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    CERAMIC LEADLESS CHIP CARRIER LCC 32 Search Results

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    HMC1048ALC3BTR Analog Devices Mixer 12-Terminal Ceramic LCC Visit Analog Devices Buy

    CERAMIC LEADLESS CHIP CARRIER LCC 32 Datasheets Context Search

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    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    WQFN032-C-R450-1

    Abstract: C038
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 WQFN032-C-R450-1 C038

    WQFN032-G-R450-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)


    Original     		PDF LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15TYP WQFN032-G-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    WQFN032-C-S420-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal LCC-32C-A06 32-pad ceramic LCC (LCC-32C-A06)


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 32-pad LCC-32C-A06) C32007SC-4-3 WQFN032-C-S420-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		PDF STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40mil Package width x package length 420 × 420mil Sealing method Metal seal LCC-32C-A06 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 40mil 420mil 32-pad LCC-32C-A06) C32007SC-4-3 CERAMIC LEADLESS CHIP CARRIER a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 Lead pitch 50mil Package width x package length 450 × 550mil Sealing method Metal seal 32-pad ceramic LCC LCC-32C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 50mil 550mil 32-pad LCC-32C-A01) CERAMIC LEADLESS CHIP CARRIER 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-G-R450-1 LCC-32C-F01
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50mil Package width x package length 450 × 550mil Sealing method Frit seal LCC-32C-F01 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-F01 WQFN032-G-R450-1 50mil 550mil 32-pad LCC-32C-F01) C32017SC-2-2 15TYP CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-G-R450-1 LCC-32C-F01

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 32-pad LCC-32C-A06) C32007SC-4-3 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-32C-A01 CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC To Top / Package Lineup / Package Index LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal


    Original     		PDF LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15T010 15TYP PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 WQFN032-G-R450-1 LCC-32C-F01

    Untitled

    Abstract: No abstract text available
    Text: Quartz Crystal Oscillators PECL COMPATIBLE CRYSTAL OSCILLATOR IN CERAMIC LCC PACKAGE - XO75PE Series FEATURES RoHS Compliant Pb-Free , Best Suited for ECL Logic Devices Very Low Phase Jitter, Excellent Noise Margin, Industry de facto Standard Footprint Leadless Chip Carrier (LCC) Ultra Small Package (7x5x2 mm)


    Original     		PDF XO75PE St5M520-B50A3

    Untitled

    Abstract: No abstract text available
    Text: Quartz Crystal Oscillators PECL COMPATIBLE CRYSTAL OSCILLATOR IN CERAMIC LCC PACKAGE - XO75PE Series FEATURES RoHS Compliant Pb-Free , Best Suited for ECL Logic Devices Very Low Phase Jitter, Excellent Noise Margin, No Internal PLL Leadless Chip Carrier (LCC) Ultra Small Package, Industry de facto Standard Footprint


    Original     		PDF XO75PE Frequency520-B50A3

    Untitled

    Abstract: No abstract text available
    Text: Quartz Crystal Oscillators PECL COMPATIBLE CRYSTAL OSCILLATOR IN CERAMIC LCC PACKAGE - XO75PE Series FEATURES RoHS Compliant Pb-Free , Best Suited for ECL Logic Devices Very Low Phase Jitter, Excellent Noise Margin, No Internal PLL Leadless Chip Carrier (LCC) Ultra Small Package, Industry de facto Standard Footprint


    Original     		PDF XO75PE Stability5M520-B50A3

    Untitled

    Abstract: No abstract text available
    Text: Quartz Crystal Oscillators PECL COMPATIBLE CRYSTAL OSCILLATOR IN CERAMIC LCC PACKAGE - XO75PE Series FEATURES RoHS Compliant Pb-Free , Best Suited for ECL Logic Devices Very Low Phase Jitter, Excellent Noise Margin, No Internal PLL Leadless Chip Carrier (LCC) Ultra Small Package, Industry de facto Standard Footprint


    Original     		PDF XO75PE Ran5M520-B50A3

    Untitled

    Abstract: No abstract text available
    Text: Quartz Crystal Oscillators PECL COMPATIBLE CRYSTAL OSCILLATOR IN CERAMIC LCC PACKAGE - XO75PE Series FEATURES RoHS Compliant Pb-Free , Best Suited for ECL Logic Devices Very Low Phase Jitter, Excellent Noise Margin, No Internal PLL Leadless Chip Carrier (LCC) Ultra Small Package, Industry de facto Standard Footprint


    Original     		PDF XO75PE Frequency520-B50A3

    Untitled

    Abstract: No abstract text available
    Text: 8 Megabit FLASH EEPROM DPZ1MM8NG DESCRIPTION: The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NG is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically sealed making the module suitable for commercial,


    Original     		PDF 150ns 30A136-00

    Untitled

    Abstract: No abstract text available
    Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:53 AM Page 33 HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL FEATURES: • Leadless chip carrier LCC , low profile. • HCMOS and TTL Compatible. • Tristate Enable / Disable Function. • High Density Surface-Mount Applications.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ULTRA LOW PROFILE • HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL2 and ASV2 7.3 x 5.08 x 1.05 mm FEATURES: • • • • Leadless chip carrier LCC , 1.05 mm max. in height.• High density surface-mount applications. HCMOS and TTL compatible, 5V or 3.3VDC.


    Original     		PDF 544MHz 20ppm 25ppm 30ppm 35ppm 50ppm

    7142LA25L48B

    Abstract: 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA
    Text: IDT Military Offerings FIFO Military Offerings Logic Military Offerings Multi-Port Military Offerings SRAM Military Offerings May 2005 FIFO Military Offerings FIFO Military Selector Guide by Part Number FIFO Military Selector Guide (by SMD Number) Obsolete Part List and Replacement Guide


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 7200L20TDB 7200L30TDB 7201LA20DB 7201LA30DB 7142LA25L48B 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA

    IDT54FCT541ATDB

    Abstract: 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA
    Text: FIFO MILITARY SELECTOR GUIDE As Of: November 1, 2001 FIFO Military Offerings Page FIFO Military Selector Guide by Part Number . 3-4 FIFO Military Selector Guide (by SMD Number) . 5 Obsolete Part List and Replacement Guide . 6-8


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 72404L15DB 72404L35DB 7200L20TDB 7200L30TDB IDT54FCT541ATDB 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    Dense-Pac Microsystems dpz1MM

    Abstract: DPZ1M
    Text: DENSE-PAC 8 Megabit FLASH EEPROM VI I C K O S Y ST HM $ D PZ1M M 8N G D E SC R IP T IO N : The DPZ1MM8NG is a 1 Meg x 8 CMOS FLASH Electrically Erasable and Programmable nonvolatile memory devices. The DPZ1MM8NC is a 40 Pin ceramic Leadless Chip Carrier LCC , hermetically


    OCR Scan     		PDF 150ns 100ns 120ns 30A136-00 Dense-Pac Microsystems dpz1MM DPZ1M