DIP28
Abstract: dip-28 DIP28- 600 sot117 600MIL
Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil 1995 Jan 14 1 SOT117-1
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DIP28:
OT117-1
DIP28
dip-28
DIP28- 600
sot117
600MIL
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DIP28
Abstract: DIP28- 600
Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil ; long body 1995 Mar 11 5-6 SOT117-2
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DIP28:
OT117-2
DIP28
DIP28- 600
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DIP28
Abstract: dip-28
Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil ; long body 1995 Mar 11 3082 SOT117-2
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DIP28:
OT117-2
DIP28
dip-28
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Untitled
Abstract: No abstract text available
Text: DIP28-C-600-2.54 15 1 14 15.11±0.25 28 INDEX MARK 1.27TYP. 15.24 5.10MAX. 2.80±0.40 35.96MAX. 5 2.54 0.50±0.10 0.25 M 2.54MIN. 1.27TYP. 0.51MIN. SEATING PLANE +0.15 0.25-0.05
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DIP28-C-600-2
96MAX.
27TYP.
10MAX.
51MIN.
54MIN.
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Untitled
Abstract: No abstract text available
Text: DIP28-G-600-2.54 15 1 14 14.90MAX. 28 15.24 38.00MAX. 5 0.25 M 5.10MAX. 0.50 0.10 2.54MIN. 2.54 4.10 0.40 1.90TYP. 0.51MIN. 1.30 0.10 SEATING PLANE +0 0.25- .15 0.05 15 0~
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DIP28-G-600-2
90MAX.
00MAX.
10MAX.
54MIN.
51MIN.
90TYP.
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Untitled
Abstract: No abstract text available
Text: DIP28-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.30 TYP. 2/Dec. 11, 1996
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DIP28-P-600-2
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600mil
Abstract: DIP28
Text: SANYO Semiconductor Dual In-line Package 28Pin Plastic DIP28 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
DIP28
600mil)
ED-7303A)
51MIN
DIP28
600mil
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DIP28 package
Abstract: No abstract text available
Text: DIP28-P-600-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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DIP28-P-600-2
DIP28 package
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Untitled
Abstract: No abstract text available
Text: Package outline DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions) UNIT A max.
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DIP28:
OT117-1
051G05
MO-015
SC-510-28
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28P4
Abstract: JEDEC 600Mil dip "lead material" DIP
Text: SEATING PLANE EIAJ Package Code DIP28-P-600-2.54 e b1 D b 14 1 Lead Material Alloy 42 15 Weight g 3.8 28 JEDEC Code – A L 28P4 A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 28pin 600mil DIP c Dimension in Millimeters Min Nom Max – – 5.5 0.51 – –
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DIP28-P-600-2
28pin
600mil
28P4
JEDEC 600Mil dip
"lead material" DIP
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sot117
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
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DIP28:
OT117-2
OT117-2
MS-011AB
sot117
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MS-011
Abstract: DIP28
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
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DIP28:
OT117-2
051G06
MS-011
SC-510-28
MS-011
DIP28
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DIP28 package
Abstract: SC-510-28 DIP28
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane handbook, full pagewidthdual in-line package; 28 leads 600 mil DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP28:
OT117-1
051G05
MO-015
SC-510-28
DIP28 package
SC-510-28
DIP28
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DIP28
Abstract: MS-011
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (mm dimensions are derived from the original inch dimensions)
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DIP28:
OT117-2
051G06
MS-011
SC-510-28
DIP28
MS-011
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015AH
Abstract: 015-AH
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane handbook, full pagewidthdual in-line package; 28 leads 600 mil DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP28:
OT117-1
OT117-1
051G05
MO-015AH
015AH
015-AH
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051G05
Abstract: DIP28
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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DIP28:
OT117-1
051G05
MO-015
SC-510-28
051G05
DIP28
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dip28p
Abstract: No abstract text available
Text: DIP28-P-600-2.54 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 4.30 TYP. 2 版/96.12.11
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DIP28-P-600-2
dip28p
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DIP28
Abstract: DIP-28 dip28 600mil package
Text: SANYO Semiconductor Dual In-line Package 28Pin Plastic DIP28 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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28Pin
DIP28
600mil)
ED-7303A
51MIN
DIP28
DIP-28
dip28 600mil package
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LC35256DM-70 equivalent
Abstract: SOP28D DIP28 DIP28- 600 LC35256DM-70 LC3564B-70 LC3564S-10 SOP32 Package LC3564B-10 sanyo lc35256fm-70u
Text: Ordering number : ENN6511A Notice of Designation of the Discontinued MOS ICs Affected products: Products listed below. Thank you for using SANYO semiconductor products. We will be introducing the technology mentioned in the title as described below. Please take note of this introduction.
