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    CBGA Search Results

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    DAC5670MGEM/EM Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA 25 Only Visit Texas Instruments Buy
    5962-0724701VXA Texas Instruments 14-Bit, 2.4-GSPS, 1x-2x Interpolating Digital-to-Analog Converter (DAC) - QML-V Qualified 192-CBGA -55 to 125 Visit Texas Instruments Buy
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    KEMET Corporation C0805C100CBGACTU

    CAP CER 10PF 630V C0G/NP0 0805
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    DigiKey C0805C100CBGACTU Digi-Reel 3,053 1
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    C0805C100CBGACTU Cut Tape 3,053 1
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    C0805C100CBGACTU Reel 2,500 2,500
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    Newark C0805C100CBGACTU Reel 2,500
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    Renesas Electronics Corporation R7S721010VCBG-AC0

    IC MPU RZ/A1M 400MHZ 256LFBGA
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    DigiKey R7S721010VCBG-AC0 Tray 201 1
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    Renesas Electronics Corporation R7S921056VCBG-AC0

    IC MPU RZ/A2M 528MHZ 256LFBGA
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    DigiKey R7S921056VCBG-AC0 Tray 198 1
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    Renesas Electronics Corporation R7S921042VCBG-AC0

    IC MPU RZ/A2M 528MHZ 272FBGA
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    DigiKey R7S921042VCBG-AC0 Tray 180 1
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    Renesas Electronics Corporation R7FS5D97C3A01CBG-AC0

    SYNERGY MCU PLATFORM S5D9 640K 1
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    DigiKey R7FS5D97C3A01CBG-AC0 Tray 152 1
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    CBGA Datasheets (1)

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    CBGA Amkor Technology From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. Original PDF

    CBGA Datasheets Context Search

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    61995AB124D1

    Abstract: No abstract text available
    Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 304 C4QFP, 255 CBGA 609 SERIES Standard P/N 609-50AB 609-100AB 40mm C4QFP 21mm CBGA Base Dimensions in. (mm


    Original     		609-50AB 609-100AB 609-50AB) 609-100AB) 61995AB124D1 PDF

    N429

    Abstract: S-CBGA-N429
    Text: MECHANICAL DATA MCBG004 – SEPTEMBER 1998 GLP S-CBGA-N429 CERAMIC BALL GRID ARRAY 27,20 SQ 26,80 25,40 TYP 1,27 1,27 AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 1,22 1,00 5 4 9 7 6 8 10 11 13 15 17 19 21 12 14 16 18 20 3,30 MAX Seating Plane 0,90 0,60


    Original     		MCBG004 S-CBGA-N429) 4164732/A MO-156 N429 S-CBGA-N429 PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCBG005 – NOVEMBER 1998 GLK S-CBGA-N567 CERAMIC BALL GRID ARRAY 31,20 SQ 30,80 29,21 TYP 1,27 0,635 0,635 1,27 AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 3 2 7 5 4 6 9 8 10 11 13 15 17 19 21 23 12 14 16 18 20 22 24 3,30 MAX Seating Plane


    Original     		MCBG005 S-CBGA-N567) 4164730/A MO-156 PDF

    FXBI04

    Abstract: CY7C965 Signal Path Designer CY7C96
    Text: ADVANCED INFORMATION CY7C965 Raceway Crossbar Features 160 Mbyte per second per path Block Transfer Rates 6 bidirectional ports Non-blocking architecture 361-pin CBGA package Fault tolerant systems may require the implementation of mul­ tiple redundant paths between nodes in the fabric. Time-critical elements in the fabric may require interrupt support, low


