Untitled
Abstract: No abstract text available
Text: WS57C71C MILITARY HIGH SPEED 32K x 8 CMOS PROM/RPROM KEY FEATURES • Ultra-Fast Access Time • Immune to Latch-UP — Up to 200 mA — 45 ns • ESD Protection Exceeds 2000V • Available in 300 and 600 Mil DIP and CLLCC • Low Power Consumption • Fast Programming
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OCR Scan
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WS57C71C
MIL-STD-883C
MIL-STD-883C
WS57C71C-45TMB
WS57C71C-55CMB
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PDF
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WS27C210L-15
Abstract: No abstract text available
Text: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES • JEDEC Standard Pin Configuration Ultra-High Performance — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) — 120 ns Access Time DESC SMD No. 5962-86805
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OCR Scan
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WS27C210L
WS27C210L
MIL-STD-883C
MIL-STD-883C
WS27C210L-15
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C64F MILITARY 8K x 8 CMOS EPROM KEY FEATURES • Fast Access Time • EPI Processing — 70 ns — Latch-Up Immunity Up to 200 mA • Low Power Consumption • Fast Programming •D E S C S M D N o. 8510207 • Standard EPROM Pinout • Available in CERDIP and CLLCC
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OCR Scan
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WS57C64F
WS57C64F
WS57C64F-70CMB*
MIL-STD-883C
WS57C64F-70DMB*
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C64F MILITARY 8K x 8 CMOS EPROM KEY FEATURES • Fast Access Time • EPI Processing — 70 ns — Latch-Up Immunity Up to 200 mA • Low Power Consumption • Fast Programming •DESC SMD No. 8510207 • Standard EPROM Pinout • Available in CERDIP and CLLCC
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OCR Scan
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WS57C64F
S57C64F
WS57C64F-70
WS57C64F
MIL-STD-883C
MIL-STD-883C
WS57C64F-70CMB*
WS57C64F-70DMB*
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PDF
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Untitled
Abstract: No abstract text available
Text: WS27C256L Military 32Kx 8 CMOS EPROM KEY FEATURES • High Performance CMOS • Ceramic Leadless Chip Carrier CLLCC 120 ns Access Time EPI Processing • Fast Programming - • DESC SMD No. 5962-86063 — ESD Protection Exceeds 2000 Volts • 300 Mil DIP or Standard 600 Mil DIP
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OCR Scan
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WS27C256L
WS27C256L
cos200
MIL-STD-883C
MIL-STD-883C
WS27C256L-12CMB*
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PDF
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WS27C256L
Abstract: capacitor, 1000 microfarad and 35 volts WS27C256L-12 WS27C256L-12CMB WS27C256L-12DMB WS27C256L-12TMB WS27C256L-15 WS27C256L-15DMB WS27C256L-15TMB WS27C256L-20
Text: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • High Performance CMOS • Ceramic Leadless Chip Carrier CLLCC • EPI Processing — 120 ns Access Time • Fast Programming • DESC SMD No. 5962-86063 • 300 Mil DIP or Standard 600 Mil DIP — Latch-Up Immunity to 200 mA
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Original
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WS27C256L
WS27C256L
MIL-STD-883C
WS27C256L-12DMB*
WS27C256L-12TMB*
WS27C256L-15DMB*
WS27C256L-15TMB*
capacitor, 1000 microfarad and 35 volts
WS27C256L-12
WS27C256L-12CMB
WS27C256L-12DMB
WS27C256L-12TMB
WS27C256L-15
WS27C256L-15DMB
WS27C256L-15TMB
WS27C256L-20
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PDF
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CLDCC
Abstract: cllcc transistor smd j4 WS57C128FB WS57C256F "16k x 8"
Text: FAMILY OF HIGH PERFORMANCE CMOS EPROMs PART NUMBER PAGE NO. DENSITY SPEED ARCHITECTURE BITS (ns) WS57C128FB 3-7 128K 16K x 8 WS57C256F 3-13 256K 32K x 8 DRAWING NO. NO. OF PINS 35 –70 C2 D2 J4 L3 32 28 32 32 CLLCC CERDIP, 0.6" PLDCC CLDCC 35 –70 C2 D2
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Original
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WS57C128FB
WS57C256F
CLDCC
cllcc
transistor smd j4
WS57C128FB
WS57C256F
"16k x 8"
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PDF
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27c256l
Abstract: No abstract text available
Text: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • Ceramic Leadless Chip Carrier CLLCC • High Performance CMOS — 120 ns A ccess Tim e • EPI Processing * Fast Programming — Latch-U p Im m unity to 200 m A * DESC SMD No. 5962-86063 — ESD Protection E xceeds 2000 Volts
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OCR Scan
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WS27C256L
-883C
-883C
256L-15T
256L-20D
WS27C256L.
