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    CHIP FUSE 3A Search Results

    CHIP FUSE 3A Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CHIP FUSE 3A Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Thin Film Chip Fuse 1. Scope This specification applies for the thin film chip fuse 2. Construction Over Coat Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating 3. Type Designation MF 06 050 T 32V 2 Chip Fuse Size 0603 Rated Current 050: 0.5A


    Original     		MF06-050T32V MF06-075T32V MF06-100T32V MF06-125T32V MF06-150T32V MF06-200T32V MF06-250T32V MF06-30 PDF

    CQ06PF

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		CQ06PF 55mmx 63VDC 63VAC. CQ06PF PDF

    Untitled

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 High Inrush Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		CQ06PT 55mmx 63VDC 63VAC. CQ06PT PDF

    CQ06PT

    Abstract: CQ06PT004
    Text: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		CQ06PT 55mmx 63VDC 63VAC. CQ06PT CQ06PT004 PDF

    Untitled

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &


    Original     		CQ06PF 55mmx 63VDC 63VAC. CQ06PF PDF

    smd fuse marking code 20

    Abstract: No abstract text available
    Text: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCP-XXOS006H 5K/10K) smd fuse marking code 20 PDF

    smd fuse marking code J

    Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
    Text: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCFS-XXOS004H 5K/10K) CFS04 CFS06 CFS12 CFS0402 CFS0603 smd fuse marking code J 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating


    Original     		TCFS-XX0S004I 5K/10K) CFS0402 CFS0603 CFS1206 PDF

    smd fuse marking 20

    Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
    Text: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCF-04OS029E CF04V CF0402 smd fuse marking 20 fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c PDF

    CF06V2T2R50

    Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
    Text: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element


    Original     		TCF-06OS030E CF06V CF0603 CF06V2T2R50 CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63 PDF

    1 smd fuse marking code 32

    Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
    Text: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate


    Original     		TCFS-12OS051E CFS12V CFS1206 1 smd fuse marking code 32 cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T PDF

    fuse smd code N

    Abstract: smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p
    Text: Document No TCFS-04OS049E Lead Free Thin Film Chip Fuse 1. Issued date 2009/5/27 Page 1/15 Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate


    Original     		TCFS-04OS049E CFS04V CFS0402 fuse smd code N smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p PDF

    Untitled

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ12PT 3.1mmx 1.6mm 1206 Slow Blow Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating


    Original     		CQ12PT 63VDC 63VAC. CQ12PT PDF

    AT350V

    Abstract: MIL-STD-202G CQ24PF
    Text: P TYPE CHIP FUSE Type CQ24PF 6.1mmx 2.6mm 2410 Fast-Acting Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating


    Original     		CQ24PF A-12A 350VAC 350VDC. CQ24PF AT350V MIL-STD-202G PDF

    Untitled

    Abstract: No abstract text available
    Text: P TYPE CHIP FUSE Type CQ12PF 3.1mmx 1.6mm 1206 Fast-Acting Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating


    Original     		CQ12PF 63VDC 63VAC. CQ12PF PDF

    1R50

    Abstract: No abstract text available
    Text: Surface Mount Typed Fuse Circuit Protector Micro Chip Fuse Industry/Field: AV, OA / Information, Mobile communication, Amusement New entry, Business magnification Small surface typed fuse with sharp fusing characteristics • Development Target: Small surface typed safety device for information


    Original     		PDF

    FERRITE TRANSFORMER 20khz toroid

    Abstract: ctx 300v buss fusetron mdl EI transformer core power ratings X1 CTX 0402ESDA-MLP 0603ESDA-MLP7 datasheets FERRITE TRANSFORMER 20khz toroid 0603FA 0603ESDA-TR1
    Text: Power Stor www.cooperbussmann.com ® OvercurrentProt The Bussmann® Electronic Fuse family offers fail-safe circuit protection devices in SMD, Thru-Hole, and traditional Ferrule Fuse packages. BUSSMANN CHIP Fuses 0603FA & 3216FF Series Bussmann's patented Solid Matrix CHIP™ fuses provide