    OCR Scan     		CY7C965 361-pin FXBI04 CY7C965 Signal Path Designer CY7C96 PDF

    reliability data

    Abstract: MOS13 XPC7410 XPC7410RX
    Text: M XPC7410RX RELIABILITY DATA SUMMARY XPC7410 Fab: Mask: Process: Package: Assy: - Nitro - Information MOS13, Austin, TX K65D HiP6L 25 x 25 mm CBGA, 360 Pin BAT-1, Austin, Tx XPC7410 - Nitro - TECHNOLOGY: MOS13 on the 0.15µm Nominal HiP6L process DYNAMIC LIFETEST (2.35V, 90°C)


    Original     		XPC7410RX XPC7410 MOS13, XPC7410 MOS13 reliability data PDF

    120C

    Abstract: 140C 210C
    Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		N130MZ327 N163MZ163 N169MZ365 N161MZ612 N169MZ641 120C 140C 210C PDF

    16M Flash Memory

    Abstract: AT49BV163D
    Text: Features • 16-Mbit Flash and 8-Mbit PSRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.6V Operating Voltage Flash • Single Voltage Read/Write Operation: 2.65V to 3.6V • Access Time – 70 ns • Sector Erase Architecture •


    Original     		16-Mbit 66-ball 3618B 16M Flash Memory AT49BV163D PDF

    AT52BR1672T

    Abstract: AT52BR1674T
    Text: Features • 16-Mbit Flash and 2-Mbit/4-Mbit SRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • •


    Original     		16-Mbit 66-ball 10/01/0M AT52BR1672T AT52BR1674T PDF

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles PDF

    AT52BR1672

    Abstract: AT52BR1674
    Text: Features • 16-Mbit Flash and 2-Mbit/4-Mbit SRAM • Single 66-ball 8 mm x 10 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • •


    Original     		16-Mbit 66-ball 2604B AT52BR1672 AT52BR1674 PDF

    LC2D

    Abstract: SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L ADSP-21060 socket am3 mounting
    Text: a AD14160/ AD14160L GENERAL DESCRIPTION The AD14160/AD14160L Quad-SHARC Ceramic Ball Grid Array CBGA puts the power of the first generation AD14060 (CQFP) DSP multiprocessor into a very high density ball grid array package; now with additional link and serial I/O pinned


    Original     		AD14160/ AD14160L AD14160/AD14160L AD14060 ADSP-21060 AD14x60 C3255 LC2D SMD transistor n36 368C smd at6 TFSC0 AD14060 AD14160 AD14160L socket am3 mounting PDF

    SA8 357

    Abstract: AT52BR3244 AT52BR3244T SA10 SA11 SA70
    Text: Features • 32-Mbit Flash and 4-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • • • • • •


    Original     		32-Mbit 66-ball 07/01/xM SA8 357 AT52BR3244 AT52BR3244T SA10 SA11 SA70 PDF

    PC755BM8

    Abstract: MCP 67 MV PC745 PC755M8 PCX755B
    Text: Features • • • • • • PC755BM8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 350 MHz Maximum L2 Cache Frequency = 175 MHz Maximum 60x Bus Frequency = 66 MHz


    Original     		PC755BM8 PC755BM8 2164C MCP 67 MV PC745 PC755M8 PCX755B PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • 32-Mbit DataFlash and 4-Mbit SRAM • Single 62-ball 8 mm x 12 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage DataFlash • • • • • • • • • • Single 2.7V to 3.3V Supply Serial Peripheral Interface (SPI) Compatible


    Original     		32-Mbit 62-ball 528-byte 3356Bâ PDF

    TMS 320 C 6X processor

    Abstract: 2164A PC745 PC755M8 2164A dynamic ram cop interface l2-dp
    Text: Features • • • • • • PC755M8 RISC Miprocessor Dedicated 1-megabyte SSRAM L2 Cache, Configured as 128K x 72 21 mm x 25 mm, 255 Ceramic Ball Grid Array CBGA Maximum Core Frequency = 300 MHz Maximum L2 Cache Frequency = 150 MHz Maximum 60x Bus Frequency = 66 MHz


    Original     		PC755M8 TMS 320 C 6X processor 2164A PC745 2164A dynamic ram cop interface l2-dp PDF

