MD-001A
Abstract: No abstract text available
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
16-bit
MD-001A
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JEDEC TRAY DIMENSIONS
Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard
Text: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)
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BGA29
729-pin
BGA29
SSD-A-H7796
JEDEC TRAY DIMENSIONS
tray container dimensions
BGA package tray
JEDEC tray standard dimensions
tray bga
TRAY CONTAINER
JEDEC tray standard
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0.3mm pitch BGA
Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1
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BGA292D
396mm
508mm
635mm
FR4/G10
20X20
488mm
SF-BGA292D-B-11
0.3mm pitch BGA
micro pitch BGA
1mm pitch BGA
BGA 20x20
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P-BGA-292
Abstract: PBGA292
Text: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA292-2727-1
P-BGA-292
PBGA292
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C BGA292
Abstract: BGA292 MS-034 BGA-292 sot881
Text: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G
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BGA292:
OT881-1
OT881-1
MS-034
C BGA292
BGA292
MS-034
BGA-292
sot881
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BGA-292
Abstract: BGA292 C BGA292 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA292:
OT489-1
MS-034
BGA-292
BGA292
C BGA292
MS-034
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SF-BGA292A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA292A
FR4/G10
SF-BGA292A-B-11
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SD2608
Abstract: IEEE754 MN103E010HRA MN103E040HYB
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
SD2608
IEEE754
MN103E010HRA
MN103E040HYB
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PRBG0297FA-A
Abstract: P-BGA297-23x23-1
Text: JEITA Package Code P-BGA297-23x23-1.00 RENESAS Code PRBG0297FA-A B D1 D Previous Code 297F7X-A MASS[Typ.] 1.7g A A ZD b S AB e ZE AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
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P-BGA297-23x23-1
PRBG0297FA-A
297F7X-A
PRBG0297FA-A
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sd2608
Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
PC-9801
sd2608
9801 nec
IEEE754
MN103E010HRA
MN103E040HYB
pc9801 nec c bus
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jedec bga tray
Abstract: 784-pin 12Surface tray bga BGA package tray
Text: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)
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BGA29
29ESP
272-pin
729-pin
784-pin
BGA29
SSD-A-H6977-2
jedec bga tray
12Surface
tray bga
BGA package tray
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SF-BGA296A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA296A 26.67mm [1.050"] C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X 26.67mm [1.050"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA296A
FR4/G10
SF-BGA296A-B-11
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MO-151
Abstract: BGA292 transistor t 04 27 C BGA292
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA292:
OT489-1
MO-151
MO-151
BGA292
transistor t 04 27
C BGA292
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BGA292
Abstract: SF-BGA292B-B-11
Text: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA292B
FR4/G10
SF-BGA292B-B-11
BGA292
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BGA292
Abstract: BGA-292
Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1
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BGA292:
OT489-1
BGA292
BGA-292
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x
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BGA292:
OT489-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5
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BGA292:
OT881-1
MS-034
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VDD18
Abstract: CLK48
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
16-bit
timerSA27
VDD33
VDD18
CLK48
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SAMSUNG MCP
Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)
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KBB0xB400M
16Mx16)
4Mx16)
80-Ball
80x12
SAMSUNG MCP
ECH information
KBB0xB400M
BA102
ba4901
UtRAM Density
BA5101
samsung NAND memory
BGA180
ba30 transistor
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Untitled
Abstract: No abstract text available
Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised
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K8D6x16UTM
K8D6x16UBM
48TSOP1
16M/16M
08MAX
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BGA292
Abstract: RGMII to SGMII RJ45 1000M PHY
Text: DP83864 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer Literature Number: SNLS172B September 2003 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer General Description Features bs ol e te The DP83864 is an extremely efficient full featured Quad • IEEE compliant 10BASE-T,100BASE-TX, 1000BASE-T
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DP83864
DP83864
SNLS172B
10BASE-T
100BASE-TX,
1000BASE-T
10BASE-T,
BGA292
RGMII to SGMII
RJ45 1000M PHY
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Nexus S JTAG pins
Abstract: mPC5746m Nexus S camera
Text: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller
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AN4566
MPC5746M
32-bit
e200z4
200MHz.
Nexus S JTAG pins
Nexus S camera
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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A4H1
Abstract: HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement
Text: REJ09B0366-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7750, SH7750S, SH7750R Group 32
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REJ09B0366-0700
SH7750,
SH7750S,
SH7750R
32-Bit
Family/SH7750
A4H1
HD6417750RBG240
264-PIN
BSC COMPUTER SCIENCE digital logic design Notes
Transistor mcr 22-8 413
REJ10B0210-0400
A5H1
zo 607
HD6417750RBP240V
Tag 225 600 replacement
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