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ENN6511A
LC3564S-10
DIP28
LC3564B-70
LC35256D-10
LC371000SP
LC3564BM-10
LC35256DM-70 equivalent
SOP28D
DIP28
DIP28- 600
LC35256DM-70
LC3564B-70
LC3564S-10
SOP32 Package
LC3564B-10
sanyo lc35256fm-70u
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dip28p
Abstract: No abstract text available
Text: DIP28-P-600-2.54 Unit nn Jul.2000
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DIP28-P-600-2
dip28p
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Untitled
Abstract: No abstract text available
Text: DIP28-P-600-2.54 Unit: m Jul,2000
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DIP28-P-600-2
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IS2473
Abstract: Isolation Timing Circuits
Text: BA7107 BA7107F BA7107S SECAM chroma signal processor The BA7107, BA7107F, and BA7107S ICs contain all major circuits for a SECAM chroma signal processor. SECAM chroma signal record and playback are integrated onto this single chip. Dimensions Units: mm BA7107 (DIP28)
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BA7107
BA7107F
BA7107S
BA7107,
BA7107F,
BA7107S
BA7107
DIP28)
BA7107F
DIP28,
IS2473
Isolation Timing Circuits
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TEA7605SP
Abstract: TEA7105 TEA5170 display driver dip16 M5450B7 TEA2164 BATWING dual npn 500ma M5480 EF9369
Text: r iZ SGS-THOMSON CONSUMER WB g ®[lILIËή®R!lD(gi TV, MONITORS AND VCR CIRCUITS SWITCH MODE POWER SUPPLY BIPOLAR TRANSISTORS •c VCEV v CEO ptot Package Type N PN hFE @ >C 1 (A (V) (V) <W) 5 6 7 7.5 7.5 12 1500 1200 1500 1500 1500 1200 700 600 700 700
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2ST2000
TDA4601/B
TEA2018A
TEA2019
TEA2164
TEA5170
M5450B7
M5451B7
M5480B7
M5481B7
TEA7605SP
TEA7105
display driver dip16
BATWING
dual npn 500ma
M5480
EF9369
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64X16 led matrix
Abstract: TDA8172A 12v 400W AUDIO AMPLIFIER TEA2037 tda2824s TDA8214A CQFP-100 12v 40w tda2040 amplifier circuit tda2030 CQFP100
Text: SELECTION GUIDE For detailed information on products referred to in the selection guide but not included as datasheet in this book, please refer to the databook indicated in column "DB" SG S-THOMSON DATABOOKS DB O RDER CODE a 4 BIT MCU FAMILY ET9400 DBET9400ST/1
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ET9400
EF6801/04/05
CB12000
ISB12000
ISB9000
ISB18000
ST6326/27/28/
ST6356/57/58
ST6340/42/44/46
64X16 led matrix
TDA8172A
12v 400W AUDIO AMPLIFIER
TEA2037
tda2824s
TDA8214A
CQFP-100
12v 40w tda2040
amplifier circuit tda2030
CQFP100
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