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    CSP24 Search Results

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    CSP24 Price and Stock

    Espros Photonics EPC611-CSP24-001

    IC TIME-OF-FLIGHT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey EPC611-CSP24-001 Reel 4,000 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $7.49925
    • 10000 $7.49925
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    CIT Relay & Switch A21CSP24VDC1.6R

    RELAY AUTOMOTIVE SPDT 40A 24V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A21CSP24VDC1.6R Tray 650 1
    • 1 $2.71
    • 10 $2.71
    • 100 $2.09388
    • 1000 $1.80951
    • 10000 $1.64431
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    CIT Relay & Switch A11CSP24VDC1.5D

    RELAY AUTOMOTIVE SPDT 30A 24V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A11CSP24VDC1.5D Tube 500 1
    • 1 $2.57
    • 10 $2.409
    • 100 $1.9271
    • 1000 $1.49884
    • 10000 $1.44531
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    CIT Relay & Switch A2H1CSP24VDC1.6D

    RELAY AUTOMOTIVE SPDT 50A 24V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A2H1CSP24VDC1.6D Tray 409 1
    • 1 $2.85
    • 10 $2.85
    • 100 $2.20313
    • 1000 $1.904
    • 10000 $1.73018
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    CIT Relay & Switch A3K1CSP24VDC1.6R

    RELAY AUTOMOTIVE SPDT 150A 24V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A3K1CSP24VDC1.6R Tray 320 1
    • 1 $9.57
    • 10 $9.57
    • 100 $7.18113
    • 1000 $5.5853
    • 10000 $5.5853
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    CSP24 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CSP240-01TG Advanced Interconnections 240 POS MOLDED PGA SOCKET Original PDF

    CSP24 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    6417727F

    Abstract: Hitachi LsC 7500 dmx led pixel HD6417727F160C 6417727BP HD6417727F100C asem cpu 702 st7550 abb cs 400 HD6417727F160B
    Text: REJ09B0254-0500 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 32 SH7727 Group Hardware Manual


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    PDF REJ09B0254-0500 SH7727 32-Bit Family/SH7700 SH7727 HD6417727 6417727F Hitachi LsC 7500 dmx led pixel HD6417727F160C 6417727BP HD6417727F100C asem cpu 702 st7550 abb cs 400 HD6417727F160B

    SH7290

    Abstract: Hitachi DSA00380
    Text: SuperH Family E10A Emulator Additional Document for User’s Manual SH7290 E10A HS7290KCM02HE Renesas Microcomputer Development Environment System SuperH Family / SH7200 Series Specific Guide for the SH7290 E10A Emulator Rev.1.00 2003.7.3 Cautions Keep safety first in your circuit designs!


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    PDF SH7290 HS7290KCM02HE SH7200 SH7290: 20-MHz 87-MHz REJ10B0012-0100H Hitachi DSA00380

    LQFP216

    Abstract: 26 pins connector LQFP-216 CSP-240 HQFP256
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF 14-pin LQFP216 26 pins connector LQFP-216 CSP-240 HQFP256

    Untitled

    Abstract: No abstract text available
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003.


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    PDF SH7727

    HP4352B

    Abstract: cdi schematics pcb LMX2470 dc cdi schematic diagram ECHU1C154MA5 CDI Y100 HP8563 VCO varil HP8563E VCO191-2450U
    Text: LMX2470SLE Evaluation Board Operating Instructions National Semiconductor Corporation Wireless Communications, RF Products Group 2900 Semiconductor Dr. M/S D3500 Santa Clara, CA, 95052-8090 LMX2470SLEFPEBI Rev 02.22.2004 L M X 2 4 7 0 E V A L U A T I O N B O A R D


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    PDF LMX2470SLE D3500 LMX2470SLEFPEBI HP4352B cdi schematics pcb LMX2470 dc cdi schematic diagram ECHU1C154MA5 CDI Y100 HP8563 VCO varil HP8563E VCO191-2450U

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    PDF

    6417727F

    Abstract: HD6417727F160CV 6417727BP HD6417727F160 HD6417727F100CV HD6417727F100 HD6417727 HQFP-3232-240 HD6417727F160C HD6417727BP160cv
    Text: date: 2003/05/13 RENESAS TECHNICAL UPDATE Classification of Production No MPU&MCU SH7727 Logic limitation Fix and Part No. Update C-Mask version THEME Classification of Information 1. 2. 3. 4. 5. TN-SH7-481A/E HD6417727 All term of validity Reference Documents