27c256l
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PDF
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CLDCC
Abstract: No abstract text available
Text: FAMILY OF HIGH PERFORMANCE CMOS EPROMs PART NUMBER PAGE NO. DENSITY SPEED ARCHITECTURE BITS (ns) DRAWING NO. NO. OF PINS PACKAGE WS57C64F 3-7 64K 8K X 8 55-70 C2 D2 J4 32 28 32 CLLCC CERDIP, 0.6" PLDCC WS57C128FB 3-13 128K 16K X 8 35-70 C2 D2 J4 L3 32 28
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OCR Scan
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WS57C64F
WS57C128FB
WS57C256F
WS57C010F
1024K
CLDCC
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C71C MILITARY HIGH SPEED 32K x 8 CMOS PROM/RPROM KEY FEATURES • Immune to Latch-UP • Ultra-Fast Access Time — Up to 200 mA — 45 ns • ESD Protection Exceeds 2000V • Available in 300 and 600 Mil DIP and CLLCC • Low Power Consumption • Fast Programming
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OCR Scan
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WS57C71C
MIL-STD-883C
MIL-STD-883C
WS57C71C-45TMB
S57C71C-55CMB
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PDF
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CERAMIC LEADLESS CHIP CARRIER
Abstract: No abstract text available
Text: Package Information Drawing C2 – 32-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 32 B e1 E3 E2 E D3 A D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.27 B Inches Min Max 3.30 0.095 0.130 2.03 0.050
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Original
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32-Pad
030195R6
CERAMIC LEADLESS CHIP CARRIER
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PDF
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S27C256
Abstract: No abstract text available
Text: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • High Performance CMOS • Ceramic Leadless Chip Carrier CLLCC — 120 ns Access Time • EPI Processing — Latch-Up Immunity to 200 mA • Fast Programming — ESD Protection Exceeds 2000 Volts • DESC SMD No. 5962-86063
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OCR Scan
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WS27C256L
S27C256L
MIL-STD-883C
WS27C256L-12DMB*
WS27C256L-12TMB*
WS27C256L-15DMB*
WS27C256L-15TMB*
S27C256
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PDF
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Untitled
Abstract: No abstract text available
Text: WS27C210L Military 64 K x 16 CMOS EPROM KEY FEATURES Ultra-High Performance JEDEC Standard Pin Configuration — 120 ns Access Time — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) DESC SMD No. 5962-86805
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OCR Scan
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WS27C210L
WS27C210L
WS27C210L-15LMB
WS27C210L-17CMB*
WS27C210L-17DMB*
MIL-STD-883C
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PDF
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smd code marking A8
Abstract: WS27C256L WS27C256L-12 WS27C256L-12CMB WS27C256L-12DMB WS27C256L-12TMB WS27C256L-15 WS27C256L-15DMB WS27C256L-15TMB WS27C256L-20
Text: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • High Performance CMOS • Ceramic Leadless Chip Carrier CLLCC • EPI Processing — 120 ns Access Time • Fast Programming • DESC SMD No. 5962-86063 • 300 Mil DIP or Standard 600 Mil DIP — Latch-Up Immunity to 200 mA
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Original
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WS27C256L
WS27C256L
MIL-STD-883C
WS27C256L-12DMB*
WS27C256L-12TMB*
WS27C256L-15DMB*
WS27C256L-15TMB*
smd code marking A8
WS27C256L-12
WS27C256L-12CMB
WS27C256L-12DMB
WS27C256L-12TMB
WS27C256L-15
WS27C256L-15DMB
WS27C256L-15TMB
WS27C256L-20
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PDF
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Untitled
Abstract: No abstract text available
Text: FAMILY OF HIGH PERFORMANCE CMOS EPROMs PART NUMBER PAGE NO. DENSITY SPEED ARCHITECTURE BITS (ns) DRAWING NO. NO. OF PINS PACKAGE WS57C64F 3-19 64 K 8K X 8 5 5 -7 0 C2 D2 J4 32 28 32 CLLCC CERDIP, 0.6" PLDCC WS57C128FB 3-25 128K 16K X 8 3 5 -7 0 C2 D2 J4
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OCR Scan
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WS57C64F
WS57C128FB
WS57C256F
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C64F MILITARY 8K x 8 CMOS EPROM KEY FEATURES • Fast Access Time • EPI Processing — 70 ns — Latch-Up Immunity Up to 200 mA • Low Power Consumption • Fast Programming • DESC SMD No. 8510207 • Standard EPROM Pinout • Available in CERDIP and CLLCC
