Untitled
Abstract: No abstract text available
Text: 4 Megabit High Speed CMOS SRAM DPS512M8MKnY DESCRIPTION: The DPS512M8MKnY High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded
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DPS512M8MKnY
DPS512M8MKnY
500mV
30A129-01
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Dense pac
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit High Speed C M O S SRAM MICROSYSTEMS DPS512M8MKnY D E S C R IP T IO N : The D P S 5 1 2 M 8 M K n Y High Speed S R A M " S T A C K " devices are a re v o lu t io n a ry ne w m e m o ry sub syste m u sin g D e n se -P a c Microsystem s' ceramic Stackable Leadless Chip Carriers SLCQ.
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PDF
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DPS512M8MKnY
Dense pac
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T1251
Abstract: No abstract text available
Text: PENSE-PAC 4 Megabit High Speed CMOS SRAM 'MIC RÍ S Y S T K M S DPS512M8MKnY D E S C R IP T IO N : The DPS512M8MKnY High Speed SRAM "STACK'7devices are a re v o lu tio n a ry new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC).
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OCR Scan
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PDF
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DPS512M8MKnY
DPS512M8MKnY
500mV
T1251
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Dense-Pac Microsystems
Abstract: No abstract text available
Text: DENSE-PAC M i C R. O S Y S T E M S 4 Megabit High Speed CMOS SRAM DPS512M8MKnY DESCRIPTION: The DPS512M8MKnY High Speed SRAM "STACK” devices are a revolutionary new memory subsystem using D ense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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PDF
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DPS512M8MKnY
DPS512M8MKnY
500mV
30A129-01
Dense-Pac Microsystems
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