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    HQFP256 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PRQP0256LA-B

    Abstract: d192
    Text: JEITA Package Code P-HQFP256-28x28-0.40 RENESAS Code PRQP0256LA-B Previous Code FP-256G/FP-256GV MASS[Typ.] 5.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 192 129 193 128 HE b1 Reference


    Original     		P-HQFP256-28x28-0 PRQP0256LA-B FP-256G/FP-256GV PRQP0256LA-B d192 PDF

    Untitled

    Abstract: No abstract text available
    Text: HQFP256-C-3636-0.50 Radiation fin Metal cap 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 アルミナ コバール Ni/Au (Au: ≥1.5µm) 24.5 TYP.


    Original     		HQFP256-C-3636-0 PDF

    Al2O3

    Abstract: HQFP256-C-3636-0 kovar
    Text: HQFP256-C-3636-0.50 Radiation fin Metal cap 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Ni/Au (Au: ≥1.5µm) 24.5 TYP.


    Original     		HQFP256-C-3636-0 Al2O3 kovar PDF

    HQFP256-P-2828-0

    Abstract: CA2E
    Text: 256P6K-E Plastic 256pin 28✕28mm body HQFP EIAJ Package Code HQFP256-P-2828-0.40 Weight g JEDEC Code – Under Planning HD D 256 Lead Material Cu Alloy 193 E HE 192 1 Symbol 64 129 128 65 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters


    Original     		256P6K-E 256pin HQFP256-P-2828-0 CA2E PDF

    pitch 0.4 QFP 256p

    Abstract: SH-432 TWT Wiring HQFP256 MB86290A MB86292 MB86293 MB86833 V832 Hitachi DSA0079
    Text: MB86293 <CORAL_LQ> Graphics Controller Specifications Revision 1.1 14th Jan, 2003 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED • The specifications in this manual are subject to change without notice. Department before purchasing the product described in this manual.


    Original     		MB86293 F256025S-c-2-3 pitch 0.4 QFP 256p SH-432 TWT Wiring HQFP256 MB86290A MB86292 MB86833 V832 Hitachi DSA0079 PDF

    LQFP216

    Abstract: 26 pins connector LQFP-216 CSP-240 HQFP256
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


    Original     		14-pin LQFP216 26 pins connector LQFP-216 CSP-240 HQFP256 PDF

    TFBGA208

    Abstract: aseram SH7706 SH7751 EPF10K20RC208-3 SHE10 lqfp-216
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


    Original     		PDF

    hitachi sh3

    Abstract: fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller
    Text: MICROCONTROLLER WORKSHOPS Graphic Controller 1 1 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com 1 PC graphics sets standards 2 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com


    Original     		30-Jan-01 hitachi sh3 fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    DG3 GI 428 diode

    Abstract: Fujitsu FP 410 diode dg3 gi 428 dg3 gi 428 m*86293 TWT Wiring HQFP256 MB86290A MB86292 MB86293
    Text: MB86293 <CORAL_LQ> Graphics Controller Specifications Revision 1.4a 19th April, 2004 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED <Notes> • The specifications in this manual are subject to change without notice. Contact our Sales Department before purchasing the product described in this manual.


    Original     		MB86293 DG3 GI 428 diode Fujitsu FP 410 diode dg3 gi 428 dg3 gi 428 m*86293 TWT Wiring HQFP256 MB86290A MB86292 PDF

    425M

    Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
    Text: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3


    Original     		P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240 PDF

    BSV 78 PHILIPS SEMICONDUCTOR

    Abstract: MB86294S 12AH, SC SF L3C analog L4W 74 MB86294 TWT Wiring HQFP256 MB86290A MB86292
    Text: MB86294/294S <CORAL_LB> Graphics Controller Specifications Revision 1.2 19th Apr, 2004 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED <Notes> • The specifications in this manual are subject to change without notice. Contact our Sales Department before purchasing the product described in this manual.


    Original     		MB86294/294S MB86294/294S BSV 78 PHILIPS SEMICONDUCTOR MB86294S 12AH, SC SF L3C analog L4W 74 MB86294 TWT Wiring HQFP256 MB86290A MB86292 PDF

    pitch 0.4 QFP 256p

    Abstract: L3C analog TWT Wiring HQFP256 MB86290A MB86292 MB86294 MB86294S MB86833 PBGA256
    Text: MB86294/294S <CORAL_LB> Graphics Controller Specifications Revision 1.0 31st Jan, 2003 Copyright FUJITSU LIMITED 2001 ALL RIGHTS RESERVED • The specifications in this manual are subject to change without notice. Department before purchasing the product described in this manual.


    Original     		MB86294/294S F256025S-c-2-3 pitch 0.4 QFP 256p L3C analog TWT Wiring HQFP256 MB86290A MB86292 MB86294 MB86294S MB86833 PBGA256 PDF

    TSOP 173 g

    Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
    Text: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4


    Original     		10sec QFP56-P-910-K SnPb9557030 JU-11T 30sec TSOP 173 g TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304 PDF

    koki solder paste

    Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY


    Original     		JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1 PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 PDF

    BLH alpha

    Abstract: Black and wite TV HQFP256 MB86290A MB86292 MB86833 V832 MRC D19 MB3516A 64-MBIT
    Text: MB86292< <ORCHID> > Graphics Controller Specifications Revision 0.10 Oct2003 Copyright FUJITSU LIMITED 1998, 1999 ALL RIGHTS RESERVED All Rights Reserved The information in this document has been carefully checked and is believed to be reliable. However, Fujitsu Limited assumes no responsibility for inaccuracies.


    Original     		Oct2003 BLH alpha Black and wite TV HQFP256 MB86290A MB86292 MB86833 V832 MRC D19 MB3516A 64-MBIT PDF