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OCR Scan
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WS57C64F
WS57C64F
WS57C64F-70CMB*
WS57C64F-70DMB*
MIL-STD-883C
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PDF
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WS27C210L-15
Abstract: WS27C210L-15CMB
Text: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES • JEDEC Standard Pin Configuration Ultra-High Performance — 120 ns Access Time — 40 Pin CERDIP Package DESC SMD No. 5962-86805 EPI Processing — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC)
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OCR Scan
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WS27C210L
S27C210L
MIL-STD-883C
MIL-STD-883C
WS27C210L-12CMB*
WS27C210L-15
WS27C210L-15CMB
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PDF
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EB 203 D
Abstract: CERAMIC LEADLESS CHIP CARRIER
Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054
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Original
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28-Pad
030195R7
EB 203 D
CERAMIC LEADLESS CHIP CARRIER
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PDF
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C2625
Abstract: a5 z smd
Text: WS57C64F MILITARY 8K x 8 CMOS EPROM KEY FEATURES • Fast Access Time • EPI Processing — 70 ns — Latch-Up Immunity Up to 200 mA • Low Power Consumption • Fast Programming • DESC SMD No. 8510207 • Standard EPROM Pinout • Available in CERDIP and CLLCC
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OCR Scan
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WS57C64F
WS57C64F-70
WS57C64F
MIL-STD-883C
MIL-STD-883C
WS57C64F-70CMB*
WS57C64F-70DMB*
C2625
a5 z smd
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PDF
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CERAMIC LEADLESS CHIP CARRIER
Abstract: 28-Pad
Text: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054
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Original
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28-Pad
030195R0
CERAMIC LEADLESS CHIP CARRIER
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PDF
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S27C256
Abstract: No abstract text available
Text: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • Ceramic Leadless Chip Carrier CLLCC • High Performance CMOS — 120 ns Access Time • EPI Processing • Fast Programming — Latch-Up Immunity to 200 mA • DESC SMD No. 5962-86063 — ESD Protection Exceeds 2000 Volts
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OCR Scan
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WS27C256L
WS27C256L
MIL-STD-883C
MIL-STD-883C
WS27C256L-12CMB*
WS27C256L-12DMB*
S27C256
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C64F MILITARY 8K x 8 CMOS EPROM KEY FEATURES • Fast Access Time • EPI Processing — 70 ns — Latch-Up Immunity Up to 200 mA • Low Power Consumption • Fast Programming • DESC SMD No. 8510207 • Standard EPROM Pinout • Available In CERDIP and CLLCC
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OCR Scan
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WS57C64F
S57C64F
WS57C64F-70
WS57C64F
MIL-STD-883C
MIL-STD-883C
S57C64F-70CMB*
S57C64F-70DMB*
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PDF
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Untitled
Abstract: No abstract text available
Text: WS57C71C MILITARY HIGH SPEED 32K x 8 CMOS PROM/RPROM KEY FEATURES • Ultra-Fast Access Time • Immune to Latch-UP — Up to 200 mA — 45 ns • ESD Protection Exceeds 2000V • Available in 300 and 600 Mil DIP and CLLCC • Low Power Consumption • Fast Programming
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OCR Scan
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WS57C71C
WS57C71C
WS57C71C-45TMB
MIL-STD-883C
WS57C71C-55CMB
WS57C71C-55DMB
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PDF
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Untitled
Abstract: No abstract text available
Text: WS27C210L Military 64K x 16 CMOS EPROM KEY FEATURES Ultra-High Performance • JEDEC Standard Pin Configuration — 120 ns Access Time — 40 Pin CERDIP Package — 44 Pin Leadless Chip Carrier CLLCC — 44 Pin Leaded Chip Carrier (CLDCC) DESC SMD No. 5962-86805
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OCR Scan
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WS27C210L
WS27C210L
lowC210L-15DMB*
MIL-STD-883C
WS27C210L-15LMB
WS27C210L-17CMB*
WS27C210L-17DMB*
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PDF
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