CTE TABLE FLIP CHIP SUBSTRATE Search Results

CTE TABLE FLIP CHIP SUBSTRATE Result Highlights (5)

Part	Manufacturer	Description
GCM188D70E226ME36D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for Automotive
GRM022C71A472KE19L	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM033C81A224KE01W	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155D70G475ME15D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155R61J334KE01D	Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose

CTE TABLE FLIP CHIP SUBSTRATE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
NATIONAL SEMICONDUCTOR ink MARKING Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as	Original		PDF
Altera Flip Chip BGA warpage Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD Text: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: kcchange@tsmc.com	Original		PDF
SPRU811 Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue	Original	SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate	PDF
Altera Flip Chip BGA warpage Abstract: cte table flip chip substrate 1806 footprint cte table epoxy substrate BGA cte cte table for epoxy adhesive and substrate with or without underfill bga warpage crack flip chip cte table epoxy Text: Reliability of Large Organic Flip-Chip Packages for Industrial Temperature Environments Anurag Bansal1, Yuan Li2, and Don Fritz2 1 Reliability Engineering Package Development Altera Corporation 101 Innovation Drive San Jose, CA 95134 abansal@altera.com 2 Abstract	Original		PDF
LGA voiding Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy Text: CLASP CERAMIC COLUMN GRID ARRAY TECHNOLOGY FOR FLIP CHIP CARRIERS S. Ray, M. Interrante, L. Achard * , M. Cole, I. DeSousa(), L. Jimarez, G. Martin, and C. Reynolds, IBM Microelectronics Division Hopewell Jct., NY () IBM Canada, Bromont, QUE Biography Sudipta Ray is a Senior Engineer in Interconnections	Original	67F4333, F52977, APD-SCC-201 LGA voiding CCGA IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy	PDF
LGA rework Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules	Original	AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework	PDF
WLCSP smt Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None	Original	AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition	PDF
A102 Abstract: A104 A110 AN-617 SHEAR MODULUS TESTING PATTERNS AN617 Text: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com MicroCSP Wafer Level Chip Scale Package by John Jackson and Alan O'Donnell DESCRIPTION OF THE PACKAGE TECHNOLOGY	Original	AN-617 E03272 A102 A104 A110 AN-617 SHEAR MODULUS TESTING PATTERNS AN617	PDF
solder paste alpha WS609 Abstract: WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga Text: Ceramic Ball Grid Array Surface Mount Assembly Application Note 1298 1. Package Description Ceramic Ball Grid Array CBGA is a custom platform supporting a wide variety of performance applications. This package uses flip chip as the first level interconnection and solder ball as the second level	Original	5988-6603EN solder paste alpha WS609 WS609 Alpha WS609 solder entek Cu-56 epoxy adhesive paste cte table Alpha WS609 ceramic rework solder paste WS609 Cu-56 cbga	PDF
underfill Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.	Original		PDF
IPC-6012 Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel	Original	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525	PDF
A102 Abstract: A104 A110 AN-617 Text: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel T : 781/329-4700 • Fax: 781/326-8703 • www.analog.com MicroCSP Wafer Level Chip Scale Package By John Jackson DESCRIPTION OF THE PACKAGE TECHNOLOGY MicroCSP is a wafer level chip scale package, the only	Original	AN-617 E03272 A102 A104 A110 AN-617	PDF
IPC-6011 Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222 Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications	Original	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222	PDF

