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Hirose Electric Co Ltd IT14-688S-BGA-2.5H CONN SELF-MATE 0.9MM 688POS SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	IT14-688S-BGA-2.5H	Digi-Reel	281		1	1 $50.31 10 $46.165 100 $40.5424 1000 $40.5424 10000 $40.5424	Buy Now
	IT14-688S-BGA-2.5H	Cut Tape	281		1	1 $94.59 10 $77.117 100 $68.5 1000 $68.5 10000 $68.5	Buy Now
	IT14-688S-BGA-2.5H	Reel			300	1 - 10 - 100 - 1000 $68.5 10000 $68.5	Buy Now
Avnet Americas	IT14-688S-BGA-2.5H	Reel	300	16 Weeks	300	1 - 10 - 100 - 1000 $75.29625 10000 $75.29625	Buy Now
Newark	IT14-688S-BGA-2.5H	Cut Tape	298		1	1 $73.06 10 $73.06 100 $73.06 1000 $73.06 10000 $73.06	Buy Now
	IT14-688S-BGA-2.5H	Reel			150	1 $124.2 10 $124.2 100 $124.2 1000 $109.6 10000 $109.6	Buy Now
New Advantage Corporation	IT14-688S-BGA-2.5H		600		1	1 - 10 - 100 - 1000 $95.93 10000 $95.93	Buy Now
Sager	IT14-688S-BGA-2.5H				150	1 - 10 - 100 - 1000 $88.7 10000 $77.6	Buy Now
T&B Fittings BGA250-6-40 Grounding Bushing, 2-1/2", Aluminum, Galvanized, Wire Range 6 to 4/0 \| T&B Fittings by ABB BGA250-6-40
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	BGA250-6-40	Bulk			5	1 - 10 $159.2 100 $143.27 1000 $143.27 10000 $143.27	Get Quote
T&B Fittings BGA250-14-20 Grounding Bushing, 2-1/2", Aluminum, Galvanized, Wire Range 14 to 2/0Awg \| T&B Fittings by ABB BGA250-14-20
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	BGA250-14-20	Bulk			5	1 - 10 $159.2 100 $159.2 1000 $159.2 10000 $159.2	Get Quote
Brady Worldwide Inc B-GA25-ANT-US
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	B-GA25-ANT-US					1 $199.99 10 $199.99 100 $199.99 1000 $199.99 10000 $199.99	Buy Now
Thomas & Betts BGA250-14-20 2-1/2 Inch Blackjack Grounding Bushing - Aluminum - Galvanized - Wire Range 14 to 2/0 for Use with Threaded or Threadless Rigid/IMC Conduit.
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	BGA250-14-20					1 $131.55 10 $116.52 100 $108.4 1000 $108.4 10000 $108.4	Buy Now
Master Electronics	BGA250-14-20					1 $131.55 10 $116.52 100 $108.4 1000 $108.4 10000 $108.4	Buy Now

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BGA25 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
BGA-252-291		Metcal	Soldering, Desoldering, Rework Tips, Nozzles, Soldering, Desoldering, Rework Products, NOZZLE BGA 25.2MM X 29.1MM		Original	PDF
BGA256		NXP Semiconductors	Footprint for reflow soldering		Original	PDF

BGA25 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e	Original	BGA256: OT811-1 MS-034	PDF
BGA256 17 X 17 Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17 Text: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape	Original	BGA256: OT811-1 MS-034 BGA256 17 X 17 BGA256 MS-034 BGA-256 sot811 BGA256 17	PDF
PB-BGA256J-Z-01 Abstract: SF-BGA256J-B-01 SF-BGA232A-B-01 Text: U.S. PATENT 6,351,392 78.64mm [3.096"] 2.54mmtyp. [0.100"] 19.23mm [0.757"] 50.8mm [2.000"] Top View 1 * This height variable depends on the screw position. * 2 9.97mm [0.393"] 12.6mm [0.496"] 6mm [0.236"] Side View For Probing BGA256J use SF-BGA256J-B-01	Original	54mmtyp. BGA256J SF-BGA256J-B-01 BGA232A SF-BGA232A-B-01 FR4/G10 16x16 PB-BGA256J-Z-01 SF-BGA256J-B-01 SF-BGA232A-B-01	PDF
BGA256 Abstract: sot466 BGA256 17 X 17 Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1	Original	BGA256: OT466-1 BGA256 sot466 BGA256 17 X 17	PDF
P-BGA256-17x17-1 Abstract: P-BGA-256-1 PRBG0256FB-A Text: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e	Original	P-BGA256-17x17-1 PRBG0256FB-A 256F7X-D P-BGA-256-1 PRBG0256FB-A	PDF
P-BGA256-27x27-1 Abstract: PRBG0256DA-A Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference	Original	P-BGA256-27x27-1 PRBG0256DA-A 256F7X-A PRBG0256DA-A	PDF
LA-BGA-740-S-B-02 Abstract: LS-BGA255A-02 Text: 2.840" 37 J4-1 38 2 2 38 J1-1 37 37 38 37 2 J5-1 38 J3-1 2 37 38 J2-1 2 1.188" 2.770" Top View 0.748" Side View LS-BGA255A-02 0.827" Plugged 0.233" 0.150" 1 0.236" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01 1 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material.	Original	LS-BGA255A-02 SF-BGA255A-B-01 FR4/G10 LA-BGA-740-S-B-02 LS-BGA255A-02	PDF
BGA256 Abstract: BGA256 17 X 17 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K	Original	BGA256: OT466-1 BGA256 BGA256 17 X 17	PDF
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	BGA256 OT811-1 OT811-1	PDF
PRBG0256DD-A Abstract: 2.5G P-BGA-256-2 Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference	Original	P-BGA256-27x27-1 PRBG0256DD-A 256F7X-F PRBG0256DD-A 2.5G P-BGA-256-2	PDF
BP-256 Abstract: P-BGA256-27x27-1 PRBG0256DE-A Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5	Original	P-BGA256-27x27-1 PRBG0256DE-A BP-256 BP-256 PRBG0256DE-A	PDF
Untitled Abstract: No abstract text available Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x	Original	BGA256: OT471-1 MS-034	PDF
BGA25 Abstract: TRAY DIMENSIONS JEDEC TRAY DIMENSIONS Text: TRAY CONTAINER UNIT : mm A' 7 25.50 27.50 20.00 25.50 135°C MAX. 26.70 BGA25x25ESP 27.50 NEC 82.5 135.9 4×11=44 PPE A 275.0 315.0 322.6 SECTION A – A' 25.50 (6.01) (6.35) 7.62 25.00 Applied Package Quantity (pcs) 240-pin Plastic BGA (25×25) (CAVITY DOWN ADVANCED TYPE)	Original	BGA25 25ESP 240-pin SSD-A-H7199 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS	PDF
D 2395 Abstract: BGA256 17 X 17 BGA256 MS-034 Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L	Original	BGA256: OT471-1 MS-034 D 2395 BGA256 17 X 17 BGA256 MS-034	PDF

