CT2102

Abstract: CT2101 CT-2101 MIL-STD-810C method 513.2 m431
Contextual Info: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead

Contextual Info: Low P rofile/S urface M ount C hip C arrier S ocket patented Features Methode has designed this PLCC socket to take full advantage of surface mount technology. The exclusive visible internal solder tails along with the use of quality high temperature materials assure compatibility with all

CT2102

Contextual Info: Low Profile/Surface Mount Chip Carrier Socket patented Features Materials Contact Material: Beryllium Copper Contact Plating: Tin/Lead over Nickel Insulator Material: Polyphenylene Sulfide, UL 94V-0 Operating Temperature: -50°C to +125°C

CT-2101

Abstract: CT2102 MIL-STD-810C Method 514.2 ct2101 MIL-STD-810C PLCC 44 socket layout plcc-68-at MO-052 ME-PLCC-44-AT
Contextual Info: Through Board Chip Carrier Socket Specifications Materials Contact Material: Phosphor Bronze Contact Plating: Tin/Lead over Nickel Insulator Material: PBT Operating Temperature: -65°C to +105°C Electrical Performance Contact Resistance: 20 milliohms maximum

CT2102

Contextual Info: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead