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    BGG256 Search Results

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    BGG256 Price and Stock

    AMD XC95288XL-6BGG256C

    IC CPLD 288MC 6NS 256BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95288XL-6BGG256C Tray 40
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    AMD XC95288XL-7BGG256C

    IC CPLD 288MC 7.5NS 256BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95288XL-7BGG256C Tray 40
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    Avnet Asia XC95288XL-7BGG256C 5 1
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    AMD XC95288XL-7BGG256I

    IC CPLD 288MC 7.5NS 256BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95288XL-7BGG256I Tray 40
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    Newark XC95288XL-7BGG256I Bulk 1
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    AMD XC95288XL-10BGG256C

    IC CPLD 288MC 10NS 256BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95288XL-10BGG256C Tray 40
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    AMD XC95288XL-10BGG256I

    IC CPLD 288MC 10NS 256BGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC95288XL-10BGG256I Tray 40
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    BGG256 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGG256

    Abstract: PK018 BG256
    Text: R Plastic BGA BG256/BGG256 Package PK018 (v1.3) March 19, 2007 256-BALL PLASTIC BGA (BG256/BGG256) 2001, 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


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    PDF BG256/BGG256) PK018 256-BALL BGG256 PK018 BG256

    XC9572XL

    Abstract: PC44 VQ44 XC9500 XC9500XL XC95144XL XC95288XL XC9536XL XC95288XL pinout
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.5 May 22, 2009 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


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    PDF XC9500XL DS054 XC9572XL PC44 VQ44 XC9500 XC95144XL XC95288XL XC9536XL XC95288XL pinout

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XC95288XL10TQG144I pinout

    Abstract: XC95288XL PQG208 XC95288XL pinout XC95288XL-10TQG144C fgg256 XC95288XL XC95288XL-7CS280C XC95288XL-10FGG256I XC95288XL-7TQ144I pqg208
    Text: XC95288XL High Performance CPLD R DS055 v2.1 April 3, 2007 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 user I/O pins


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    PDF XC95288XL DS055 144-pin 208-pin 256-pin 280-pin 220oC. XC95288XL10TQG144I pinout XC95288XL PQG208 XC95288XL pinout XC95288XL-10TQG144C fgg256 XC95288XL-7CS280C XC95288XL-10FGG256I XC95288XL-7TQ144I pqg208

    XC95288XL pinout

    Abstract: Xilinx jtag cable pcb Schematic XC9572XL TQ100 micron 3*3 resistor
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.1 March 22, 2006 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


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    PDF XC9500XL DS054 all03/22/06 XC95288XL CS280 DS054 44-pin XC95288XL pinout Xilinx jtag cable pcb Schematic XC9572XL TQ100 micron 3*3 resistor

    XC9572XL TQG100

    Abstract: XC9500XL schematic of TTL XOR Gates XC9572XL XC9572XL Series PC44 VQ44 XC9500 XC95144XL XC95288XL
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.2 July 25, 2006 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


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    PDF XC9500XL DS054 XC95288XL CS280 DS054 44-pin XC9572XL TQG100 schematic of TTL XOR Gates XC9572XL XC9572XL Series PC44 VQ44 XC9500 XC95144XL XC95288XL

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


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    PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


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    PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    XCV100 TQ144

    Abstract: XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116
    Text: Device Reliability Report First Quarter 2009 [optional] UG116 v5.5 June 15, 2009 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG116 611GU FGG676 FFG1152 XCV100 TQ144 XCS20XL pqg208 XC3S700AN FGG484 WS609 x2 type ac capacitor UG-116 xc3s200an pqg208 SPARTAN-3 XC3S400 PQ208 XC3S200 RELIABILITY REPORT UG116

    XC95288XL pinout

    Abstract: XC95288XL-7TQG144I xc95288xl-10tqg144 XC95288XL-10TQ144C
    Text: XC95288XL High Performance CPLD DS055 v2.0 March 22, 2006 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 user I/O pins)


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    PDF XC95288XL DS055 144-pin 208-pin 256-pin 280-pin BG256 BG352) CS280 XC95288XL pinout XC95288XL-7TQG144I xc95288xl-10tqg144 XC95288XL-10TQ144C

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


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    PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    XC9572XL

    Abstract: XC9500 pqg208
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.0 July 15, 2005 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


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    PDF XC9500XL DS054 XC95288XL CS280 DS054 44-pin XC9572XL XC9500 pqg208

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    XC9572XL TQ100

    Abstract: XC9500XL
    Text: k XC9500XL High-Performance CPLD Family Data Sheet R DS054 v2.3 April 3, 2007 Product Specification Features • • Optimized for high-performance 3.3V systems - 5 ns pin-to-pin logic delays, with internal system frequency up to 208 MHz - Small footprint packages including VQFPs, TQFPs


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    PDF XC9500XL DS054 XC95288XL CS280 DS054 44-pin XC9572XL TQ100

    XC95288XL-10PQG208I

    Abstract: XC95288XL-10TQ144I XC95288XL-10PQG208C XC95288XL XC95288XL-10TQG144C XAPP114 XAPP427 XC9500XL XC95288 xc95288xl-7fg256c
    Text: XC95288XL High Performance CPLD DS055 v1.8 July 15, 2004 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 user I/O pins)


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    PDF XC95288XL DS055 144-pin 208-pin 256-pin 280-pin BG256 BG352) CS280 XC95288XL-10PQG208I XC95288XL-10TQ144I XC95288XL-10PQG208C XC95288XL-10TQG144C XAPP114 XAPP427 XC9500XL XC95288 xc95288xl-7fg256c

    XAPP427

    Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING
    Text: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


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    PDF XAPP427 XAPP427 BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


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    PDF UG112 UG072, UG075, XAPP427, BFG95

    XC6SLX45t-fgg484

    Abstract: XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow
    Text: Device Reliability Report Third Quarter 2010 UG116 v5.11 November 1, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the “Documentation”) to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG116 611GU FGG676 FFG1152 XC6SLX45t-fgg484 XC6SLX16-CSG324 XC6SLX100-FGG676 XC6SLX45 FGG484 x2 type ac capacitor XC6SLX16 FIT rate xc3s3400a UG116 XC95288 Virtex-6 reflow

    Untitled

    Abstract: No abstract text available
    Text: IDT - Integrated Device Technology - QSpan II > CA91L862A > CA91L862A-50IEV Integrated Device Technology Products | Applications Processor Products | Search | EHB Embedded Host Bridges Support QSpan II™ Page 1 of 2 The Analog and Digital Company ™


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    PDF CA91L862A CA91L862A-50IEV

    TQG144

    Abstract: XC95288XL-10PQG208I XC95288XL-7TQG144I 6 pin diode n10 BGG256 marking j9 marking w13 marking W18 R20 marking XC95288XL-10TQ144I
    Text: XC95288XL High Performance CPLD DS055 v1.9 September 15, 2004 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages


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    PDF XC95288XL DS055 144-pin 208-pin 256-pin 280-pin CS280 FG256 220oC. TQG144 XC95288XL-10PQG208I XC95288XL-7TQG144I 6 pin diode n10 BGG256 marking j9 marking w13 marking W18 R20 marking XC95288XL-10TQ144I