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    CDFP Search Results

    CDFP Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    R5F52108CDFP#30 Renesas Electronics Corporation High Performance, Low Power 32-bit Microcontrollers Supporting Large Capacity Memory Visit Renesas Electronics Corporation
    R5F104LCDFP#X0 Renesas Electronics Corporation Low Power, High Function, General Purpose Microcontrollers for Motor Control, Industrial and Metering Applications Visit Renesas Electronics Corporation
    R5F21336CDFP#V2 Renesas Electronics Corporation 16-bit Microcontrollers with R8C CPU Core (Non Promotion) Visit Renesas Electronics Corporation
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    CDFP Price and Stock

    Rochester Electronics LLC R5F571MLCDFP#V0

    IC MCU 32BIT 4MB FLASH 100LFQFP
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    DigiKey R5F571MLCDFP#V0 Bulk 2,888 10
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    Renesas Electronics Corporation R5F52316CDFP#30

    IC MCU 32BIT 256KB FLSH 100LFQFP
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    DigiKey R5F52316CDFP#30 Tray 1,045 1
    • 1 $8.72
    • 10 $6.013
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    Verical R5F52316CDFP#30 545 4
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    Newark R5F52316CDFP#30 Bulk 313 1
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    Avnet Asia R5F52316CDFP#30 12 Weeks 360
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    Avnet Silica R5F52316CDFP#30 14 Weeks 90
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    Chip1Stop R5F52316CDFP#30 Tray 545
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    Renesas Electronics America R5F52316CDFP#30 Tray 1,045 1
    • 1 $8.72
    • 10 $6.013
    • 100 $4.63563
    • 1000 $3.73881
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    Renesas Electronics Corporation R5F564MGCDFP#11

    IC MCU 32BIT 2.5MB FLSH 100LFQFP
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    DigiKey R5F564MGCDFP#11 Tray 720 1
    • 1 $17.92
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    Chip1Stop R5F564MGCDFP#11 Tray 720
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    Renesas Electronics America R5F564MGCDFP#11 Tray 720 1
    • 1 $17.92
    • 10 $16.472
    • 100 $13.91125
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    Renesas Electronics Corporation R5F566TFCDFP#10

    IC MCU 32BIT 512KB FLSH 100LFQFP
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    DigiKey R5F566TFCDFP#10 Tray 720 1
    • 1 $10.68
    • 10 $7.456
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    Chip1Stop R5F566TFCDFP#10 Tray 663
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    Renesas Electronics America R5F566TFCDFP#10 Tray 720 1
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    • 10 $7.456
    • 100 $5.821
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    Renesas Electronics Corporation R5F571MFCDFP#10

    IC MCU 32BIT 2MB FLASH 100LFQFP
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    DigiKey R5F571MFCDFP#10 Tray 720 1
    • 1 $19.05
    • 10 $17.505
    • 100 $14.78375
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    Renesas Electronics America R5F571MFCDFP#10 Tray 720 1
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    Find more CDFP price and stock on Findchips.com

    CDFP Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    CDFP3-F14 Intersil Obsolete Product Datasheet Original PDF

    CDFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    cdfp3-f28

    Abstract: dip 28 dimension
    Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN


    Original     		PDF MIL-STD-1835 CDFP3-F28 F-11A, 038mm) cdfp3-f28 dip 28 dimension

    DG509A

    Abstract: CERAMIC FLATPACK 20pin dg509aal
    Text: SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER Device Type 01 02 Generic Number DG508AA x /883B DG509AA(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter K L P Z Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CDFP4-16


    Original     		PDF DG508AA /883B DG509AA /883B Mil-Std-1835 GDIP1-T16 CDIP2-T16 CDFP4-16 DG509A CERAMIC FLATPACK 20pin dg509aal

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCDF001 – JANUARY 1997 HBK R-CDFP-F32 CERAMIC DUAL FLATPACK 0.006 (0,15) 0.004 (0,10) 0.117 (2,97) 0.097 (2,46) 0.033 (0,84) 0.027 (0,69) 0.336 (8,53) 0.324 (8,23) 0.310 (7,87) 0.290 (7,37) 0.415 (10,54) 0.405 (10,29) 16 17 0.755 (19,18)


    Original     		PDF MCDF001 R-CDFP-F32) 4073159/A

    R-CDFP-F20

    Abstract: No abstract text available
    Text: MECHANICAL DATA MHRR001 – MAY 1995 HR R-CDFP-F20 CERAMIC DUAL FLATPACK 0.100 (2,54) MIN 1 20 0.050 (1,27) TYP 0.715 (18,16) 0.685 (17,39) 0.022 (0,56) 0.015 (0,38) 10 11 0.500 (12,70) 0.480 (12,19) 0.370 (9,40) 0.250 (6,35) 0.035 (0,89) 0.025 (0,64) 0.100 (2,54)


    Original     		PDF MHRR001 R-CDFP-F20) R-CDFP-F20

    dual flatpack

    Abstract: 634 transistor
    Text: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN


    Original     		PDF MCDF002 R-CDFP-F50) 4081537/B dual flatpack 634 transistor

    78 hkc

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCFP011A – JANUARY 1995 – REVISED JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76


    Original     		PDF MCFP011A R-CDFP-F64) 4073160/C 78 hkc

    CDFP4-F24

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN


    Original     		PDF MIL-STD-1835 CDFP4-F24 350ied. 038mm) CDFP4-F24

    CDFP3-F14

    Abstract: K14.A Package
    Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN


    Original     		PDF MIL-STD-1835 CDFP3-F14 038mm) CDFP3-F14 K14.A Package

    5962-8750401XA

    Abstract: qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R029-92. thn 91-11-22 Mionica L. Poelking B Changes according to NOR 5962-R130-93. tvn 93-04-12 Thomas M. Hess C Add package CDFP4-F16. Change document to current electronic format.