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    PDF SH7727 TN-SH7-481A/E HD6417727 ADE-602-209C HD6417727C, HD6417727 HD6417727B. HD6417727B 6417727F HD6417727F160CV 6417727BP HD6417727F160 HD6417727F100CV HD6417727F100 HQFP-3232-240 HD6417727F160C HD6417727BP160cv

    7133 A-1

    Abstract: varil vco190 varil D3500 LMX2471 VCO190-1650T VCO varil
    Text: LMX2471SLE Evaluation Board Operating Instructions National Semiconductor Corporation Wireless Communications, RF Products Group 2900 Semiconductor Dr. M/S D3500 Santa Clara, CA, 95052-8090 LMX2471SLEFPEBI Rev 02.22.2004 Table of Contents GENERAL


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    PDF LMX2471SLE D3500 LMX2471SLEFPEBI 1318000GHz 30sec 10dB/ 3002000GHz 1202000GHz 7133 A-1 varil vco190 varil D3500 LMX2471 VCO190-1650T VCO varil

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    PDF

    tlo82

    Abstract: TLO82 datasheet lm147 lm117 3.3V JM38510/10901BGA TLO82 application lm723 LM338 model SPICE LM723 pin details lm842
    Text: Worldwide Sales Offices Linear/Mixed-Signal Designer’s Guide Winter 2002 FRANCE ITALY PRC SWEDEN National Semicondutores da América do Sul Ltda. World Trade Center Av. das Nações Unidas, 12.551 22nd Floor - cj. 2207 04578-903 Brooklyn São Paulo, SP Brasil


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    PDF I-20089 tlo82 TLO82 datasheet lm147 lm117 3.3V JM38510/10901BGA TLO82 application lm723 LM338 model SPICE LM723 pin details lm842

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    pj86

    Abstract: GP136 GP134 A1111P pj74 avk6 F66T18HC AP1616 C924B pj2016
    Text: To be used as guide only. User responsible for reviewing critical variables. Hoffman Part Number A10086CH A10086CHFL A10086CHNF A1008CH A1008CHFL A1008CHNF A1008CHNFSS A1008CHNFSS6 A1008CHS A1008LP A1008NF A1008NFAL A1008NFSS A1008SC A10106CH A10106CHFL A1066JFGQRPWR


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    PDF A10086CH A10086CHFL A10086CHNF A1008CH A1008CHFL A1008CHNF A1008CHNFSS A1008CHNFSS6 A1008CHS A1008LP pj86 GP136 GP134 A1111P pj74 avk6 F66T18HC AP1616 C924B pj2016

    A7260

    Abstract: pj86 pj74 diode cross reference A3020 A72XM6618FTC csd483610 A1008CHNFSS6 A1111P GP136
    Text: This Cross Reference is a guide only. Products may not be exactly the same and it is user’s responsibility to verify details for acceptable subsitution. Hammond is not responsibile for cross reference errors. Panel = Part No. Hammond Part No. A10086CH A10086CHFL


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    PDF A10086CH A10086CHFL A10086CHNF A1008CH A1008CHFL A1008CHNF A1008CHNFSS A1008CHNFSS6 A1008CHS A1008LP A7260 pj86 pj74 diode cross reference A3020 A72XM6618FTC csd483610 A1008CHNFSS6 A1111P GP136

    Untitled

    Abstract: No abstract text available
    Text: Hitachi SuperH RISC engine SH7727 Hardware Manual The revision list can be viewed directly by clicking the title page. ADE-602-209C Rev. 4.0 1/31/2003 Hitachi, Ltd. The revision list summarizes the locations of revisions and additions. Details should always


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    PDF SH7727 ADE-602-209C SH7727

    Untitled

    Abstract: No abstract text available
    Text: LMX2470SLE Evaluation Board Operating Instructions National Semiconductor Corporation Wireless Communications, RF Products Group 2900 Semiconductor Dr. M/S D3500 Santa Clara, CA, 95052-8090 LMX2470SLEFPEBI Rev 02.22.2004 L M X 2 4 7 0 E V A L U A T I O N B O A R D


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    PDF LMX2470SLE D3500 LMX2470SLEFPEBI

    a888 513

    Abstract: st7550 HD6417727F160 SH7727 UNIVERSAL ir remote decoder 6417727 DY-01 2014 year mitsubishi label 2013 year mitsubishi Label manual A5008
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF SH7727 a888 513 st7550 HD6417727F160 UNIVERSAL ir remote decoder 6417727 DY-01 2014 year mitsubishi label 2013 year mitsubishi Label manual A5008

