Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DIE ATTACH MCU Search Results

    DIE ATTACH MCU Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    DIE ATTACH MCU Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    200B

    Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 200B AN598 DK-2750 RG41 popcorn defect analysis to-220

    MC81F4104M

    Abstract: MC81F4104S ABOV MC81F 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor
    Text: Document name Page RT_Report 1 of 9 MC81F4104x Include : MC81F4104M, MC81F4104S Qualification Report Report No. AQA-09-06-03 Issued Date 30. June. 2009 Issued By ◈ Part Number MC81F4104x Dong Hee Park ◈ Process Feature ( QA Engineer) 2Poly 4 Metal 4KB Flash 8Bit MCU


    Original     		PDF MC81F4104x MC81F4104M, MC81F4104S) AQA-09-06-03 MC81F4104M MC81F4104S 10TSSOP ABOV MC81F 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor

    Moisture Sensitivity Levels MICROCHIP PIC Package

    Abstract: 78610 delamination leadframe barber excursion AN598
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		PDF AN598 Moisture Sensitivity Levels MICROCHIP PIC Package 78610 delamination leadframe barber excursion AN598

    amkor

    Abstract: amkor exposed pad
    Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a


    Original     		PDF

    amkor exposed pad

    Abstract: exposed QFP 128 amkor exposed QFP 144
    Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small


    Original     		PDF

    CS-007

    Abstract: Amkor Electronics Amkor mold compound
    Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld


    Original     		PDF

    C21DC

    Abstract: SWRR064 CC1190EM RF pcb antenna for cc430 CC102X CC1190 QFN-16 CC1190RGVT CC110X antenna for cc430
    Text: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power


    Original     		PDF CC1190 SWRS089 CC11xx CC430 50-nA C21DC SWRR064 CC1190EM RF pcb antenna for cc430 CC102X CC1190 QFN-16 CC1190RGVT CC110X antenna for cc430

    C21DC

    Abstract: SWRR064 cc111x CC1190 RF pcb antenna for cc430 GRM1555C1H120JZ01D antenna for cc430 CC110X QFN-16 CC1190RGVT
    Text: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power


    Original     		PDF CC1190 SWRS089 CC11xx CC430 50-nA C21DC SWRR064 cc111x CC1190 RF pcb antenna for cc430 GRM1555C1H120JZ01D antenna for cc430 CC110X QFN-16 CC1190RGVT

    SWRR064

    Abstract: CC1190EM
    Text: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power


    Original     		PDF CC1190 SWRS089 CC11xx CC430 50-nA SWRR064 CC1190EM

    SWRR064

    Abstract: CC110X SWRS089 OMAP 850 CC11XX CC1190EM
    Text: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power


    Original     		PDF CC1190 SWRS089 CC11xx CC430 50-nA SWRR064 CC110X OMAP 850 CC1190EM

    CC1190EM

    Abstract: No abstract text available
    Text: CC1190 www.ti.com SWRS089 A – NOVEMBER 2009 – REVISED FEBRUARY 2010 850 – 950 MHz RF Front End Check for Samples: CC1190 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • Seamless Interface to Sub-1 GHz Low Power


    Original     		PDF CC1190 SWRS089 CC11xx CC430 50-nA CC1190EM

    Cymbet EnerChip User Guide

    Abstract: Application Notes application-notes
    Text: Cymbet EnerChip Smart Solid State Batteries Product Overview and User Guide AN-72-1026 Version 9.0 AN-72-1026 v9.0 Copyright 2008-2012 Cymbet Corporation. All rights reserved. Cymbet Corporation 18326 Joplin St. NW Elk River, MN 55330 Phone 763-633-1780


    Original     		PDF AN-72-1026 AN-72-1026 EVAL-05 Cymbet EnerChip User Guide Application Notes application-notes

    DE104iML

    Abstract: prepreg 7628 AT05 7628M PCB f antenna balun 2.4ghz cc2500 tl131 CC24xx CC2500 GRM1555C1HR50BZ01 prepreg 7628 LWQ15AN1N5B00
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 DE104iML prepreg 7628 AT05 7628M PCB f antenna balun 2.4ghz cc2500 tl131 CC24xx CC2500 GRM1555C1HR50BZ01 prepreg 7628 LWQ15AN1N5B00

    prepreg 7628 AT05

    Abstract: prepreg 7628 CC2500
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 prepreg 7628 AT05 prepreg 7628 CC2500

    prepreg 7628 AT05

    Abstract: CC2500
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 100-nA 22-mA prepreg 7628 AT05 CC2500

    tl131

    Abstract: CC2510 balun matching circuit design of Balun for CC2420, CC243x, and CC2480 CC2590EM f antenna balun 2.4ghz prepreg 7628 AT05 7628M CC2500
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 100-nA 22-mA tl131 CC2510 balun matching circuit design of Balun for CC2420, CC243x, and CC2480 CC2590EM f antenna balun 2.4ghz prepreg 7628 AT05 7628M CC2500

    DE104iML

    Abstract: CC2500 CC2400 CC2510 CC2511 CC2590 QFN-16 AN032 CC2510 balun matching circuit CC2590EM
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 DE104iML CC2500 CC2400 CC2510 CC2511 CC2590 QFN-16 AN032 CC2510 balun matching circuit CC2590EM

    RF MODULE CC2500 CIRCUIT DIAGRAM

    Abstract: tl131 prepreg 7628 AT05 C102 M DE104 CC2500 CC2590EM CC2400 CC2520 AN032
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 RF MODULE CC2500 CIRCUIT DIAGRAM tl131 prepreg 7628 AT05 C102 M DE104 CC2500 CC2590EM CC2400 CC2520 AN032

    DE104iML

    Abstract: CC2510 balun matching circuit CC2590EM DE104 CC2500 PCB f antenna balun 2.4ghz cc2500 prepreg 7628 AT05 RF MODULE CC2500 CIRCUIT DIAGRAM AN032 AT05
    Text: CC2590 www.ti.com . SWRS080 – SEPTEMBER 2008 2.4-GHz RF Front End, 14-dBm output power


    Original     		PDF CC2590 SWRS080 14-dBm 14-dBm CC24xx CC2500, CC2510, CC2511 DE104iML CC2510 balun matching circuit CC2590EM DE104 CC2500 PCB f antenna balun 2.4ghz cc2500 prepreg 7628 AT05 RF MODULE CC2500 CIRCUIT DIAGRAM AN032 AT05

    Untitled

    Abstract: No abstract text available
    Text: MAX7049 RELIABILITY REPORT FOR MAX7049ATI+ PLASTIC ENCAPSULATED DEVICES October 9, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.


    Original     		PDF MAX7049 MAX7049ATI+ JESD22-A114. 100mA JESD78. SL1ZBQ002E,

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		PDF DS550R

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: UCS1002-1 Programmable USB Port Power Controller with Charger Emulation PRODUCT FEATURES Datasheet General Description Features The UCS1002 provides a USB port power switch for precise control of up to 2.5 amperes continuous current with over-current limit OCL , dynamic thermal


    Original     		PDF UCS1002-1 UCS1002 UCS1002

    Untitled

    Abstract: No abstract text available
    Text: UCS8100X Automotive USB Port Power Controller with Charger Emulation PRODUCT FEATURES Datasheet General Description Features The UCS81001 and UCS81002 referred to as the UCS8100X in this document provide a USB port power switch for precise control of up to 2.5 amperes continuous


    Original     		PDF UCS8100X UCS81001 UCS81002 UCS8100X