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    DH020 Search Results

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    DH020 Price and Stock

    Essentra Components BDH020A

    PUSH FIT BUMPER: COMPATIBLE HOLE
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    DigiKey BDH020A Bag 31,358 1
    • 1 $0.1
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    • 100 $0.0441
    • 1000 $0.03551
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    Mouser Electronics BDH020A
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    RS BDH020A Bulk 19,449 24 Weeks 1
    • 1 $0.101
    • 10 $0.101
    • 100 $0.095
    • 1000 $0.09
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    Essentra Components RDH0200A

    ROUND HEAVY DUTY THREADED INSERT
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    DigiKey RDH0200A Bulk 48
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    • 100 $13.32125
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    Mouser Electronics RDH0200A
    • 1 $15.81
    • 10 $14.57
    • 100 $11.65
    • 1000 $11.07
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    ITW Lumex LOD-H02004DP-G

    OLED MODULE 80DIG 20 X 4 PASSIVE
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    DigiKey LOD-H02004DP-G Box
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    Newark LOD-H02004DP-G Bulk 9 1
    • 1 $11.36
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    RS LOD-H02004DP-G Bulk 5 1
    • 1 $49.18
    • 10 $44.26
    • 100 $44.26
    • 1000 $44.26
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    ITW Lumex LOD-H02002DP-W

    OLED MODULE 40DIG 20 X 2 PASSIVE
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    DigiKey LOD-H02002DP-W Box
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    Newark LOD-H02002DP-W Bulk 52 1
    • 1 $6.65
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    RS LOD-H02002DP-W Bulk 360
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    • 1000 $27.53
    • 10000 $23.4
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    Omega Engineering ADH-020-480V-3P

    AIR DUCT HEATER, HIGH TEMPERATUR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ADH-020-480V-3P Bulk 1
    • 1 $4855.93
    • 10 $4855.93
    • 100 $4855.93
    • 1000 $4855.93
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    DH020 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TI date code

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG


    Original     		DM941230AG DM941226AA DS2502 DM941226AA DM941230AG TI date code PDF

    DALLAS DS80C320

    Abstract: 25863
    Text: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		DS1232L DS1232 DK933191AAJ HRS87C520 DS87C520 DE013425AAD J-STD-020 30C/60% DALLAS DS80C320 25863 PDF

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA


    Original     		DM941226AA DM941230AG DS2502 DM941230AG DM941226AA PDF

    DS-1000

    Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		DS1000M-100 DS1000 DH927108AJC J-STD-020 30C/60% DS-1000 DS1302 DIE REVISION DH020 25409 PDF

    dallas date code ds1230

    Abstract: dallas ds1230 25919 DS1230
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:


    Original     		DS1621 DE940040AAC DS5002 DS87C520 DM925587AAF DK935356AAB DK933191AAJ DE952427AAD DE014522ADB dallas date code ds1230 dallas ds1230 25919 DS1230 PDF

    25821

    Abstract: dallas date code ds12887 25854
    Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC


    Original     		DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854 PDF

    997E-07

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY


    Original     		DK031452AB DS21352 DM941230AG DN041061AAE DK007198AAF DK016058AA DK016058AA DS2108 997E-07 PDF

    25804

    Abstract: No abstract text available
    Text: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		DS1000Z-25 DS1000 DE009456ACE 150x1 DS87C520 DE029195AAB 650x65 25804 PDF