    Original     		PDF 5962-R029-92. 5962-R130-93. CDFP4-F16. 0EU86 5962-8750401XA qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16

    cdfp4-f16

    Abstract: No abstract text available
    Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045


    Original     		PDF MIL-STD-1835 CDFP4-F16 038mm) cdfp4-f16

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCDF003A – JANUARY 1998 HKE R-CDFP-F36 CERAMIC DUAL FLATPACK 0.125 (3,18) 0.096 (2,44) 0.009 (0,23) 0.003 (0,08) 0.045 (1,14) 0.026 (0,66) 0.397 (10,08) 0.385 (9,78) 0.515 (13,81) 0.505 (12,83) 18 0.310 (7,87) 0.250 (6,35) 19 0.850 (21,59)


    Original     		PDF MCDF003A R-CDFP-F36) 4081545/B

    cdfp4-f16

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN


    Original     		PDF MIL-STD-1835 CDFP4-F16 245lied. 038mm) cdfp4-f16

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCFP011A – JANUARY 1997 HKC R-CDFP-F64 CERAMIC DUAL FLATPACK WITH NCTB 41,14 SQ 40,13 25,91 24,89 19,43 18,54 0,66 MIN 3,81 2,54 1,78 1,40 33 64 11,30 10,67 1 32 8,13 7,49 4,70 3,68 0,25 0,15 0,20 0,11 1,02 0,76 0,50 4073160/C 09/96 NOTES: A.


    Original     		PDF MCFP011A R-CDFP-F64) 4073160/C

    10H524

    Abstract: 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs


    Original     		PDF 5962-R268-92. CDFP4-F16. 0EU86 10H524 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"

    qml-38535

    Abstract: CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin


    Original     		PDF 5962-R106-93. CDFP4-F16. 0EU86 qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576

    Untitled

    Abstract: No abstract text available
    Text: SPP-10E-LR-CDFP Features  Support 10GBASE-LR/LW and Data Center application  Up to 1.4km transmission on SMF  1310nm FP laser and PIN receiver  SFI high speed electrical interface  2-wire interface with integrated Digital Diagnostic monitoring


    Original     		PDF SPP-10E-LR-CDFP 10GBASE-LR/LW 1310nm MIL-STD-883E 61000m DS-7159

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs


    Original     		PDF 5962-R107-93. CDFP4-F16. MIL-PRF-38535

    Untitled

    Abstract: No abstract text available
    Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16


    Original     		PDF DG201AA /883B DG202A /883B Mil-Std-1835 CDFP4-F16 GDIP1-T16 CDIP2-T16 CQCC1-N20

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)


    Original     		PDF MCFP008 R-CDFP-F28)

    CDFP

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCFP009B– JANUARY 1995 – REVISED JUNE 1999 HKB R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.350 (8,89) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places


    Original     		PDF MCFP009B­ R-CDFP-F28) CDFP

    MCFP008

    Abstract: R-CDFP-F28
    Text: MECHANICAL DATA MCFP008 – OCTOBER 1994 HKA R-CDFP-F28 CERAMIC DUAL FLATPACK 0.045 (1,14) 0.026 (0,66) Lid 0.009 (0,23) 0.004 (0,10) 0.130 (3,32) 0.090 (2,29) 0.400 (10,16) 0.200 (5,08) 0.030 (0,76) MIN 2 Places 0.010 (0,25) MIN 4 Places 0.370 (9,40) 0.250 (6,35)


    Original     		PDF MCFP008 R-CDFP-F28) MCFP008 R-CDFP-F28

    CDFP3-F10

    Abstract: k10a
    Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K10.A MIL-STD-1835 CDFP3-F10 (F-4A, CONFIGURATION B) 10 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE e A INCHES A -A- D -BPIN NO. 1 ID AREA b E1 0.004 M H A-B S Q D S S1


    Original     		PDF MIL-STD-1835 CDFP3-F10 038mm) CDFP3-F10 k10a

    Untitled

    Abstract: No abstract text available
    Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16


    Original     		PDF DG201AA /883B DG202A /883B Mil-Std-1835 CDFP4-F16 GDIP1-T16 CDIP2-T16 CQCC1-N20

    R-CDFP-F50

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCDF002 – NOVEMBER 1995 HKD R-CDFP-F50 CERAMIC DUAL FLATPACK 0.665 (16,90) 0.634 (16,10) 1 50 0.031 (0,80) 0.843 (21,40) 0.811 (20,60) 0.766 (19,45) 0.746 (18,95) 0.020 (0,50) 0.012 (0,30) 25 26 0.370 (9,40) 0.250 (6,35) 0.015 (0,38) MIN


    Original     		PDF MCDF002 R-CDFP-F50) 4081537/B R-CDFP-F50