CHAPTER 2 PACKAGE MATERIALS Search Results
CHAPTER 2 PACKAGE MATERIALS Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | |||
TPH2R408QM |
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MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance | |||
XPH2R106NC |
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N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) | |||
XPH3R206NC |
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N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) | |||
TPH4R008QM |
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MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) |
CHAPTER 2 PACKAGE MATERIALS Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
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D2863-77, CDA 194 jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108 | |
NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
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C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B | |
nec microcomputer
Abstract: PG-FP3 ID78K0 ID78K4 IE-78001-R-A IE-784000-R V830
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78K/IV 78K/0 78K/0S 78K/III 75X/75XL nec microcomputer PG-FP3 ID78K0 ID78K4 IE-78001-R-A IE-784000-R V830 | |
12x12 bga thermal resistance
Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
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UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB | |
Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
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CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping | |
OC-106 94V0 C
Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
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CH05WIP 300oC OC-106 94V0 C olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t | |
kic 125
Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
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CH04WIP kic 125 ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES | |
BGA 328
Abstract: No abstract text available
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44-Lead 48-Lead 80-Lead BGA 328 | |
TLC 1050
Abstract: FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008
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56-Lead 25917b TLC 1050 FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008 | |
Chapter 2 Package Materials
Abstract: for movement device spansion datecode
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f29239 Chapter 2 Package Materials for movement device spansion datecode | |
Untitled
Abstract: No abstract text available
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GL831A GL831A 64pin GL831A-MSGxx 64-pin | |
gl823
Abstract: GL823-OGG
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GL823 GL823 GL823-HGGXX GL823-OGG | |
Memory Stick pro duo pinouts
Abstract: memory stick pro duo pin datasheet Memory Stick pinouts 93C46 93C46 IC GL817 IC 93c46 Memory Stick Micro SD Card and MMC Reader pro duo card
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GL817E GL817E 48-pin Memory Stick pro duo pinouts memory stick pro duo pin datasheet Memory Stick pinouts 93C46 93C46 IC GL817 IC 93c46 Memory Stick Micro SD Card and MMC Reader pro duo card | |
93C46 IC
Abstract: Genesys Logic Memory Stick pro duo pinouts Memory Stick pinouts IC 93c46 93C46 CRC16 GL817E LQFP-48 LQFP-64
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GL817E GL817E 48-pin 93C46 IC Genesys Logic Memory Stick pro duo pinouts Memory Stick pinouts IC 93c46 93C46 CRC16 LQFP-48 LQFP-64 | |
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Untitled
Abstract: No abstract text available
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GL817E GL817E 48-pin | |
eeprom 93c46
Abstract: micro sd interface with 8051 with circuit CIRCUIT DIAGRAM OF MICRO SD MMC Genesys Logic GL828-MNG 93C46 CRC16 GL828 GL828-PNG LQFP48
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GL828 GL828 PARTI28 GL828-MNG 48-pin GL828-PNG eeprom 93c46 micro sd interface with 8051 with circuit CIRCUIT DIAGRAM OF MICRO SD MMC Genesys Logic GL828-MNG 93C46 CRC16 GL828-PNG LQFP48 | |
Untitled
Abstract: No abstract text available
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
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Untitled
Abstract: No abstract text available
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GL817E GL817E 48-pin | |
Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
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and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 | |
microSD card reader circuit diagram
Abstract: LQFP Package 128-pin
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GL826 GL826 64pin 48pin GL826-MXGxx 128-pin GL826-MSGxx 64-pin microSD card reader circuit diagram LQFP Package 128-pin | |
microSD card reader circuit diagram
Abstract: GL826
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GL826 GL826 128pin 48pin GL826-MXG 128-pin GL826-MNG 48-pin microSD card reader circuit diagram | |
Untitled
Abstract: No abstract text available
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GL816E GL816E 128-pin | |
8052 microcontroller
Abstract: 12M he crystal genesys 8052 and usb 8052 basic 100-PIN 48-PIN AVDD33 GL861 GPIO14
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GL861 GL861 100-pin 48-pin 8052 microcontroller 12M he crystal genesys 8052 and usb 8052 basic AVDD33 GPIO14 |