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Nexperia PUSB3FR4Z ESD Protection Diodes / TVS Diodes PUSB3FR4/SOT1176/XSON10
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	PUSB3FR4Z	Reel	15,000		5,000	1 - 10 - 100 - 1000 - 10000 $0.071	Buy Now
Nexperia NXS0104GU12X Translation - Voltage Levels NXS0104GU12/SOT1174/XQFN12
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	NXS0104GU12X	Reel	12,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.267	Buy Now
Nexperia PESD4USB3UCTBR-QZ ESD Protection Diodes / TVS Diodes DIODE-ESD SOT1176/XSON10
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	PESD4USB3UCTBR-QZ	Reel	5,000		5,000	1 - 10 - 100 - 1000 - 10000 $0.098	Buy Now
Nexperia NXB0104GU12X Translation - Voltage Levels NXB0104GU12/SOT1174/XQFN12
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	NXB0104GU12X	Reel	4,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.267	Buy Now
Nexperia PESD4USB5U-TBSX ESD Protection Diodes / TVS Diodes PESD4USB5U-TBS/SOT1176D/DFN251
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	PESD4USB5U-TBSX	Reel			8,000	1 - 10 - 100 - 1000 - 10000 $0.111	Buy Now

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SOT117 Datasheets (21)

Part	Manufacturer	Description	Datasheet Type	PDF
SOT117-1	Philips Semiconductors	Dip28: Plastic Dual In-line Package 28 Leads (600 Mil)	Original	PDF
SOT1172-1	NXP Semiconductors	Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad	Original	PDF
SOT1172-2	NXP Semiconductors	Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad	Original	PDF
SOT1172-2_118	NXP Semiconductors	HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118	Original	PDF
SOT1172-3	NXP Semiconductors	Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad	Original	PDF
SOT1173-1	NXP Semiconductors	Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based	Original	PDF
SOT1174-1	NXP Semiconductors	Plastic, extremely thin quad flat package; no leads 12 terminals	Original	PDF
SOT1174-1	NXP Semiconductors	Footprint for reflow soldering SOT1174-1	Original	PDF
SOT1174-1	NXP Semiconductors	SOT1174 _T1_ packing info 12NC ending 115	Original	PDF
SOT1174-1_115	NXP Semiconductors	Standard product orientation 12NC ending 115	Original	PDF
SOT1175-1	NXP Semiconductors	Plastic small outline package; 7 leads; body width 3.9 mm	Original	PDF
SOT1176-1	NXP Semiconductors	Reflow soldering footprint1176-1	Original	PDF
SOT1176-1	NXP Semiconductors	Plastic extremely thin small outline package; no leads; 10 terminals	Original	PDF
SOT1177-1	NXP Semiconductors	Plastic extremely thin small outline package; no leads; 10 terminals	Original	PDF

SOT1178-1	NXP Semiconductors	Plastic extremely thin small outline package; no leads; 9 terminals	Original	PDF
SOT1178-1	NXP Semiconductors	Footprint for reflow soldering SOT1178-1	Original	PDF
SOT1179-1	NXP Semiconductors	Footprint for reflow soldering SOT1179-1	Original	PDF
SOT1179-1	NXP Semiconductors	Plastic thermal enhanced very thin small outline package; no leads; 12 terminals	Original	PDF
SOT1179-1_135	NXP Semiconductors	HVSON12; reel pack; standard product orientation; 12NCending 135	Original	PDF
SOT1179-2	NXP Semiconductors	Plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm	Original	PDF

