Die Attach epoxy stamping
Abstract: 60022 pressure low die attach coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Text: Application Note Handling Gallium Arsenide Die Rev 2 INTRODUCTION Gallium arsenide die have physical properties that require special care in assembly to ensure high yields and good reliability. A few simple precautions in the die mounting and wire bonding operations
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TQFP144
Abstract: TQFP-144 G700LY 82V2058XDAG TQFP144 DIMENSION TQFP 144 PACKAGE 82V2058DAG 82V2048 82V2058DA TQFP 144
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-07 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: August 25, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES:
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A1007-07
82V2048
82V2058
TQFP-144)
JESD22-A113
82V2048DA
82V2048DAG
82V2048LDA
82V2048LDAG
TQFP144
TQFP-144
G700LY
82V2058XDAG
TQFP144 DIMENSION
TQFP 144 PACKAGE
82V2058DAG
82V2058DA
TQFP 144
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asm eagle
Abstract: WHP-002 flux-eutectic 2151-HTV21-CT-series CPR3-AN03 EZ290 bonding wire cree UP78 EZ1000 1572-17-437GM-20D
Text: EZBright LED Handling and Packaging Recommendations This applications note provides the user with a basic understanding of Cree’s EZBright LED chips, as well as recommendations on handling and packaging. Cree’s EZBright LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials
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EZ290TM
EZR260TM
EZ290,
EZR260
EZ1000
CPR3AN04
asm eagle
WHP-002
flux-eutectic
2151-HTV21-CT-series
CPR3-AN03
EZ290
bonding wire cree
UP78
1572-17-437GM-20D
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KCW-10
Abstract: AuSn solder GaAs MMIC ESD, Die Attach and Bonding Guidelines thermocompression bonder AuSn a/KCW-10
Text: H GaAs MMIC Assembly and Handling Guidelines Application Note 999 Mechanical Considerations Because of the small size of the devices, handling should always be performed with the aid of a microscope. There are several methods for picking up, transferring and die
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5091-1988E
5964-6644E
KCW-10
AuSn solder
GaAs MMIC ESD, Die Attach and Bonding Guidelines
thermocompression
bonder
AuSn
a/KCW-10
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84-1LMI epoxy adhesive
Abstract: 84-1LMI thermocompression Die Attach and Bonding Guidelines copper bond wire PEDESTAL FOR MMIC BRASS
Text: GaAs MMIC ESD, Die Attach and Bonding Guidelines Application Note # 54 - Rev. A May 2000 1.0 ESD Considerations A GaAs IC can be destroyed electrically by a static or other discharge through the device. It must therefore be handled so these effects cannot occur.
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SPT-1002-A-W-2015-L-F
84-1LMI epoxy adhesive
84-1LMI
thermocompression
Die Attach and Bonding Guidelines
copper bond wire
PEDESTAL FOR MMIC BRASS
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CPR3-AN03
Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
Text: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.
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CPR3-AN02,
CPR3-AN03
pressure low die attach
UP78
silicon carbide LED cree
AuSn eutectic
ejector
0.5um
silicon carbide LED
bonding wire cree
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ed28 smd diode
Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM
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ED-4701-1
C-113:
ed28 smd diode
hv 102 mos fet transistor
diagram of high frequency pvc welding machine
schematic diagram of electric cookers
Ultrasonic Cleaner schematic
engel injection machines
TEG 2423
40khz ULTRASOUND CLEANER
ultrasonic generator 40khz for cleaning
schematic of trigger 555 n-mosfet
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Sharp Semiconductor Lasers
Abstract: AU4A transistor QB tensile-strength thermopile array BREAK FAILURE INDICATOR APPLICATIONS LIST relay failure analysis CRACK DETECTION PATTERNS gold wire bound failures due to ultrasonic cleaning 2n2222 micro electronics
Text: Application Note Optoelectronics Failure Analysis of Optoelectronic Devices DEFINITIONS • US Military Standard: MIL-STD-883 Method 5003 Failure Analysis Procedures for Microcircuits – Failure analysis is a post-mortem examination of a failed device employing, as required, electrical
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MIL-STD-883
SMA04033
Sharp Semiconductor Lasers
AU4A
transistor QB
tensile-strength
thermopile array
BREAK FAILURE INDICATOR APPLICATIONS LIST
relay failure analysis
CRACK DETECTION PATTERNS
gold wire bound failures due to ultrasonic cleaning
2n2222 micro electronics
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77106
Abstract: CRACK DETECTION PATTERNS HM628128 reliability test data cbv 2 10910 statistical Physics Hitachi DSA00503
Text: Reliability of Hitachi IC Memories 1. Structure IC memory devices are classified as NMOS type, CMOS type, and Bi-CMOS type. There are advantages to it's circuit design, layout pattern, degree of integration, and manufacturing process. All Hitachi memories are produced using standardized design, manufacturing, and inspection techniques.
