CQFJ
Abstract: CSOIC hbm 216 LA 7652 PE9354 PE97042 PE9701 PE9309 PE95420 PE9601
Text: High-Reliability Products May 2010 Peregrine’s High-Reliability UltraCMOS RF IC Portfolio Expands TM New SPDT Switch, Ultra-low Phase Noise PLLs, DSA and Prescalers Lead the Industry Peregrine Semiconductor’s recent advancements on UltraCMOS silicon-on-sapphire technology have enabled
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Tower10B-6
CQFJ
CSOIC
hbm 216
LA 7652
PE9354
PE97042
PE9701
PE9309
PE95420
PE9601
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QFN 4x4 mm 20L
Abstract: QUALCOMM QFN CQFJ qualcomm temperature spec rf spdt mhz dbm PE9308 CQFj 44 GSM qualcomm PE3336 PE3341
Text: 2007 Second Edition Product Selection Guide Changing how you design RF. Forever. Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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product-3940
10B-6
QFN 4x4 mm 20L
QUALCOMM QFN
CQFJ
qualcomm temperature spec
rf spdt mhz dbm
PE9308
CQFj 44
GSM qualcomm
PE3336
PE3341
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PE42692
Abstract: F QFN 3X3 PE42xx SPDT stacked FET PE42552 03 07 qfn 3x3 flip flap PE3336 PE3341 PE4230
Text: 2009 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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high-re3940
10B-6
PE42692
F QFN 3X3
PE42xx
SPDT stacked FET
PE42552
03 07 qfn 3x3
flip flap
PE3336
PE3341
PE4230
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Untitled
Abstract: No abstract text available
Text: Product Specification PE83336 3000 MHz UltraCMOS Integer-N PLL For Low Phase Noise Applications Military Operating Temperature Range Product Description Peregrine’s PE83336 is a high performance integer-N PLL capable of frequency synthesis up to 3.0 GHz. The superior
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PE83336
PE83336
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Untitled
Abstract: No abstract text available
Text: Product Specification PE83336 3000 MHz UltraCMOS Integer-N PLL For Low Phase Noise Applications Military Operating Temperature Range Product Description Peregrine’s PE83336 is a high performance integer-N PLL capable of frequency synthesis up to 3.0 GHz. The superior
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PE83336
PE83336
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PE33632
Abstract: PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694
Text: 2010 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS : The Green RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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and940
10B-6
PE33632
PE33362
PE33632 die
pe33382
PE42692
PE33362 die
PE42510A1
PE4340
PE33631
PE42694
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qualcomm 7500
Abstract: rf spdt mhz dbm 32 pins qfn 5x5 footprint E k m QFN 3X3 F QFN 3X3 PE42692 QUALCOMM Reference design QUALCOMM QFN GSM qualcomm PE3336
Text: 2008 Product Selection Guide Changing how you design RF. Forever. Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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10B-6
qualcomm 7500
rf spdt mhz dbm
32 pins qfn 5x5 footprint
E k m QFN 3X3
F QFN 3X3
PE42692
QUALCOMM Reference design
QUALCOMM QFN
GSM qualcomm
PE3336
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CQFj 44
Abstract: PE83336
Text: Product Specification PE83336 3000 MHz UltraCMOS Integer-N PLL For Low Phase Noise Applications Military Operating Temperature Range Product Description Peregrine’s PE83336 is a high performance integer-N PLL capable of frequency synthesis up to 3.0 GHz. The superior
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PE83336
PE83336
PE3336
CQFj 44
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Untitled
Abstract: No abstract text available
Text: Product Specification PE83336 3000 MHz UltraCMOS Integer-N PLL For Low Phase Noise Applications Military Operating Temperature Range Product Description Peregrine’s PE83336 is a high performance integer-N PLL capable of frequency synthesis up to 3.0 GHz. The superior
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PE83336
PE83336
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Untitled
Abstract: No abstract text available
Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE ADVANCED* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as
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WS1M32V-XG3X
1Mx32
WS1M32V-XG3X
512Kx32,
2Mx16
I/O31
I/O30
I/O29
I/O28
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WS1M32V-XG3X
Abstract: No abstract text available
Text: WS1M32V-XG3X White Electronic Designs PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O31
I/O30
I/O29
I/O28
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3d plus
Abstract: CQFJ 84 A12 marking airborn CQFJ 3DSD1280-323H 3D marking
Text: PRELIMINARY 1.28 Gbit SDRAM ELECTRONICS 3DSD1280-323H 1.28 GBit Synchronous DRAM - Hermetic package Features General Description Organized as 40M x 32-bit. Single +3.3V ±0.3V power supply Two stacks of ten 64 MBit SDRAM mounted on ceramic hermetic package
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3DSD1280-323H
32-bit.
