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    BGA TRAYS Search Results

    BGA TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    BGA TRAYS Price and Stock

    Hirose Electric Co Ltd IT5HM-100S-BGA(37)

    High-Speed(25+ Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT5HM-100S-BGA(37)
    • 1 -
    • 10 $25.6
    • 100 $17.56
    • 1000 $17.56
    • 10000 $17.56
    		Buy Now

    Hirose Electric Co Ltd IT5M-100S-BGA(37)

    High-Speed(25+ Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT5M-100S-BGA(37)
    • 1 -
    • 10 $25.6
    • 100 $17.56
    • 1000 $17.56
    • 10000 $17.56
    		Buy Now

    Hirose Electric Co Ltd IT5HD-300S-BGA(39)

    High-Speed(25+ Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT5HD-300S-BGA(39)
    • 1 -
    • 10 $52.2
    • 100 $47.75
    • 1000 $47.75
    • 10000 $47.75
    		Buy Now

    Hirose Electric Co Ltd IT5HM-300S-BGA(37)

    High-Speed(25+ Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT5HM-300S-BGA(37)
    • 1 -
    • 10 $52.2
    • 100 $47.75
    • 1000 $47.75
    • 10000 $47.75
    		Buy Now

    Hirose Electric Co Ltd IT3M-200S-BGA(37)

    High-Speed(10⁺Gbps) BGA Mezzanine Connectors
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com IT3M-200S-BGA(37)
    • 1 $24.83
    • 10 $24.83
    • 100 $18.14
    • 1000 $16.68
    • 10000 $16.68
    		Buy Now
    Find more BGA TRAYS price and stock on Findchips.com

    BGA TRAYS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


    Original     		PDF

    BGA Solder Ball compressive force

    Abstract: bga solder ball shear
    Text: BACKPANEL CONNECTORS AirMax VS BGA Connector Development Using BGA connector technology to extend the performance of backplane connectors DESCRIPTION The development of AirMax VS vertical signal headers for reflow solder termination combines FCI's proven Ball Grid Array BGA


    Original     		10067807-101LF 10076728-101LF 10067811-101LF ELXAIRMXBGA0109ELT BGA Solder Ball compressive force bga solder ball shear PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    196-pin

    Abstract: DSP56300 EB360
    Text: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA


    Original     		EB360 196-pin 196-pin 196pin DSP56300 EB360 PDF

    DSP56300

    Abstract: EB362
    Text: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA


    Original     		EB362 252-pin 252-pin 252pin DSP56300 EB362 PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7 PDF

    Socket T for LGA

    Abstract: No abstract text available
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the


    Original     		63Sn/37Pb ASTM-B-488 QQ-N-290 BGA050-TECH07 Socket T for LGA PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 C17200
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance


    Original     		ASTM-B-488 QQ-N-290 MICROBGA-TECH09 0.65mm pitch BGA ASTM-B-488 C17200 PDF

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile PDF

    0.65mm pitch BGA

    Abstract: No abstract text available
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the


    Original     		63Sn/37Pb ASTM-B-488 QQ-N-290 BGA050-TECH07 0.65mm pitch BGA PDF

    Socket T for LGA

    Abstract: 0.65mm pitch BGA socket
    Text: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold


    Original     		PDF

    TLC056

    Abstract: TSC056 TSC080 spansion tray 2606 tray datasheet bga TLC080 Spansion tray drawing
    Text: SPANSION LLC 915 DeGuigne Drive, P.O. Box 3453 Sunnyvale, California 94088-3453, USA April 28, 2006 Advanced Change Notification No: Subject: 2606 Changes to 9x7 mm Ball Grid Array BGA Packages packed in Tray Spansion LLC is announcing changes to the 9x7 mm Ball Grid Array (BGA) packages packed in tray.


    Original     		TLC056, TSC056, VBU056, TLC080, TSC080, VBR080 TLC056 TSC056 TSC080 spansion tray 2606 tray datasheet bga TLC080 Spansion tray drawing PDF

    TG-175

    Abstract: FREESCALE PACKING DSP56300
    Text: Freescale Semiconductor, Inc. Order No.: EB360/D Rev. 0, 6/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196-pin Plastic Ball Grid Array (PBGA) packages. The MAP BGA is an identical pinout and drops into a board laid out for


    Original     		EB360/D 196-pin 196-pin DSP56300 TG-175 FREESCALE PACKING PDF

    punch singulation for PBGA

    Abstract: DSP56300
    Text: Order No.: EB362/D Rev. 0, 8/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages Summary of Differences . 2 Pinout and Electrical Performance . 2


    Original     		EB362/D 252-pin 252-pin DSP56300 punch singulation for PBGA DSP56300 PDF

    DSP56300

    Abstract: No abstract text available
    Text: Order No.: EB360/D Rev. 0, 6/2000 MOTOROLA Semiconductor Products Sector Engineering Bulletin Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages Summary of Differences . 2 Pinout and Electrical Performance . 2


    Original     		EB360/D 196-pin 196-pin DSP56300 PDF

    BGA PROFILING

    Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile PDF

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK PDF

    xcm916

    Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80


    Original     		DSP56F807VF80 SPSSG1006/D MC68HC08Aotorola xcm916 motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB PDF

    pbga package weight

    Abstract: mindspeed pbga Cold solder joint
    Text: 500154B December 18, 2001 Plastic BGA Surface Mount Application Note Introduction One of the greatest advantages of the Plastic Ball Grid Array PBGA package is that it is typically placed onto printed circuit boards and assembled using existing surface mount


    Original     		500154B 225-pin pbga package weight mindspeed pbga Cold solder joint PDF

    IPC-9701

    Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
    Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the


    Original     		MS-034 15mm-42 IPC-9701 Amkor mold compound coreless substrate amkor flip "IPC-9701" PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		DS550R PDF

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 PDF