C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
|
Original
|
PDF
|
FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
|
C18070
Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract
|
Original
|
PDF
|
|
Cu6Sn5
Abstract: 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L
Text: AN2035 Application note Control of whisker growth in Tin alloy coatings 1 Nature of whiskers and whisker mitigation techniques Some metals show an unusual metallurgical phenomenon: a single, microscopic crystal filament of the metal grows “spontaneously” from its surface. The metals concerned include
|
Original
|
PDF
|
AN2035
Cu6Sn5
22A121
AN2035
Cu3Sn
an2035 st
Cu6Sn5 surface energy
176L
FeNi42
SO36L
|
Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
|
Original
|
PDF
|
D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
|
Cu6Sn5
Abstract: Cu6Sn5 surface energy sem 2006 IPACK2005
Text: APPLIED PHYSICS LETTERS 88, 012106 ͑2006͒ Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints Lingyun Zhang,a͒ Shengquan Ou, Joanne Huang, and K. N. Tu Department of Materials Science and Engineering, University of California, Los Angeles,
|
Original
|
PDF
|
|
Cu6Sn5
Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are
|
Original
|
PDF
|
|
schematic diagram intel atom
Abstract: DE-AC03-76SF00098 schematic diagram atom Cu6Sn5 Acta Materialia
Text: Acta Materialia 51 2003 6253–6261 www.actamat-journals.com Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction W.J. Choi a,∗ 1, T.Y. Lee a 2, K.N. Tu a, N. Tamura b, R.S. Celestre b, A.A. MacDowell b, Y.Y. Bong c, Luu Nguyen c
|
Original
|
PDF
|
|
ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
|
Original
|
PDF
|
D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
|
DE-AC03-76SF00098
Abstract: Cu3Sn Cu6Sn5 sncu0.7
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
|
Original
|
PDF
|
|
DE-AC03-76SF00098
Abstract: Cu3Sn sncu0.7 Cu6Sn5 Ortec Cu6Sn5 formation whisker Cu base b110c
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
|
Original
|
PDF
|
|
FeNi42
Abstract: Cu6Sn5 sn-pb-ag solder paste
Text: Whisker Formation on Tin Plated FeNi42 Results and Conclusion 29 October 2004 Outline • Introduction • Experimental procedure and inspection • Results • Summary and Conclusions Introduction Major mechanism and conditions for whisker formation FeNi42
|
Original
|
PDF
|
FeNi42
FeNi42=
FeNi42
SnPb10
Cu6Sn5
sn-pb-ag solder paste
|
SZZA024
Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
Text: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In
|
Original
|
PDF
|
SZZA024
ic ZN 415
ic ZN 415 datasheet
CU-106A
IPC-A-610C
91Sn
Cu6Sn5
|
JESD22-B111
Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5
Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA
|
Original
|
PDF
|
|
FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Text: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
|
Original
|
PDF
|
ST-300
Workshop/54th
FLUX TYPE ROL0
ALLOY leadframe C7025
C7025 strip specification
smd EDL 63
ST-50
adrian borg
10X10
C151
C194
|
|
|
smema
Abstract: smema control STR223 smema wiring electronics nasa smema specifications Phoenix contact subcon 9 connector tamura solder paste tamura tin lead solder paste Telcon
Text: TND311 Tin Whisker Info Brief" http://onsemi.com APPLICATION NOTE acceleration test with quantified acceleration factors is unknown. This is complicated further by the highly variable “incubation” period during which stress builds before whiskers grow. However, ON has completed testing using
|
Original
|
PDF
|
TND311
TND311/D
smema
smema control
STR223
smema wiring
electronics nasa
smema specifications
Phoenix contact subcon 9 connector
tamura solder paste
tamura tin lead solder paste
Telcon
|
FeNi42
Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.
|
Original
|
PDF
|
LF-304,
FeNi42
C18070
LF-304
53RD
J-STD-004
leadframe materials
CuCrSiTi
FeNi42-leadframe
lf304
Cu6Sn5
|
Cu3Sn
Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
|
Original
|
PDF
|
AN10365
AN10365
Cu3Sn
HVQFN48
J-STD-020D
SSOP20
Cu6Sn5
Solder Paste, Indium 5.1, Type 3
|
Cu3Sn
Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
|
Original
|
PDF
|
AN10365
AN10365
Cu3Sn
Solder Paste, Indium, Type 3
SSOP20 LAND PATTERN
Solder Paste Indium reflow process control
Solder Paste, Indium 5.1, Type 3
HVQFN48
SSOP20
philips pb-free products
SOT266-1 LAND PATTERN
|
822 smd
Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
|
Original
|
PDF
|
|
Lead Free reflow soldering profile BGA
Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
|
Original
|
PDF
|
AN10365
AN10365
Lead Free reflow soldering profile BGA
HVQFN48
SSOP20
Solder Paste, Indium, Type 3
Cu3Sn
philips pb-free products
|
transport media and packing
Abstract: ic shelf life Ultrasonic cleaner circuit diagram MIL-B-81705 moisture sensitive handling and packaging PQFP moisture sensitive handling and packaging IPC-SM-786 IPC-SM-786A PLCC 68 intel package dimensions smt 28rh
Text: CHAPTER 8 MOISTURE SENSITIVITY DESICCANT PACKING HANDLING OF PSMCs INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and establishes preconditioning flows which encompasses moisture absorption thermal stress and
|
Original
|
PDF
|
|
AN10365
Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and
|
Original
|
PDF
|
AN10365
AN10365
ipc 610D
Cu3Sn
JEDEC J-STD-033b.1
SSOP20 LAND PATTERN
JEDEC J-STD-033b
J-STD-033b.1
Cu6Sn5
ipc 610 non-wetting
Solder Paste, Indium, Type 3
|
intel packaging handbook 240800
Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and
|
Original
|
PDF
|
CH08WIP
intel packaging handbook 240800
Ultrasonic cleaner circuit diagram
moisture sensitive handling and packaging
MIL-B-81705
intel 815 reflow profile
INTEL PLCC 68 dimensions tape
LEAD FRAME SURFACE MOUNT
Intel Packaging Handbook 240800 solder
PQFP die size
PQFP moisture sensitive handling and packaging
|
36804-10M
Abstract: Cu6Sn5 SnAgCu
Text: Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections Dragos Burlacu, Luu Nguyen* and Jorma Kivilahti Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, FIN-02150, Finland
|
Original
|
PDF
|
FIN-02150,
36804-10M
Cu6Sn5
SnAgCu
|
