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    SZZA031

    Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
    Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)


    Original     		SZZA031 Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste PDF

    JESD22A121

    Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
    Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were


    Original     		SZZA051B JESD22A121 IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031 PDF