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    KA3213

    Abstract: KA32 KS5112 30A10 3A29
    Contextual Info: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for


    OCR Scan     		DPD2MX16M2H3 DPD2MX16M2 32-Megabits DPD2MX16M2H3 100ns 40-PIN 30A106-1S 275T415 0QQ137Ã KA3213 KA32 KS5112 30A10 3A29 PDF

    cb-rj

    Contextual Info: DENSE-PAC ^ _ Me abit CMOSdram 32 8 MICROSYSTEMS DPD2MX16M2H3 PRELIMINARY DESCRIPTION: TheDPD2M X16M 2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ stacked and leaded for


    OCR Scan     		DPD2MX16M2H3 32-Megabits DPD2MX16M2H3 30A108-18 100ns 3QA10B-18 cb-rj PDF

    DP5Z

    Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


    OCR Scan     		128Kx8, 64Kx16, 256Kx8, 384Kx8, DP5Z PDF