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DATA SHEET OF IC 317
Abstract: Test-Element-Group Thermal Test-Element-Group hitachi ic hitachi HM514256 HM514256 28-pin SOJ SRAM high speed thyristor HM62256 Reliability of Hitachi IC Memories
Text: Reliability of Hitachi IC Memories Contents 1. Structure 2. Reliability 3. Reliability of Semiconductor Devices Reliability of Hitachi IC Memories 1. Structure IC memory devices are classified as NMOS type, CMOS type, and Bi-CMOS type. There are advantages to it's circuit design, layout pattern,
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CGH60060D
Abstract: hemt .s2p 5609 transistor
Text: CGH60060D 60 W, 6.0 GHz, GaN HEMT Die Cree’s CGH60060D is a gallium nitride GaN High Electron Mobility Transistor (HEMT). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift
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CGH60060D
CGH60060D
CGH6006
hemt .s2p
5609 transistor
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5609 transistor
Abstract: CGH60060D bonding wire cree
Text: CGH60060D 60 W, 6.0 GHz, GaN HEMT Die Cree’s CGH60060D is a gallium nitride GaN High Electron Mobility Transistor (HEMT). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift
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CGH60060D
CGH60060D
CGH6006
5609 transistor
bonding wire cree
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cgh60120D
Abstract: No abstract text available
Text: CGH60120D 120 W, 6.0 GHz, GaN HEMT Die Cree’s CGH60120D is a gallium nitride GaN High Electron Mobility Transistor (HEMT). GaN has superior properties compared to PN: CGH6012 0D silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity, and higher thermal conductivity.
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CGH60120D
CGH60120D
CGH6012
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cgh60120D
Abstract: CGH6012
Text: CGH60120D 120 W, 6.0 GHz, GaN HEMT Die Cree’s CGH60120D is a gallium nitride GaN High Electron Mobility Transistor (HEMT). GaN has superior properties PN: CGH6012 0D compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity, and higher thermal
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CGH60120D
CGH60120D
CGH6012
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CGH60015D
Abstract: bonding wire cree
Text: CGH60015D 15 W, 6.0 GHz, GaN HEMT Die Cree’s CGH60015D is a gallium nitride GaN High Electron Mobility Transistor (HEMT). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity,
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CGH60015D
CGH60015D
CGH6001
bonding wire cree
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62256 hitachi
Abstract: 28 pin plastic dip hitachi dimension hitachi PLC
Text: Reliability of Hitachi 1C Memories 1. Structure The dies of IC memories are encapsulated in various packages. The most common packages are plastic and cerdip. Plastic packages are widely used in many different types of equipment. Cerdip packaging is especially suitable in equipment
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CBV2
Abstract: HN27C301
Text: Reliability of Hitachi IC Memories 1. Structure IC memory devices are classified as NMOS type, CMOS type, and Bi-CMOS type. There are advantages to it's circuit design, layout pattern, degree of integration, and manufacturing process. All Hitachi memories are produced using standardized design, manufacturing, and inspection techniques.
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flash 32 Pin PLCC 16mbit
Abstract: 398x
Text: Reliability o f Hitachi IC Memories 1. Structure IC memory devices are classified as NMOS type, CMOS type, and Bi-CMOS type. There are advantages to it's circuit design, layout pattern, degree of integration, and manufacturing process. All Hitachi memories are produced using standardized design, manufacturing, and inspection techniques.
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HN613256P
Abstract: HN27C301 1S00G CRACK DETECTION PATTERNS HN27256
Text: • RELIABILITY OF HITACHI 1C MEMORIES 1. ST RU CTU RE 1C memories are basically classified into bipolar type and MOS type and utilized effectively by their characteristics. The characteristic of bipolar memo ries is high speed but small capacity, instead, MOS
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CBV2
Abstract: hitachi ic thyristor TT 570 N Reliability of Hitachi IC Memories
Text: Reliability o f Hitachi IC Memories 1. Structure IC memory devices are classified as NMOS type, CMOS type, and Bi-CMOS type. There are advantages to it's circuit design, layout pattern, degree of integration, and manufacturing process. All Hitachi memories are produced using standardized design, manufacturing, and inspection techniques.
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transistor tester
Abstract: Polymer Aluminum Capacitor CS 213 Polymer protection ph meter Hitachi die attach film digital microammeter
Text: Reliability 1. Reliability 1.1 Reliability Characteristics for Semiconductor Devices H ita ch i se m ic o n d u c to r d e v ic e s are d e sig n e d , manufactured and inspected so as to achieve a high level o f reliability. Accordingly, system reliability
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DYNA-CRIMP
Abstract: copalum 58422-1
Text: _ COPALUM Sealed Terminals and Splices Catalog 82126 Revised 3-94 Product Facts • No need for inhibitor agents, thanks to AMP's “ dry crimp” technique ■ Terminating/splicing capa bilities for stranded alu minum wire, plus splicing of aluminum wire to copper
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408-9535rips
DYNA-CRIMP
copalum
58422-1
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27c301
Abstract: HM6788P-25 HM6788
Text: • RELIABILITY OF HITACHI 1C MEMORIES 1. S TR U C TU R E IC memories are basically classified into bipolar type and MOS type and utilized effectively by their characteristics. The characteristic of bipolar memories is high speed but small capacity, instead, MOS memories have large capacity.
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free transistor equivalent book 2sc
Abstract: HA13108 HL7801G HL7801E free thyristor equivalent book 2sc 2SC1707 HIGH POWER HIGH FREQUENCY CVD DIAMOND CHIP RESISTORS footprint HD44237 semi catalog pic micro weighing scale code example
Text: RELIABILITY 1. 1.1 R E L IA B IL IT Y R E L IA B IL IT Y C H A R A C T E R IS T IC S F O R S E M IC O N D U C T O R D E V IC E S Hitachi semiconductor devices are designed, manufactured and inspected so as to achieve a high level of reliability. Accordingly, system reliability can be improved by com
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