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    Untitled

    Abstract: No abstract text available
    Text: High Power Infrared Ceramic Chip CR50IRH Features End to End Side to Side Stackable Down to a Pitch of 1.3mm High Power Thermal Absorbtion Solder Pads Conform to Mil−Std 883B Solid State Ceramic Chip Superior Light Uniformity Over 180° Surface Mount Device


    Original     		CR50IRH CR50IRH PDF

    Untitled

    Abstract: No abstract text available
    Text: High Power Infrared Ceramic Chip CR50IRH Features End to End Side to Side Stackable Down to a Pitch of 1.3mm High Power Thermal Absorbtion Solder Pads Conform to Mil−Std 883B Solid State Ceramic Chip Superior Light Uniformity Over 180° Surface Mount Device


    Original     		CR50IRH CR50IRH PDF