JESD51-9 Abstract: Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC Text: AN-617 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com MicroCSP Wafer Level Chip Scale Package by John Jackson and Alan O’Donnell • GENERAL DESCRIPTION	Original	AN-617 EIA-481-C, AN03272-0-6/07 JESD51-9 Plastic Pin Grid Array UBM STD-20C WLCSP stencil design A102 A104 A110 AN-617 MO-211 outline of the heat sink for Theta JC	PDF
Untitled Abstract: No abstract text available Text: PLESSIEY SEMICONDUCTORS Appendix 7 ; CLA60000 SERIES CHANNELLESS CMOS GATE ARRAYS Supersedes December 1988 Edition This advanced family o f gate arrays uses many innovative techniques to achieve 110K gates pa r ch'p - system clock speeds in excess o f 70MHz are achievable. The combinatbn	OCR Scan	CLA60000 70MHz	PDF
LGA voiding Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal	Original	AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D	PDF
A7647 Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package	Original		PDF
74C926 Abstract: 74L04 pin out diagram of CD4027 74l74 CD4027 application note design a BCD counter using j-k flipflop cd4027 cd4025 74c926 equivalent CD4027 applications Text: MM1ER51L ICL8052/80 53 3V* Digit ICL8052A/8053A(4V2Digit) Precision Chip Pairs for A / D Conversion FEATURES • Accuracy high enough for ±40,000 count instruments • Priced low enough to compete with 3-1/2 digit DPM/DVM pairs • One basic circuit for an entire family of DVMs	OCR Scan	ICL8052/8053 ICL8052A/8053A ICL8052CPD ICL8052CDD ICL8052ACPD ICL8052ACDD ICL8053CPD MM74C926-4 ICL8052 ICL8068 74C926 74L04 pin out diagram of CD4027 74l74 CD4027 application note design a BCD counter using j-k flipflop cd4027 cd4025 74c926 equivalent CD4027 applications	PDF
MAX791 Abstract: MAX791CPE Text: 19-0075: Rev. 5; 7/95 y i/ i/ jx i/ i/ i M icroprocessor Supervisory Circuit ♦ Precision 4.65V Voltage Monitoring ♦ 200ms Power-OK/Reset Time Delay ♦ Independent Watchdog Timer— Preset or Adjustable ♦ 1pA Standby Current ♦ Power Switching 250mA Output in V c c Mode	OCR Scan	200ms 250mA MAX791CPE MAX791CSE AX791C Sfl7hb51 MAX791 MAX791CPE	PDF
IPC-6012 Abstract: reflow temperature bga laptop IPC 6012 micron tsop 48 PIN tray failure of heating element in hot air gun epoxy adhesive paste cte table PCB design for very fine pitch csp package Text: Mounting of Surface Mount Components Introduction Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics, have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers,	Original		PDF
footprint jedec MS-026 TQFP Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144 Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES	Original		PDF
16k x 8 ram Abstract: A12LC Text: ID T 7M 10 01 /3 D a t a B o o k B, S e c t i o n 8.4, P a g e 1 128K x 8 64K x 8 CMOS DUAL-PORT STATIC RAM MODULE PRELIMINARY IDT7M1001 IDT7M1003 FEATURES DESCRIPTION: • High density 1 M /512K CM OS dual-port static RAM module • Fast access times: — commercial - 25, 30, 35, 40, 50, 65ns	OCR Scan	/512K 64-pin IDT7M1001 IDT7M1003 1001/1D /64K01/1003 16k x 8 ram A12LC	PDF
circuit diagram of MOD 100 counter using ic 7490 Abstract: circuit diagram of MOD 8 counter using ic 7490 12 hour digital clock using 7490 ic 7490 pin diagram decade counter mod 8 ring counter using JK flip flop mod 5 ring counter using JK flip flop circuit diagram of MOD 12 counter using ic 7490 mod 4 ring counter using JK flip flop signetics SE180 4 bit gray code synchronous counter wiring diagram using jk Text: DESIGNING WITH MSI [ilVol.l COUNTERS AND SHIFT 1 DESIGNING WITH MSI VOL. I COUNTERS AND SHIFT REGISTERS W ritten by LES BR O C K C opyright 1970 Signetics C orporation TABLE OF CONTENTS SECTION I II T IT L E PAGE AN IN T R O D U C T IO N TO D ES IG N IN G W ITH M S I .	OCR Scan	MSI0041 1950M circuit diagram of MOD 100 counter using ic 7490 circuit diagram of MOD 8 counter using ic 7490 12 hour digital clock using 7490 ic 7490 pin diagram decade counter mod 8 ring counter using JK flip flop mod 5 ring counter using JK flip flop circuit diagram of MOD 12 counter using ic 7490 mod 4 ring counter using JK flip flop signetics SE180 4 bit gray code synchronous counter wiring diagram using jk	PDF

CTE TABLE FLIP CHIP SUBSTRATE Search Results

CTE TABLE FLIP CHIP SUBSTRATE Result Highlights (5)

CTE TABLE FLIP CHIP SUBSTRATE Datasheets Context Search

underfill

NATIONAL SEMICONDUCTOR ink MARKING

Altera Flip Chip BGA warpage

SPRU811

Altera Flip Chip BGA warpage

LGA voiding

LGA rework

WLCSP smt

A102

solder paste alpha WS609

underfill

IPC-6012

A102

IPC-6011

JESD51-9

Untitled

LGA voiding

A7647

74C926

MAX791

IPC-6012

footprint jedec MS-026 TQFP

16k x 8 ram

circuit diagram of MOD 100 counter using ic 7490