BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Search Results
BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | |||
TPH2R408QM |
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MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance | |||
XPH2R106NC |
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N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) | |||
XPH3R206NC |
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N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) | |||
TPH4R008QM |
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MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) |
BGA PACKAGE THERMAL PROFILE POWERPC MOTOROLA Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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90Pb 10Sn solder paste
Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
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25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola | |
Untitled
Abstract: No abstract text available
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Original |
MPR603EHS-01 MPC603EEC/D A25/862-1, R0260, | |
Aavid Thermalloy cold plate
Abstract: BGA and QFP Package ibm Nippon capacitors PID7v-603e
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G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. Aavid Thermalloy cold plate BGA and QFP Package ibm Nippon capacitors | |
BGA PACKAGE thermal resistance
Abstract: PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set
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MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set | |
754-compliant
Abstract: DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors
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G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 754-compliant DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors | |
BGA PACKAGE thermal resistance
Abstract: PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604
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MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604 | |
transistor mw 131
Abstract: ALPha r09 Nippon capacitors
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G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v PID7v-603e) transistor mw 131 ALPha r09 Nippon capacitors | |
BGA PACKAGE thermal resistance
Abstract: cmos 4008 304X MPC604 604 semiconductor Nippon capacitors
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MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance cmos 4008 304X MPC604 604 semiconductor Nippon capacitors | |
D 304X transistor
Abstract: BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB
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MPR604HSU-02 MPC604EC/D 604TM D 304X transistor BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB | |
Coffin-Manson Equation
Abstract: CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA
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603TM 604TM 21x21 PowerPC603 PowerPC604 Coffin-Manson Equation CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA | |
tdb 158 dp
Abstract: tdb 0124 ap0aa
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MPR604HSU-01 MPC604EC/D A25/862-1, R0260, tdb 158 dp tdb 0124 ap0aa | |
ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
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25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles | |
Coffin-Manson Equation
Abstract: 44th land pattern BGA c4 freescale CHN 841
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603TM 604TM elerPC603 PowerPC604 Coffin-Manson Equation 44th land pattern BGA c4 freescale CHN 841 | |
Kester 182
Abstract: ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance
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G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v Kester 182 ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance | |
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CQFP 240
Abstract: CQFP240 j12 ir G38-87 CBGA255 CQFP24
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TSPC603P 603eTM PID7v-603e PowerPC603e 32-bit CQFP 240 CQFP240 j12 ir G38-87 CBGA255 CQFP24 | |
CQFP 240
Abstract: 2-CQFP PC603P T08 3421
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TSPC603p 603eTM PID7v-603e PowerPC603e 32-bit CQFP 240 2-CQFP PC603P T08 3421 | |
Nippon capacitors
Abstract: Loctite E04 PPC604E
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G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Nippon capacitors Loctite E04 PPC604E | |
PROCESSOR
Abstract: PPC604e Nippon capacitors
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G522-0296-01 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. PROCESSOR PPC604e Nippon capacitors | |
TIL 143
Abstract: MPR603EHS-01 IBM25PPC603
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OCR Scan |
MPR603EHS-01 MPC603EEC/D 603eTM TIL 143 MPR603EHS-01 IBM25PPC603 | |
TEA 1732
Abstract: D1433
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OCR Scan |
MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v PID7v-603e) PID6-603psig, TEA 1732 D1433 | |
Untitled
Abstract: No abstract text available
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OCR Scan |
MPR603EHS-01 MPC603EEC/D D13E15A | |
BGA 256 PACKAGE power dissipation
Abstract: motorola transistor t75 PPC604E
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OCR Scan |
SA14-2054-00 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Topic20. BGA 256 PACKAGE power dissipation motorola transistor t75 PPC604E | |
PPC604 instruction set
Abstract: diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors
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OCR Scan |
MPR604HSU-01 MPC604EC/D MOTOS263 A25/862-1, R0260, 1ATX31869-0 PPC604 instruction set diagram circuits power supply APS 283 MPR604HSU-01 8037b Nippon capacitors | |
DHO 165
Abstract: Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604
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OCR Scan |
MPR604HSU-02 MPC604EC/D DHO 165 Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604 |