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    CU OSP AND CU SOP Search Results

    CU OSP AND CU SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    CU OSP AND CU SOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SZZA031

    Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
    Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)


    Original     		PDF SZZA031 Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste

    szza026

    Abstract: Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75
    Text: Application Report SZZA026 – July 2001 Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT Texas Instruments has introduced a refined version of its nickel/palladium NiPd finish for


    Original     		PDF SZZA026 40-billion szza026 Finishes Cu OSP and Cu SOP CU-106A IPC-A610C IPC-A-610C heraeus oxygen entek plus cu 106a heraeus osp 75

    FP5512

    Abstract: autofocus IC WLCSP chip mount 0.4mm pitch flip chip 256 pin 0X18H autofocus lens control system in camera diode SD4
    Text: FP5512 fitipower integrated technology lnc. 85T I2C Compatible 10-Bit DAC 120mA VCM Driver with Slope Control Description Features The FP5512 is a single 10-bit DAC with 120mA output current voice coil motor VCM driver, with an 2 I C-compatible serial interface that operates at clock


    Original     		PDF FP5512 10-Bit 120mA FP5512 FP5512-0 autofocus IC WLCSP chip mount 0.4mm pitch flip chip 256 pin 0X18H autofocus lens control system in camera diode SD4

    AVR181: Automotive Grade0 - PCB and Assembly Recommendations

    Abstract: ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
    Text: AVR181: Automotive Grade0 - PCB and Assembly Recommendations 1. Foreword Modern cars still involve control loops between a set of captors and different actuators elements responsible for the transportation, but also the comfort and the safety of the occupants. To satisfy the constant growth of these elements, car makers and their


    Original     		PDF AVR181: AVR181: Automotive Grade0 - PCB and Assembly Recommendations ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101

    211X1-APP-001-A

    Abstract: JEDEC SMT reflow profile SMT Process pcb warpage* in smt reflow BGA PROFILING M21111 M21121 MINDSPEED J-STD-20
    Text: 211x1-APP-001-A April 2006 SMT Lead-Free Packages Application Note Products Affected: M21111, M21121 Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for lead-free packages. Mindspeed has taken a proactive role


    Original     		PDF 211x1-APP-001-A M21111, M21121 211X1-APP-001-A JEDEC SMT reflow profile SMT Process pcb warpage* in smt reflow BGA PROFILING M21111 M21121 MINDSPEED J-STD-20

    pcb warpage* in smt reflow

    Abstract: JEDEC SMT reflow profile SMT Process pcb warpage in ipc standard J-STD20
    Text: 2xxxx-APP-001-A September 2006 SMT Lead-Free Packages Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for lead-free packages. Mindspeed has taken a proactive role


    Original     		PDF 2xxxx-APP-001-A pcb warpage* in smt reflow JEDEC SMT reflow profile SMT Process pcb warpage in ipc standard J-STD20

    DIN EN 60352-5

    Abstract: dell 170 board problem solution Harting Technology Group F-95972 compactPCI 47 positions connector DIN ISO 1302 Harting Technology Group Catalogue HARTING Device Connectivity DIN 41612 connector harting POWER SUPPLY BOARD sy 94V-0
    Text: 35 4 HARTING TCA Connectors People | Power | Partnership HARTING worldwide Transforming customer wishes into concrete solutions The HARTING Technology Group is skilled in the fields of electrical, electronic and optical connection, transmission and networking, as well as in manufacturing, mechatronics and software creation.


    Original     		PDF MO/24 DIN EN 60352-5 dell 170 board problem solution Harting Technology Group F-95972 compactPCI 47 positions connector DIN ISO 1302 Harting Technology Group Catalogue HARTING Device Connectivity DIN 41612 connector harting POWER SUPPLY BOARD sy 94V-0

    BGA-3000

    Abstract: BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar
    Text: National Semiconductor Application Note 1112 May 1999 CONTENTS Package Construction lation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for micro-SMD 8 I/O Smallest Footprint


    Original     		PDF AN-1112 BGA-3000 BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar

    B 58290 siemens

    Abstract: circular waveguide siemens B 58290 RG232 cable ARRESTOR GAS TUBE SIEMENS tag 8634 2367-0000-54 2367-5001-54 omni spectra sma Omni-Spectra 2081-2700-00
    Text: Catalog 1307191 Revised 10-00 R F C O A X I A L S O L U T I O N S F O R WIRELESS BASE STATION The new Tyco Electronics RF Coaxial Solutions for Communications Equipment catalog combines the best products from industry leading brand names like Omni SPECTRA, M/A-COM, Siemens E.C.,


    Original     		PDF

    2TY smd transistor

    Abstract: transistors ai 757 MIL-STD-1553 cable connector circular waveguide radiall 617 610 connector 1/4-36 UNS-2B smd 2TY CECC 22190 2.4 ghz 2 WATTS POWER AMPLIFIER SCHEMATIC DIAGRAM smd transistor 2TY
    Text: Cat1307191_Cover+Spine_v7.qxd 2/21/07 2:46 PM Page 1 Catalog 1307191 Revised 3-07 tycoelectronics.com 1307191–3M–LUG–FP–3-07 RF Coax Products Catalog Tyco Electronics Corporation Harrisburg, PA RF Coax Products RF Coax Connectors Introduction Product Facts


    Original     		PDF Cat1307191 E-81956 E-81956 2TY smd transistor transistors ai 757 MIL-STD-1553 cable connector circular waveguide radiall 617 610 connector 1/4-36 UNS-2B smd 2TY CECC 22190 2.4 ghz 2 WATTS POWER AMPLIFIER SCHEMATIC DIAGRAM smd transistor 2TY

