J32CG
Abstract: 61a3 mosfet BCM5461KFB 61a3 58A6 bcm5461 60F10 L32SD DQ27152 A26B4
Text: 1 2 4 3 5 6 7 TABLE OF CONTENTS F F PAGE 02 - BLOCK DIAGRAM PAGE 03 - 750GX ADDRESS/DATA BUSSES PAGE 04 - 750GX CONTROLS AND GROUND PAGE 05 - 750GX POWER AND DECOUPLING PAGE 06 - TSI108 PROCESSOR BUS INTERFACE PAGE 07 - TSI108 MEMORY INTERFACE PAGE 08 - DDR2 DIMM CONNECTOR SLOT 0
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750GX
TSI108
RS232
NC7SZ00
J32CG
61a3 mosfet
BCM5461KFB
61a3
58A6
bcm5461
60F10
L32SD
DQ27152
A26B4
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Untitled
Abstract: No abstract text available
Text: w GEC PLESS EY S E M I C O N D U C T O R S DS3587-3.3 MA36901 3 1553B BUS CONTROLLER/REMOTE TERMINAL The MA3690/1 chip set has three modes of operation: remote terminal, bus controller, and passive monitor It has a dual bus capability, requires minimum support hardware /
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DS3587-3
MA36901
1553B
MA3690/1
48-Pin
MA3693
MA3690.
Mil-Std-1553B.
Mil-Std-883
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474 K1C capacitor
Abstract: S1123 CSB320D proasm FCR455K BU2461 u2462 CSB440 U245 CSB440E
Text: Com m unication ICs Microcomputer for multi-key remote controllers BU2456/BU2458/BU2459/BU2460/BU2461/BU2462 T h e B U 2 4 5 8 series are four-bit, single-chip m icrocom puters on which all of the functions required for a rem ote con trol tra n s m itte r can b e c o n fig u re d on a sing le chip , w hich can b e u sed as a m ic ro c o n tro ller for a re m o te control
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BU2456/BU2458/BU2459/BU2460/BU2461/BU2462
BU2458
BU2456/BU2458/BU2459/BU2460
BU2461/BU2462
BU2456/B
U2458/B
U2459
BU2460/BU2461/BU2462
BU2458
BU2459
474 K1C capacitor
S1123
CSB320D
proasm
FCR455K
BU2461
u2462
CSB440
U245
CSB440E
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Untitled
Abstract: No abstract text available
Text: Communication ICs Shock Sensor Signal Processor BU3892FV T h e B U 3892FV is an 1C that processes the signals from shock sensors like those used in H D D and C D -R O M drives. This 1C receives the faint signals output by shock sensors in response to vibration, and output a sho ck detection
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BU3892FV
3892FV
D0211ED
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Untitled
Abstract: No abstract text available
Text: D S 1 2 3 0 Y /A B DALLAS SEMICONDUCTOR FEATURES DS1 230Y/ AB 256K N onvolatile SRAM PIN ASSIGNMENT A14 111 281 A12 112 E 271IW A7 113 261IA13 A6 114 251IA8 A5 115 241IA9 A4 116 231IA11 A3 117 221I A2 118 211I A10 A1 119 201I^ A0 1110 191I DQ7 DQ01111 181I DQe
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DS1230Y)
DS1230AB)
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Untitled
Abstract: No abstract text available
Text: TO S H IB A «10=17240 0 0 2 1 1 5 4 b 42E D L O G I C / M E M O R Y 1,048,576 WORD x 4 BIT DYNAMIC RAM DESCRIPTION IT0S2 * This is advanced information and specifications. are subject to change without notice. ¿ 3 /8 The TC514400J/Z is the new generation dynamic RAM organized 1)048,576 words by 4
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TC514400J/Z
TC514400J/Zâ
l7240
T-46-23-18
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74C04 application
Abstract: SILICONIX DG212CJ DQ211
Text: B&gæz DG211/212 Low Cost 4-Channel Monolithic SPST CMOS Analog Switches FEATURES BENEFITS APPLICATIONS • ± 15 V Analog Signal Range • TTL Compatibility • Logic Inputs Accept Negative Voltages • ON-Reslstance < 1 7 5 n • Wide Signal Range • Simple Logic Interface
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DG211/212
DQ211
DG2122
XXICJ0497
74C04 application
SILICONIX DG212CJ
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pin diagram of ic 7470
Abstract: IC 7470
Text: W D EDI9F232256BC \ 2x256Kx32 SRAM Module ELECTRONIC DESIGNS, INC. 2x256Kx32 Static RAM CMOS, High Speed Module Features The EDI9F232256B isa high speed 16 megabit Static RAM 2x256Kx32 bit BiCMOS and CMOS Static module organized as 2x256K words by 32 bits. This module
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EDI9F232256BC
2x256Kx32
EDI9F232256B
2x256K
256Kx4
pin diagram of ic 7470
IC 7470
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Untitled
Abstract: No abstract text available
Text: rMBSB. A tv 2; 7/96 / I / I / 1 X I A 1 Quad, SPST, Ultra-Low Leakage. CMOS Analog S w itc h * The MAX326/MAX327’s low charge.injection 2pC typ minimizes signal error. Operation from single supplies (+10V to +3W ), dual supplies (±5V to ±18V), and unbal
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MAX326/MAX327
211/D
DG201A/DG202
DG211/DG212
5000pA.
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