Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0052512 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0048153 91.700% 39.149% Trade secret
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CDFN2520
CDFN2520-4LD-GRN-RS-18
031214HC04
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0052512 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0048153 91.700% 39.149% Trade secret
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CDFN2520
CDFN2520-4LD-GRN-RS-11
031214HC03
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0049499 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0045391 91.700% 36.903% Trade secret
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CDFN2520
CDFN2520-6LD-GRN-RS-18
031214HC05
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LQFP-128L
Abstract: LQFP128L
Text: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER
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FCQFN46-34L
FQFN33-16L,
FQFN44-26L,
H3QFN1212-64L
H3QFN88-52L
H4QFN1010-52L
QFN56-30L
H4QFN1212-64L
LGA5032-06L
LGA5555-76L
LQFP-128L
LQFP128L
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