BGA360 Abstract: PPC603 bga255 PPC750 Text: 1.060" 1.000" 0.984" PPC603 BGA255 PPC750 (BGA360) A1 A1 0.900" 0.984" 0.050" Ø 0.025" pad 0.051" Top View Bottom View Removeable Pins to Aid In Alignment. 3 0.048" 1 1 2 2 Side View 3 0.024"±0.005" Substrate: 0.0480"±0.007" FR4/G10 or equivalent high	Original	PPC603 BGA255) PPC750 BGA360) FR4/G10 19x19 DC-BGA/BGA-750-S-B-02 BGA360 PPC603 bga255 PPC750	PDF
BGA256 Abstract: P-BGA-256-2 Text: P-BGA256-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.	Original	P-BGA256-2727-1 BGA256 P-BGA-256-2	PDF
16X16 Abstract: SF-BGA256F-B-11 Text: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]	Original	BGA256F 16X16 SF-BGA256F-B-11 16X16	PDF
16x16 bga Abstract: logic analyzer 16X16 LA-BGA-740-Z-B-02 BGA zif socket DASF00504 Text: 38 37 J5-1 2 J2-1 37 2 2 38 J3-1 J4-1 38 37 2 2.840" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A B C D E F G H J K L M N P R T 2.770" Top View 38 37 2 38 J1-1 37 Side View 0.897" Plugged 0.233" 0.150" 1 0.237" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01	Original	SF-BGA255A-B-01 16X16 FR4/G10 LA-BGA-740 -Z-B-02 LA-BGA-740-Z-B-02 16x16 bga logic analyzer 16X16 BGA zif socket DASF00504	PDF
16x16 bga Abstract: 16X16 SF-BGA256G-B-11 Text: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]	Original	BGA256G FR4/G10 16X16 SF-BGA256G-B-11 16x16 bga 16X16	PDF
BGA256 Abstract: No abstract text available Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K	Original	BGA256: OT471-1 BGA256	PDF
SF-BGA256C-B-11 Abstract: BGA 23 x 23 array Text: D C Package Code: BGA256C See BGA pattern code to the right for actual pattern layout Y 27.94mm [1.100"] 0.64mm [0.025"] 0.89mm [0.035"] X Top View reference only 27.94mm [1.100"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]	Original	BGA256C FR4/G10 SF-BGA256C-B-11 BGA 23 x 23 array	PDF
180 ohm resistor Abstract: Tektronix LA-BGA-740-S-B-01 Text: 2.550" 0.845" 8 16 Hi_A A1 1 H 2.525" 15 T JTAG Lo_D Lo_E 0.845" 0.853" Side View LS-BGA255A-02 0.858" Each Mictor connection contains a 180 ohm resistor to source. 0.480" 0.827" Plugged PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD	Original	LS-BGA255A-02 LA-BGA-740 -S-B-01 LA-BGA-740-S-B-01 180 ohm resistor Tektronix	PDF
Untitled Abstract: No abstract text available Text: P-BGA256-2727-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 2.22 TYP. 2/Oct. 28, 1996	Original	P-BGA256-2727-1	PDF
BGA256 Abstract: No abstract text available Text: P-BGA256-1717-1.00AZ Uniti nn Jul.2003	OCR Scan	P-BGA256-1717-1 BGA256	PDF

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BGA25 Search Results

BGA25 Price and Stock

Hirose Electric Co Ltd IT14-688S-BGA-2.5H

T&B Fittings BGA250-6-40

T&B Fittings BGA250-14-20

Brady Worldwide Inc B-GA25-ANT-US

Thomas & Betts BGA250-14-20

BGA25 Datasheets (2)

BGA25 Datasheets Context Search

Untitled

BGA256 17 X 17

PB-BGA256J-Z-01

BGA256

P-BGA256-17x17-1

P-BGA256-27x27-1

LA-BGA-740-S-B-02

BGA256

Untitled

PRBG0256DD-A

BP-256

Untitled

BGA25

D 2395

BGA360

BGA256

16X16

16x16 bga

16x16 bga

BGA256

SF-BGA256C-B-11

180 ohm resistor

Untitled

BGA256