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    CERDIP PACKAGE Search Results

    CERDIP PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CERDIP PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CERDIP Package Intersil 18 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE Original PDF

    CERDIP PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERDIP 28 PINS

    Abstract: CODE 1P MATRA MHS code 1k CERDIP 48 PINS
    Text: Packages Ceramic Dual In Line package outlines 22 pins CERDIP 300 mils Code : 1S Date : 28–04–97 24 pins CERDIP (300 mils) Code : 1Z MATRA MHS Date : 29–06–94 1 Packages 28 pins CERDIP (300 mils) Code : 1P Date : 23–04–97 28 pins CERDIP (600 mils)


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    MIL-STD-1835

    Abstract: D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip cerdip 16 lead
    Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 22–Lead (400–Mil) CerDIP D8


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    PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip cerdip 16 lead

    ceramic package

    Abstract: CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ
    Text: Ceramic Dual-in-Line Package Cerdip 8 Lead Ceramic Dual-in-Line Package NS Package Number J08A 2000 National Semiconductor Corporation MS101109 www.national.com Ceramic Dual-in-Line Package (Cerdip) August 1999 Ceramic Dual-in-Line Package (Cerdip) 14 Lead Ceramic Dual-in-Line Package


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    PDF MS101109 ceramic package CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ

    w32 transistor

    Abstract: W32 Package transistor w16 W6 Diode MIL-STD-1835 cerdip CERDIP Package W6 Package D-10 600MIL
    Text: Package Diagram Ceramic Windowed Dual-In-Line Packages 20-Lead 300-Mil Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagram 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A


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    PDF 20-Lead 300-Mil) MIL-STD-1835 24-Lead 600-Mil) 28-Lead w32 transistor W32 Package transistor w16 W6 Diode cerdip CERDIP Package W6 Package D-10 600MIL

    80041

    Abstract: MIL-STD-1835 40 PIN CERDIP cerdip D16 PACKAGE DIAGRAM 80046 CERDIP 52 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor
    Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029


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    PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead 22-Lead 80041 40 PIN CERDIP cerdip D16 PACKAGE DIAGRAM 80046 CERDIP 52 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor

    MIL-STD-1835

    Abstract: D-10 1835
    Text: Package Diagrams Ceramic Windowed Dual-In-Line Packages 20-Lead 300-Mil Windowed CerDIP W6 MIL-STD-1835 D-8 Config. A 24-Lead (600-Mil) Windowed CerDIP W12 MIL-STD-1835 D-3 Config. A 1 Package Diagrams 24-Lead (300-Mil) Windowed CerDIP W14 MIL-STD-1835 D-9 Config. A


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    PDF 20-Lead 300-Mil) MIL-STD-1835 24-Lead 600-Mil) 28-Lead D-10 1835

    MIL-STD-1835

    Abstract: sidebraze
    Text: Package Diagrams Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagrams 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029


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    PDF 16-Lead 300-Mil) MIL-STD-1835 18-Lead 20-Lead 22-Lead sidebraze

    ad7543kn

    Abstract: AD7543JN
    Text: Package/Price Information 12-Bit, Multiplying Iout, SERIAL Model Status Package Description Pin Count Temperature Range Price* 100-499 AD7543AQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543BQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543GBQ OBSOLETE


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    PDF 12-Bit, AD7543AQ AD7543BQ AD7543GBQ AD7543GKN AD7543GKR AD7543GKR-REEL AD7543GKR-REEL7 AD7543GTQ AD7543GTQ/883B ad7543kn AD7543JN

    DAC8212FV

    Abstract: DAC8221FS
    Text: Package/Price Information Dual 12-Bit Buffered Multiplying CMOS D/A Converter Model Status Package Description Pin Count Temperature Range Price* 100-499 5962-8967101LA PRODUCTION CERDIP GLASS SEAL 24 MILITARY $85.78 DAC8212FV PRODUCTION CERDIP GLASS SEAL