    ABB Group

    Abstract: EPF6024AQC208 EPF6024AQC208-2 SH7290 SH7751 5225 hitachi J196
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    Rapa relay

    Abstract: st7550 HD6417727F160B transistor tt 2222 relay rapa 10 pin FRC connector abb variable frequency drive wiring diagram B12 IC marking code PAL 006A MD 202 flame relay
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF SH7727 Rapa relay st7550 HD6417727F160B transistor tt 2222 relay rapa 10 pin FRC connector abb variable frequency drive wiring diagram B12 IC marking code PAL 006A MD 202 flame relay

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    PDF

    LMX2332U

    Abstract: LMX1601 LMX2604 LMX2353 LMX2430 VCO 1.4 GHz LMX2470 LMX2502 LMX2505 LMX2515
    Text: New products PLLatinum family of PLL products Selection guide LMX2604 – New 4 mm x 4 mm x 0.75 mm LLP package reduces PCB area up to 83% over alternative solutions National Semiconductor provides a comprehensive set of support services. Product information, including


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    PDF LMX2604 LMX2505 LMX2515 LMX2525 LMX2512 LMX2532 LMX2542 PCS1900 LMX2332U LMX1601 LMX2604 LMX2353 LMX2430 VCO 1.4 GHz LMX2470 LMX2502 LMX2505 LMX2515

    12W Sot23

    Abstract: 12W SMD SOT23 12w sot-23 sot-23 12w TA 7698 AP Micro SOIC8 sot23 12W LM3500 FBGA-49 SOT23 M7
    Text: LM2796 a * f lM S t t n m * ä 6 = c a n iH ! àm m m m • t o j» i = s i s K m m m i £ 20 mA • m1 ENA & ENB > U l f i M M ä t # • f f a t m 3/2 « m s 2.7V M 5.5V • JJIt«r^ÄI«Ä(PWM)^ÄSf!|: • 100 Hz M 1 kHz i 8 ü m micro SMD 2.1 mm x 2.4 min x 0.6 mm


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    PDF lm2796 12W Sot23 12W SMD SOT23 12w sot-23 sot-23 12w TA 7698 AP Micro SOIC8 sot23 12W LM3500 FBGA-49 SOT23 M7

    CSP50

    Abstract: No abstract text available
    Text: Note: 1.Material: 1.1 Insulator: High temperature thermoplastic with g.f,UL94v-0 1.2 Contact: Copper alloy,t=0.25mm 1.3 Shell: Spcc,t=0.40mm,50P Front-shell t=0.60mm 2.Specification: 2.1 Current rating: 1 A Max. 2.2 Dielectric withstanding voltage: 750 V ac for 1 min.


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    PDF H99999HI9Â 99999HI9Â UL94v-0 CS-P-14 CS-P-24 CS-P-36 CS-P-50 CSP50

    LM50 sot23-5

    Abstract: LMS48 FPD87370 USBN9604 lmx2324 SSOP-EIAJ28 7I SOT23-3 STT150 DS92LV1021A fpd8737
    Text: 2005^ 4 ^ 1 m m jim m m t t * * * « it m * * m m m m m z m m m m z * . u tm u m h * * * » » |t f c g « M 2 -7 n ^ fts a » a « * ' Ä lttlÄ Ä B te ir a f e >m ' « « f t * X |I » J : TO m » • REID M U M ttA ' K ä U M U M ß U l Mtklrm •


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    PDF LM6181 Narrow-16, LM7171 CERPACK-10, LM7372 LMC6035 LM50 sot23-5 LMS48 FPD87370 USBN9604 lmx2324 SSOP-EIAJ28 7I SOT23-3 STT150 DS92LV1021A fpd8737

    asa 300f

    Abstract: A1t smd JD 1803 LMX2604 equivalent SMD-42 LLP-20 llp20 12W Sot23 smd A1T LM2502
    Text: ît S j w m m m m p l i t w LM2502 MPL S % M ¥ f& • 320 Mbps f t S ü & g & M & t t t t * • MPL f f f g J t (MPL-0) • è W ttW LVCMOS / MPL Î# & • : 16 i80 & m68 f t m ' RGB565 În ^ S tlltÊ '¿fcÉÔÏÏW ’ 10 nA • (C Si* Ä CS2*) • $£t§ S ?L W m p l SÂ ï& ffê


    OCR Scan
    PDF LM2502 -RGB565 LM25Q2 OT23-3 65Vto OT23-5 LMX2471 CSP-24 LMX2434 asa 300f A1t smd JD 1803 LMX2604 equivalent SMD-42 LLP-20 llp20 12W Sot23 smd A1T