    AT52BR3244

    Abstract: AT52BR3244T AT52BR3248 AT52BR3248T SA70
    Text: Features • 32-Mbit Flash and 4-Mbit/8-Mbit SRAM • Single 66-ball 8 mm x 11 mm CBGA Package • 2.7V to 3.3V Operating Voltage Flash • 2.7V to 3.3V Read/Write • Access Time – 85 ns • Sector Erase Architecture • • • • • • • • •


    Original     		32-Mbit 66-ball 2471B 08/01/xM AT52BR3244 AT52BR3244T AT52BR3248 AT52BR3248T SA70 PDF

    PC603R

    Abstract: atmel 528 24 c01 TSPC603R 255l K12K14 NS615
    Text: Features • • • • • • • Superscalar 3 Instructions per Clock Peak Dual 16 KB Caches Selectable Bus Clock 32-bit Compatibility PowerPC Implementation On-chip Debug Support Nap, Doze and Sleep Power Saving Modes Device Offered in Cerquad, CBGA 255 and CI-CGA 255


    Original     		32-bit SPECint95, SPECfp95 64-bit PC603R atmel 528 24 c01 TSPC603R 255l K12K14 NS615 PDF

    AT45BR3214B

    Abstract: 3356b
    Text: Features • 32-Mbit DataFlash and 4-Mbit SRAM • Single 62-ball 8 mm x 12 mm x 1.2 mm CBGA Package • 2.7V to 3.3V Operating Voltage DataFlash • • • • • • • • • • Single 2.7V to 3.3V Supply Serial Peripheral Interface (SPI) Compatible


    Original     		32-Mbit 62-ball 528-byte 3356B AT45BR3214B PDF

    FR4 epoxy dielectric constant 4.4

    Abstract: FR4 epoxy dielectric constant 4.2 FR4 substrate epoxy dielectric constant 4.6 DIODE K9 FR4 dielectric constant 4.6 ro4003 datasheet MC100EL16 RO4003 TS8388BG TSEV8388BG
    Text: DESCRIPTION The TSEV8388BG Evaluation Board EB is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the TS8388BG device (in CBGA72) up to its 1.8 GHz full power bandwidth at up to 1 Gsps in the extended temperature range.


    Original     		TSEV8388BG TS8388BG CBGA72) FR4 epoxy dielectric constant 4.4 FR4 epoxy dielectric constant 4.2 FR4 substrate epoxy dielectric constant 4.6 DIODE K9 FR4 dielectric constant 4.6 ro4003 datasheet MC100EL16 RO4003 PDF

    CBGA

    Abstract: No abstract text available
    Text: 1.5 Pin Assignments Motorola and IBM both offer a ceramic bail grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout o f the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top


    OCR Scan     		PID9q-604e CBGA PDF

    Untitled

    Abstract: No abstract text available
    Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.


    OCR Scan     		240-pin PID6-603e PDF

    SpaceWire

    Abstract: No abstract text available
    Text: Standard Products UT200SpW4RTR 4-Port SpaceWire Router Datasheet April 8, 2013 www.aeroflex.com/SpaceWire FEATURES  Operational environment: - Total-dose: 100 krad Si - Latchup immune (LET >100 MeV-cm2/mg)  Packaging options: - 255-lead CLGA - 255-lead CBGA


    Original     		UT200SpW4RTR 200Mbps ECSS-E-ST-50-12C 50MHz SpaceWire PDF

    PowerPC-604e

    Abstract: microprocessor pin
    Text: 1.5 PowerPC 604e Microprocessor Pin Assignments The following sections contain the pinout diagrams for the 604e. Note that the 604e is currently offered by Motorola and IBM in a ceramic ball grid array CBGA package. The IBM and Motorola CBGA packages have identical pinouts.


    OCR Scan     		PID9v-604e PowerPC-604e microprocessor pin PDF