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    PDF 12-Bit 5962-8967101LA DAC8212FV DAC8221AW/883C DAC8221BTC/883C DAC8221EW DAC8221FP DAC8221FS DAC8221GBC DAC8221GP

    CDIP

    Abstract: glass frit electronics
    Text: data sheet CERAMIC / HERMETIC CDIP / CerDIP Ceramic Dual-Inline Package CDIP / CerDIP Amkor Technology is committed to continuing to service this long established standard industry package. The Amkor Technology CDIP capability provides a wide range of lead counts and body


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    PDF DS801 CDIP glass frit electronics

    14-PIN

    Abstract: No abstract text available
    Text: a 14-Pin CERDIP Package Q-14 Dimensions shown in inches and (mm)


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    PDF 14-Pin

    CERDIP Package

    Abstract: No abstract text available
    Text: a 8-Pin CERDIP Package Q-08 Dimensions shown in inches and (millimeters)


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    MD300-09A

    Abstract: cerdip
    Text: UNIT : mm 7.5 13.5 8.3 4.3 14.2 MD300-09A or SC-300-7P length : 495±2.0 thickness : 0.5+0.2 −0.1 tolerance : ±0.4 material : plastic with antistatic finish Applied Package Quantity (pcs) 8-pin plastic DIP MAX. 50 8-pin ceramic DIP (cerdip) MAX. 45 14-pin ceramic DIP (cerdip)


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    PDF MD300-09A SC-300-7P 14-pin 16-pin 18-pin 20-pin 22-pin 24-pin 28-pin cerdip

    METAL DETECTOR PROGRAM PIC16F84

    Abstract: PIC16F84 Free Projects of LED PIC16F84A 16 pin ic 16 PIN PIR SENSOR IC PINOUT BCD DIVISION USING MPASM four pin PIR sensor PIC16F84 and Parallel port interfacing circuit PIC16F84A PIC17C42 PIC17C42A
    Text: PIC17C4X High-Performance 8-Bit CMOS EPROM/ROM Microcontroller Devices included in this data sheet: PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42† PDIP, CERDIP, Windowed CERDIP Microcontroller Core Features: ✯ • Only 58 single word instructions to learn


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    PDF PIC17C4X PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42 METAL DETECTOR PROGRAM PIC16F84 PIC16F84 Free Projects of LED PIC16F84A 16 pin ic 16 PIN PIR SENSOR IC PINOUT BCD DIVISION USING MPASM four pin PIR sensor PIC16F84 and Parallel port interfacing circuit PIC16F84A PIC17C42 PIC17C42A

    Untitled

    Abstract: No abstract text available
    Text: PIC17C4X High-Performance 8-Bit CMOS EPROM/ROM Microcontroller Devices included in this data sheet: PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42† PDIP, CERDIP, Windowed CERDIP Microcontroller Core Features: ✯ • Only 58 single word instructions to learn


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    PDF PIC17C4X PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42â

    KC800

    Abstract: KC700 KC-320 KC-700 54fct162245ateb A0910-02 6116SA120DB 5962-8866201XA 54FCT162244ATEB M1014
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN 15-Apr-2010 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: A0910-02 DATE: Product Affected: Cerdip 300 mil, Cerdip 600 mil Product Mark


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    PDF 15-Apr-2010 A0910-02 15-Jul-2010 0/100deg 1000cys. -65/150deg 85deg KC800 KC700 KC-320 KC-700 54fct162245ateb A0910-02 6116SA120DB 5962-8866201XA 54FCT162244ATEB M1014

    17C42A

    Abstract: bcd division using mpasm pic16f84 16 PIN PIR SENSOR IC PINOUT METAL DETECTOR PROGRAM PIC16F84 PIR D 203 S BCD DIVISION USING MPASM microcontroller application PIR CONTROLLER PIC16 example codes TECH C compiler pwm PIC16 example hi tech lcd IC transistor linear handbook
    Text: PIC17C4X High-Performance 8-Bit CMOS EPROM/ROM Microcontroller Devices included in this data sheet: PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42† PDIP, CERDIP, Windowed CERDIP Microcontroller Core Features: ✯ • Only 58 single word instructions to learn