    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		PDF AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition

    30g 122 igbt

    Abstract: SEMIKRON type designation PCIM 176 display CALCULATION SemiSel 3.1 PCIM 176 pure sinus inverter circuit 60749 IGBT cross reference semikron CALCULATION SemiSel PCIM 95
    Text: SEMiX - Technical Explanations SEMiX ® IGBT Modules & Bridge Rectifier Family Technical Explanations Version 2.0 / January 2008 Christian Daucher 1 Version 2.0 2008-01-22 by SEMIKRON SEMiX® - Technical Explanations Content 1 Introduction . 3


    Original     		PDF

    circular waveguide

    Abstract: 945 mercury MOTHERBOARD CIRCUIT diagram 190-32 UNF radiall 617 610 connector Radiall 620 600 770 msc 0645 TNC micro-coax commscope 3104 AMP PBT connector MIL-STD-348A SMP
    Text: Cat1307191_Cover+Spine_v7.qxd 2/21/07 2:46 PM Page 1 Catalog 1307191 Revised 3-07 tycoelectronics.com 1307191–3M–LUG–FP–3-07 RF Coax Products Catalog Tyco Electronics Corporation Harrisburg, PA RF Coax Products RF Coax Connectors Introduction Product Facts


    Original     		PDF E-81956 circular waveguide 945 mercury MOTHERBOARD CIRCUIT diagram 190-32 UNF radiall 617 610 connector Radiall 620 600 770 msc 0645 TNC micro-coax commscope 3104 AMP PBT connector MIL-STD-348A SMP

    PCIM 176

    Abstract: PCIM 95 CALCULATION SemiSel 30g 122 igbt PCIM 176 display IGBT rectifier theory IGBT cross reference semikron pure sinus inverter circuit makrolon 9425 T100
    Text: SEMiX - Technical Explanations SEMiX ® IGBT Modules & Bridge Rectifier Family Technical Explanations Version 2.0 / January 2008 Christian Daucher 1 Version 2.0 2008-01-22 by SEMIKRON SEMiX® - Technical Explanations Content 1 Introduction . 3


    Original     		PDF

    sot23 w32

    Abstract: SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g
    Text: Main System Design location Level Parts Code Parts Description Spec.


    Original     		PDF WLL3141 BA44-00238A BA44-00243A BA44-00162A BA42-00133A BA59-02154A BA92-04714A BA99-07566A BA70-00388A BA39-00431A sot23 w32 SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    ic 555 timer 10 minute

    Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
    Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin

    RTL8192

    Abstract: RTL819 abc c789 100uf 10p MEC1308-NU BA59-02570A tps51620 w192 BA41-01100A rtl-8192 mec1308
    Text: Point LABEL-LOGO BEZEL-ODD KNOB-ODD LENS-ODD HDD Componet BA68-10150B BA81-06661A BA81-06662A BA81-06663A BA59-02348A Object description LABEL-LOGO_SAMSUNG;NP,SEC,ARTPAPER+OPP COATING,-,-,-,-,W


    Original     		PDF BA68-10150B BA81-06661A BA81-06662A BA81-06663A BA59-02348A BA43-00207A BA69-40003A BA44-00242A BA81-07036A BA42-00235A RTL8192 RTL819 abc c789 100uf 10p MEC1308-NU BA59-02570A tps51620 w192 BA41-01100A rtl-8192 mec1308

    military relay

    Abstract: BGA-3000 AN-1112 LMC6035 LMC6035IBP LMC6035IBPX Lay out of 10 Bump Micro smd package CD laser pickup assembly
    Text: ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy


    Original     		PDF

    Heading

    Abstract: No abstract text available
    Text: SENtral Motion Coprocessor General Description The SENtral Motion Coprocessor is a custom integrated circuit that makes it easy to quickly incorporate, optimize and operate multiple motion sensors on mobile consumer electronics devices. SENtral employs and manages a user-specified


    Original     		PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    P80A49H

    Abstract: 8035HL F1L 250 V fuse BPK-70 interfacing 8275 crt controller with 8086 i8282 hall marking code A04 Transistor AF 138 DK55 82720 intel
    Text: COMPONENT DATA CATALOG JANUARY 1982 Intel C orporation makes no w arranty fo r the use of its products and assumes no re sponsib ility fo r any e rrors w hich may appear in th is docum ent nor does it make a com m itm ent to update the info rm atio n contained herein.


    OCR Scan     		PDF RMX/80, P80A49H 8035HL F1L 250 V fuse BPK-70 interfacing 8275 crt controller with 8086 i8282 hall marking code A04 Transistor AF 138 DK55 82720 intel

    TDA 9370

    Abstract: Z86C2704PSC TDA 9370 321 30349 P40P03 TDA 9370 with pin no 64 Z86C27 Z86C97
    Text: i^ZilßG Product Specification Z86C27-R0M Z86C97-R0MLESS CMOS Z8 8-BIT MICROCONTROLLER FEATURES • 8-bit CMOS m icrocontroller for consum er television applications. 64-pin DIP package. ■ Low cost ■ Low pow er consum ption ■ Fast instruction p o in te r-1.5 m icroseconds @ 4 MHz


    OCR Scan     		PDF 64-pin Z86C27 Z86C97 DC-2561 TDA 9370 Z86C2704PSC TDA 9370 321 30349 P40P03 TDA 9370 with pin no 64