100nF
MIL-STD-883D
/883D-S
3DSD1280-323H/PROTO
3DSD1280-323H/883D-S
F-78532
3DFP-0008
3d plus
CQFJ 84
A12 marking
airborn
CQFJ
3DSD1280-323H
3D marking
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WS1M32V-XG3X
Abstract: No abstract text available
Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES n Access Times of 17, 20, 25ns n 3.3 Volt Power Supply n 84 lead, 28mm CQFP, Package 511 n Low Power CMOS n Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O31
I/O30
I/O29
I/O28
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511S
Abstract: WS1M32-XG3X ah55
Text: WS1M32-XG3X 1Mx32 SRAM MODULE PRELIMINARY* FEATURES • Access Time of 70, 85, 100, 120ns ■ TTL Compatible Inputs and Outputs ■ 84 lead, 28mm CQFP, Package 511 ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8
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WS1M32-XG3X
1Mx32
120ns
512Kx32,
1Mx16
I/O31
I/O30
I/O29
I/O28
511S
WS1M32-XG3X
ah55
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WS1M32V-XG3X
Abstract: No abstract text available
Text: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O31
I/O30
I/O29
I/O28
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WS1M32-XG3X
Abstract: No abstract text available
Text: White Electronic Designs WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns Low Power CMOS Packaging Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight • 84 lead, 28mm CQFP, Package 511 Organized as two banks of 512Kx32, User
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WS1M32-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32-XG3X
I/O31
I/O30
I/O29
I/O28
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WS1M32-XG3X
Abstract: No abstract text available
Text: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as
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WS1M32-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32-XG3X
I/O31
I/O30
I/O29
I/O28
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WS1M32V-XG3X
Abstract: No abstract text available
Text: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O31
I/O30
I/O29
I/O28
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Untitled
Abstract: No abstract text available
Text: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O0-31
A0-18
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WS1M32-XG3X
Abstract: No abstract text available
Text: White Electronic Designs WS1M32-XG3X PRELIMINARY* 1Mx32 SRAM MODULE FEATURES Access Time of 70, 85, 100, 120ns 5V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8 Weight - WS1M32-XG3X - 20 grams typical
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WS1M32-XG3X
1Mx32
120ns
512Kx32,
1Mx16
WS1M32-XG3X
I/O31
I/O30
I/O29
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Untitled
Abstract: No abstract text available
Text: WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8
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WS1M32V-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32V-XG3X
I/O0-31
A0-18
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Untitled
Abstract: No abstract text available
Text: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES Access Times of 17, 20, 25ns 5V Power Supply Packaging Low Power CMOS Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 84 lead, 28mm CQFP, Package 511
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WS1M32-XG3X
1Mx32
512Kx32,
2Mx16
WS1M32-XG3X
I/O0-31
A0-18
I/O31
I/O30
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Untitled
Abstract: No abstract text available
Text: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES Access Time of 70, 85, 100, 120ns 5V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8 Weight - WS1M32-XG3X - 20 grams typical
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WS1M32-XG3X
1Mx32
120ns
512Kx32,
1Mx16
WS1M32-XG3X
I/O0-31
A0-18
I/O31
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WS1M32-XG3X PRELIMINARY* 1Mx32 SRAM MODULE FEATURES Access Time of 70, 85, 100, 120ns 5V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8 Weight - WS1M32-XG3X - 20 grams typical
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1Mx32
120ns
512Kx32,
1Mx16
WS1M32-XG3X
WS1M32-XG3X
I/O31
I/O30
I/O29
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