SOT117 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
HVSON12 Abstract: No abstract text available Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit	Original	HVSON12 OT1179-1 sot1179-1	PDF
Untitled Abstract: No abstract text available Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper	Original	XQFN12 OT1174-1 sot1174-1	PDF
Untitled Abstract: No abstract text available Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w	Original	HTSSOP28: OT1172-2 MO-153 sot1172-2	PDF
Untitled Abstract: No abstract text available Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1	Original	XSON10: OT1177-1 sot1177-1	PDF
Untitled Abstract: No abstract text available Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12	Original	HVSON12: OT1179-2 MO-229 sot1179-2	PDF
Untitled Abstract: No abstract text available Text: SOT1174-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1174 115 180 x 8	Original	OT1174-1 OT1174 OT1174	PDF
Untitled Abstract: No abstract text available Text: Package outline XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X B D A terminal 1 index area E A A1 A3 detail X ∅v ∅w b 5 C C A B C y1 C y 7 e1 e 1 11 terminal 1 index area L1 L 1 2 mm scale	Original	XQFN12: OT1174-1 MO-288 sot1174-1	PDF
DIP28 Abstract: dip-28 DIP28- 600 sot117 600MIL Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil 1995 Jan 14 1 SOT117-1	Original	DIP28: OT117-1 DIP28 dip-28 DIP28- 600 sot117 600MIL	PDF
sot117 Abstract: No abstract text available Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)	Original	DIP28: OT117-2 OT117-2 MS-011AB sot117	PDF
MS-011 Abstract: DIP28 Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)	Original	DIP28: OT117-2 051G06 MS-011 SC-510-28 MS-011 DIP28	PDF
DIP28 package Abstract: SC-510-28 DIP28 Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane handbook, full pagewidthdual in-line package; 28 leads 600 mil DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)	Original	DIP28: OT117-1 051G05 MO-015 SC-510-28 DIP28 package SC-510-28 DIP28	PDF
sot1178 Abstract: No abstract text available Text: Package outline Footprint information for reflow soldering of XSON9 package SOT1178-1 Hx C Hy Ay By 0.025 D P 0.025 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	OT1178-1 sot1178-1 sot1178	PDF
sot1176 Abstract: 02K1 Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm SOT1176-1 X B D A E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 5 C C A B C y1 C y L1 k L 10 6 1 Dimensions Unit 1	Original	XSON10: OT1176-1 OT1176-1 sot1176-1 sot1176 02K1	PDF
051G05 Abstract: DIP28 Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)	Original	DIP28: OT117-1 051G05 MO-015 SC-510-28 051G05 DIP28	PDF

HTSSOP28 Abstract: No abstract text available Text: SOT1172-2 HTSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 12 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal	Original	OT1172-2 HTSSOP28; 001aak603 OT1172 HTSSOP28	PDF
Untitled Abstract: No abstract text available Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w	Original	HTSSOP28: OT1172-1 MO-153 sot1172-1	PDF
stencil Abstract: XSON10 Text: Reflow soldering footprint Footprint information for reflow soldering of XSON10 package SOT1176-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	XSON10 OT1176-1 sot1176-1 stencil	PDF
DIP28 Abstract: DIP28- 600 Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil ; long body 1995 Mar 11 5-6 SOT117-2	Original	DIP28: OT117-2 DIP28 DIP28- 600	PDF
Untitled Abstract: No abstract text available Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-1 X A B D E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L Eh 12 7	Original	HVSON12: OT1179-1 MO-229 sot1179-1	PDF
Untitled Abstract: No abstract text available Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-3 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 e bp 14	Original	HTSSOP28: OT1172-3 MO-153 sot1172-3	PDF
Untitled Abstract: No abstract text available Text: Package outline SO7: plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1 D A E X c HE y v A Z 7 5 Q A2 A A1 A3 θ pin 1 index Lp L 1 4 e detail X w bp 2.5 5 mm scale Dimensions Unit mm A A1 A2 A3 bp c max 1.75 0.250 1.45 0.49 0.25 nom 0.175 1.35 0.25 0.40 0.20	Original	OT1175-1 sot1175-1	PDF
sot1178 Abstract: No abstract text available Text: Package outline XSON9: plastic extremely thin small outline package; no leads 9 terminals; body 1 x 2.1 x 0.5 mm SOT1178-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 3 5 C C A B C v w b y1 C y L k 9 6 0.5 Dimensions Unit 1	Original	OT1178-1 OT1178-1 sot1178-1 sot1178	PDF
Untitled Abstract: No abstract text available Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-2 Gx D 0.105 P C nSPx SPx nSPy Hy Gy SLy SPy By Ay SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By	Original	HVSON12 OT1179-2 sot1179-2	PDF
Untitled Abstract: No abstract text available Text: Package outline HVQFN64R: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 0.8 mm A B D SOT1173-1 terminal 1 index area E A detail X e1 e L1 L 1/2 e 17 32 C C A B C v w b y y1 C 33 16 e e2 Eh 1/2 e 1 terminal 1	Original	HVQFN64R: OT1173-1 sot1173-1	PDF

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SOT117 Price and Stock

Nexperia PUSB3FR4Z

Nexperia NXS0104GU12X

Nexperia PESD4USB3UCTBR-QZ

Nexperia NXB0104GU12X

Nexperia PESD4USB5U-TBSX

SOT117 Datasheets (21)

SOT117 Datasheets Context Search

HVSON12

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DIP28

sot117

MS-011

DIP28 package

sot1178

sot1176

051G05

HTSSOP28

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stencil

DIP28

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sot1178

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