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    CY7C122 DIE Search Results

    CY7C122 DIE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ISL70062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL70061SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A PMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL73062SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A NMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    ISL73061SEHX/SAMPLE Renesas Electronics Corporation Radiation Hardened 10A PMOS Load Switch, DIE, /Die Waffle Pack Visit Renesas Electronics Corporation
    HS0-26CT31RH-Q Renesas Electronics Corporation Radiation Hardened Quad Differential Line Drivers, DIE, / Visit Renesas Electronics Corporation

    CY7C122 DIE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    94v-0 dynamic RAM

    Abstract: M33005 CY93L422PC CY9122 7c122 cy7c122 CY93L422 m3300 EME-6300H UL-94V0
    Text: Qualification Report December 1994 QTP 94261 Version 1.0 CY7C122 256 x 4 Static RAM - RAM2.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		PDF CY7C122 7C122A PassivatiY7C185-PC CY7C185-PC 200mA 94v-0 dynamic RAM M33005 CY93L422PC CY9122 7c122 cy7c122 CY93L422 m3300 EME-6300H UL-94V0

    CY93L422PC

    Abstract: cy9122 cy93l422 cy7c122 sumitomo epoxy am-113 7C122 EME-6300H UL-94V0 CY93422 22 CDIP DIMENSIONS
    Text: Qualification Report January 1992 QTP 90172 256 x 4 Static RAM MARKETING PART NBR DEVICE DESCRIPTION CY7C122 SIO Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part


    Original     		PDF CY7C122 7C122A 200mA CY93L422PC cy9122 cy93l422 cy7c122 sumitomo epoxy am-113 7C122 EME-6300H UL-94V0 CY93422 22 CDIP DIMENSIONS

    5962-8867001LA cypress

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010
    Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION procedure

    Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
    Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality


    Original     		PDF

    CY27S03A

    Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
    Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability


    Original     		PDF CY7C122 CY27S03A 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide

    CY7C9101

    Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
    Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the


    Original     		PDF

    Gunn Diode symbol

    Abstract: cy202 CY7C190 WSP-109BMP3 pal22V10D cy7b166 cy7c291 CY7C371 EV film cap calculation gunn diode datasheet
    Text: CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY APPENDIX A: FAILURE RATE CALCULATION Thermal Acceleration Factors Acceleration factors AF for thermal stresses (High Temperature Operating Life, Data Retention and High Temperature Steady State Life) are calculated from the Arrhenius equation.


    Original     		PDF 62x10-5 Gunn Diode symbol cy202 CY7C190 WSP-109BMP3 pal22V10D cy7b166 cy7c291 CY7C371 EV film cap calculation gunn diode datasheet

    CY62256LL-PC

    Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
    Text: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2


    Original     		PDF PALCE22V10-JC FLASH-FL22D CY62256LL-PC VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113

    CY7C169

    Abstract: 54600
    Text: Thermal Management CYPRESS Part Number CY7B173 CY7B174 CY7B180 CY7B181 CY7B185 CY7B186 CY7B191 CY7B192 CY7B194 CY7C122 CY7C123 CY7C128 CY7C128A CY7C130 CY7C131 CY7C132 CY7C136 CY7C140 CY7C141 CY7C142 CY7C146 CY7C147 CY7C148 CY7C149 CY7C150 CY7C157 CY7C161A


    OCR Scan     		PDF CY7B173 CY7B174 CY7B180 CY7B181 CY7B185 CY7B186 CY7B191 CY7B192 CY7B194 CY7C122 CY7C169 54600