MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance cmos 4008 304X MPC604 604 semiconductor Nippon capacitors PDF

    Untitled

    Abstract: No abstract text available
    Text: MPR603EHS-01 IBM Order Number MPC603EEC/D (Motorola Order Number) 6/95 TM Advance Information PowerPC 603e” RI Hardware Specific The PowerPC 603e m icroproo reduced instruction set co: pertinent physical charai processor, refer to the oprocessor lementation o f the PowerPC family o f


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    MPR603EHS-01 MPC603EEC/D D13E15A PDF

    D 304X transistor

    Abstract: BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB
    Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 O IC EM R, O CT U ND C IN . S E L A PowerPC 604 RISC EMicroprocessor SC E Hardware Specifications FR BY D The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of


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    MPR604HSU-02 MPC604EC/D 604TM D 304X transistor BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB PDF

    Coffin-Manson Equation

    Abstract: CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA
    Text: Motorola's PowerPC 603 and PowerPC 604™ RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang m Advanced Packaging Technology 6501 William Cannon Dr., OE55 Semiconductor Products Sector Austin, Texas 78735


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    603TM 604TM 21x21 PowerPC603 PowerPC604 Coffin-Manson Equation CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA PDF

    BGA 256 PACKAGE power dissipation

    Abstract: motorola transistor t75 PPC604E
    Text: SA14-2054-00 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 7/96 TM Advance Information PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


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    SA14-2054-00 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Topic20. BGA 256 PACKAGE power dissipation motorola transistor t75 PPC604E PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


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    25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles PDF

    PPC604 instruction set

    Abstract: diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors
    Text: MPR604HSU-01 IBM Order Number MPC604EC/D (Motorola Order Number) 2/95 POWi A dvance Information PowerPC 604” RIS Hardware Specificali lementation of the PowerPC family of microprocessors. This document contains The PowerPC 604 microproces reduced instruction set confQ tç


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    MPR604HSU-01 MPC604EC/D MOTOS263 A25/862-1, R0260, 1ATX31869-0 PPC604 instruction set diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors PDF

    Coffin-Manson Equation

    Abstract: 44th land pattern BGA c4 freescale CHN 841
    Text: Freescale Semiconductor, Inc. Motorola's PowerPC 603 and PowerPC 604™ RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang Advanced Packaging Technology Freescale Semiconductor, Inc. 6501 William Cannon Dr., OE55


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    603TM 604TM elerPC603 PowerPC604 Coffin-Manson Equation 44th land pattern BGA c4 freescale CHN 841 PDF

    Kester 182

    Abstract: ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 O IC EM R, O CT U ND C IN . S E L CA PowerPC 603e RISC Microprocessor Family: S E E PID7v-603e Hardware Specifications FR Y B D The PowerPC 603e microprocessor


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    G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v Kester 182 ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance PDF

    DHO 165

    Abstract: Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604
    Text: MPR604HSU-02 IBM O rder Number MPC604EC/D (M otorola O rder Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


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    MPR604HSU-02 MPC604EC/D DHO 165 Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604 PDF

    XPC755BRX300LE

    Abstract: XPC755BPX300LD XPC755BRX400LD AN-1850
    Text: Advance Information MPC755EC/D Rev. 6, 9/2002 MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are reduced


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    MPC755EC/D MPC755 MPC755; MPC745. MPC745 MPC755. MPC750 XPC755BRX300LE XPC755BPX300LD XPC755BRX400LD AN-1850 PDF

    CQFP 240

    Abstract: CQFP240 j12 ir G38-87 CBGA255 CQFP24
    Text: TSPC603P PowerPC 603e RISC MICROPROCESSOR Family PID7v-603e Specification DESCRIPTION The PID7v-603e implementation of PowerPC603e after named 603p is a low-power implementation of reduced instruction set computer (RISC) microprocessors PowerPC family. The 603p implements 32-bit effective addresses, integer data types of 8, 16 and 32 bits, and floating-point data types


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    TSPC603P 603eTM PID7v-603e PowerPC603e 32-bit CQFP 240 CQFP240 j12 ir G38-87 CBGA255 CQFP24 PDF

    CQFP 240

    Abstract: 2-CQFP PC603P T08 3421
    Text: TSPC603p PowerPC 603e RISC MICROPROCESSOR Family PID7v-603e Specification DESCRIPTION The PID7v-603e implementation of PowerPC603e after named 603p is a low-power implementation of reduced instruction set computer (RISC) microprocessors PowerPC family. The 603p implements 32-bit effective addresses, integer data types of 8, 16 and 32 bits, and floating-point data types


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    TSPC603p 603eTM PID7v-603e PowerPC603e 32-bit CQFP 240 2-CQFP PC603P T08 3421 PDF

    Nippon capacitors

    Abstract: Loctite E04 PPC604E
    Text: Freescale Semiconductor, Inc. G522-0296-01 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 5/97 REV 1 RY IN A Advance Information IM PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications EL The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


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    G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Nippon capacitors Loctite E04 PPC604E PDF

    PROCESSOR

    Abstract: PPC604e Nippon capacitors
    Text: G522-0296-01 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 5/97 REV 1 Advance Information IN A RY IM PowerPC 604e™ RISC Microprocessor Family: PID9v-604e Hardware Specifications PR EL The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


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    G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. PROCESSOR PPC604e Nippon capacitors PDF