    Original     		0603FA 3216FF BUSSMA506 FERRITE TRANSFORMER 20khz toroid ctx 300v buss fusetron mdl EI transformer core power ratings X1 CTX 0402ESDA-MLP 0603ESDA-MLP7 datasheets FERRITE TRANSFORMER 20khz toroid 0603FA 0603ESDA-TR1 PDF

    BUSS SR-5 T3.15A 250V

    Abstract: Buss SR-5 T2A 250v OC-106 94V0 C T2A 250v BUSS SS-5 OC106 BUSS SR-5 T1.25A 250V T4A 250V buss ss-5 oc103 94vo c T2A 250v BUSS T2A 250v SS-5
    Text: CIRCUIT PROTECTION Circuit Protection G r o u The Cooper Bussmann Electronic Fuse family offers fail-safe circuit protection devices in SMD, Thru-Hole, and traditional Ferrule Fuse p RoHS 2002/95/EC packages. CHIP Fuses 0603FA & 3216FF Series Cooper Bussmann's patented Solid Matrix CHIP™ fuses


    Original     		2002/95/EC 0603FA 3216FF OC-129 BUSS SR-5 T3.15A 250V Buss SR-5 T2A 250v OC-106 94V0 C T2A 250v BUSS SS-5 OC106 BUSS SR-5 T1.25A 250V T4A 250V buss ss-5 oc103 94vo c T2A 250v BUSS T2A 250v SS-5 PDF

    smd fuse IEC60127

    Abstract: Edison Fuse chip fuse 3A smd fuses GE SMD FUSE 52887 IEC60127-4 delay Fuses fuse L G FUSE SMD 0603
    Text: VISHAY BEYSCHLAG Resistive Products Tech Note TN0028 Chip Fuse Developments for Secondary Circuit Protection Surface-mount fuse links enable designers to implement circuit protection measures now obligatory in many electronic products. Next-generation fuses are combining


    Original     		TN0028 smd fuse IEC60127 Edison Fuse chip fuse 3A smd fuses GE SMD FUSE 52887 IEC60127-4 delay Fuses fuse L G FUSE SMD 0603 PDF

    2T transistor surface mount

    Abstract: diode Marking code A2 thermal fuse Littelfuse THERMAL Fuse 5a 2t transistor MIL-STD-202f K V 63 Marking 8A marking code 8A marking code diode 14
    Text: Next Previous Surface Mount Fuses Thin-Film Surface Mount SlimLine 1206 Very Fast-Acting Fuse 433 Series • The SlimLine 1206 fuse is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of


    Original     		MIL-STD-202F. 2T transistor surface mount diode Marking code A2 thermal fuse Littelfuse THERMAL Fuse 5a 2t transistor MIL-STD-202f K V 63 Marking 8A marking code 8A marking code diode 14 PDF

    marking H

    Abstract: No abstract text available
    Text: CERAMIC CHIP FUSE Type CQ12LT 3.1mmx 1.6mm 1206 Slow Blow Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof


    Original     		CQ12LT CQ12LT marking H PDF

    Untitled

    Abstract: No abstract text available
    Text: CERAMIC CHIP FUSE Type CQ06LT 1.6mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof


    Original     		CQ06LT CQ06LT PDF

    Untitled

    Abstract: No abstract text available
    Text: CERAMIC CHIP FUSE Type CQ06LF 1.6mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof


    Original     		CQ06LF CQ06LF PDF

    IEC 60127-1

    Abstract: 1206F SMD code mfu 1 smd fuse marking code cv SMD fuse x 153 MFU0402 MFU04
    Text: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering


    Original     		18-Jul-08 IEC 60127-1 1206F SMD code mfu 1 smd fuse marking code cv SMD fuse x 153 MFU0402 MFU04 PDF