Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are
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OCR Scan
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DPS3232V
66-pin
128Kx32
256Kx32,
DPS3232V
12SKX8,
64KX16
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PDF
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twilight
Abstract: No abstract text available
Text: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal
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OCR Scan
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DPS3232V
DPS3232V
66-pin
128KX32
256KX32
S3232
100ns
120ns
150ns
twilight
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs
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OCR Scan
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DPS3232V
DPS3232V
66-pin
128Kx32
256Kx32,
128KX8,
64KX16
32KX32
30A014-10
275T415
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs
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OCR Scan
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DPS3232V-35I-TI
DPS3232V-35I-TI
66-pin
64KX32
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PDF
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Untitled
Abstract: No abstract text available
Text: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l
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OCR Scan
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DPS3232V
DPS3232V
66-pin
128KX32
256KX32
30A014-10
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs
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OCR Scan
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DPS3232V
66-pin
128Kx32
256Kx32,
DPS3232V
12SKX8.
64KX16
30A014-10
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PDF
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DPS3232V
Abstract: No abstract text available
Text: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs
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OCR Scan
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DPS3232V-35I-TI
DPS3232V-35I-TI
66-pin
128KX8,
64KX32
32KX32
A014-1
DPS3232V
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE Dense-Pac Microsystems, Inc. ^ DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired c e r a m ic s u b s tra te w ith m a tc h in g th e rm a l
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OCR Scan
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DPS3232V
DPS3232V
66-pin
128KX32
256KX32
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs
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OCR Scan
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DPS3232V-35I-TI
DPS3232V-35I-TI
66-pin
128KX8,
30A014-15
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS DPS3232V D E SC R IP TIO N : The D PS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs
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OCR Scan
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DPS3232V
66-pin
128Kx32
256Kx32,
30A014-10
DD0121fl
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM •C Dense-Pac Microsystems, Inc ^ DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired c eram ic substrate w ith m atching thermal
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OCR Scan
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DPS3232V
DPS3232V
66-pin
128KX32
256KX32
120ns
125-C
30A0I4-10
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PDF
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