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    PDF PIC17C4X PIC17CR42 PIC17C42A PIC17C43 PIC17CR43 PIC17C44 PIC17C42 17C42A bcd division using mpasm pic16f84 16 PIN PIR SENSOR IC PINOUT METAL DETECTOR PROGRAM PIC16F84 PIR D 203 S BCD DIVISION USING MPASM microcontroller application PIR CONTROLLER PIC16 example codes TECH C compiler pwm PIC16 example hi tech lcd IC transistor linear handbook

    FL65

    Abstract: 318N MIL-STD-1835 Mq05 VN 990
    Text: Packages Packaging Information 28D6,28 Lead, 0.600” Wide, Non-Windowed, Ceramic Dual Inline Package Cerdip Dimensions in Inches and (Millimeters) 32D6,32 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters)


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    PDF MIL-STD-1835 MQ-052 FL65 318N Mq05 VN 990

    MIL-STD-1835

    Abstract: 44 Lead Ceramic Leadless Chip Carrier MO-52
    Text: Packages Packaging Information 28D6, 28 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package Cerdip Dimensions in Inches and (Millimeters) 32D6,32 Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip) Dimensions in Inches and (Millimeters)


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    PDF MIL-STD-1835 MO-52 44 Lead Ceramic Leadless Chip Carrier

    D-10

    Abstract: D28-1 AD-01
    Text: PACKAGE DIAGRAM OUTLI NES CERDIP C o n tin u e d


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    PDF D28-1 D-10 D28-1 AD-01

    62256 hitachi

    Abstract: 28 pin plastic dip hitachi dimension hitachi PLC
    Text: Reliability of Hitachi 1C Memories 1. Structure The dies of IC memories are encapsulated in various packages. The most common packages are plastic and cerdip. Plastic packages are widely used in many different types of equipment. Cerdip packaging is especially suitable in equipment


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    Sample and Hold Amplifiers

    Abstract: HA4-5330 HA4-5330/883
    Text: Selection Guide SAMPLE AND HOLD AMPLIFIERS : Typical Values at 25°C, Unless Otherwise Specified TEMP. RANGE °C LEAD COUNT AND PACKAGE TYPE ACQUISITION TIME (TO 0.01%) -55 to 125 14 CERDIP 3.2ns 10mV 30ns 2.5MHz (CH = 1000pF) HA1-2425-5 0 to 75 14 CERDIP


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    PDF HA1-2425-5 HA3-2425-5 HA4P2425-5 HA9P2425-5 HA1-5320-2 HA1-5320-5 HA1-5320/883 HA3-5320-5 HA4-5320/883 HA9P5320-5 Sample and Hold Amplifiers HA4-5330 HA4-5330/883

    H bridge

    Abstract: ip2m12d 8 PIN DIP
    Text: lili itti lili Sem elab Power Management Division MOTOR CONTROL ICs Type Num ber Description Temp. Range Package IP1M12J 100mA Dual H Bridge -5 5 °C to 125°C 14 Pin CERDIP IP2M12J 100mA Dual H Bridge -4 0 °C to 85°C 14 Pin CERDIP IP2M12N 100mA Dual H Bridge


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    PDF IP1M12J IP2M12J IP2M12N IP2M12D IP3M12J IP3M12N IP3M12D 100mA H bridge 8 PIN DIP

    tsc 429

    Abstract: TSC429 l046 SG1526 teledyne tsc
    Text: OM429MJ SINGLE CMOS POWER MOSFET DRIVER I ft ft « 800 MW, 25 nsec High Speed Single CMOS Power MOSFET Driver In CerDIP Package i i FEATURES • • • • • • • CerDIP 8-Pin Package Wide Operating Voltage Range 7 V to 1 8V TTL/CMOS Input Compatible


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    PDF OM429MJ OM429MJ tsc 429 TSC429 l046 SG1526 teledyne tsc