KMM53216000CK
Abstract: KMM53216000CKG
Text: DRAM MODULE KMM53216000CK/CKG 4Byte 16Mx32 SIMM 16Mx4 base Revision 0.0 JUNE 1998 DRAM MODULE Revision History Version 0.0 (JUNE 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53216000CK/CKG DRAM MODULE KMM53216000CK/CKG
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KMM53216000CK/CKG
16Mx32
16Mx4
KMM53216000CK/CKG
16Mx4,
KMM53216000C
16Mx32bits
KMM53216000CK
KMM53216000CKG
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16Mx4bits
Abstract: No abstract text available
Text: DRAM MODULE M53211600CE0/CJ0-C 4Byte 16Mx32 SIMM 16Mx4 base Revision 0.0 JUNE 1998 DRAM MODULE Revision History Version 0.0 (JUNE 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. M53211600CE0/CJ0-C DRAM MODULE M53211600CE0/CJ0-C
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M53211600CE0/CJ0-C
16Mx32
16Mx4
M53211600CE0/CJ0-C
16Mx4,
16Mx32bits
16Mx4bits
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE M53211600BE0/BJ0-C 4Byte 16Mx32 SIMM 16Mx4 base Revision 0.1 May 1998 DRAM MODULE M53211600BE0/BJ0-C Revision History Version 0.0 (Sept. 1997) • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS.
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M53211600BE0/BJ0-C
16Mx32
16Mx4
M53211600BE0/BJ0-C
16Mx4,
16Mx32bits
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE M53611601BE0/BJ0-C 4Byte 16Mx36 SIMM 16Mx4 & 16Mx1 base Revision 0.1 June 1998 DRAM MODULE M53611601BE0/BJ0-C Revision History Version 0.0 (Sept. 1997) • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS.
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M53611601BE0/BJ0-C
16Mx36
16Mx4
16Mx1
M53611601BE0/BJ0-C
16Mx1,
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM53232000CV/CVG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 JUNE 1999 DRAM MODULE Revision History Version 0.0 (JUNE 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53232000CV/CVG DRAM MODULE KMM53232000CV/CVG
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KMM53232000CV/CVG
32Mx32
16Mx4
KMM53232000CV/CVG
16Mx4,
KMM53232000C
32Mx32bits
16Mx4bits
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KMM5364003CK
Abstract: KMM5364003CKG KMM5364103CK KMM5364103CKG
Text: KMM5364003CK/CKG KMM5364103CK/CKG DRAM MODULE 4Byte 4Mx36 SIMM 4Mx4 & 16M Quad CAS base Revision 0.1 Nov. 1997 DRAM MODULE KMM5364003CK/CKG KMM5364103CK/CKG Revision History Version 0.1 (Nov. 1997) • Changed the mode of parity check component from EDO to FP, refer to
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KMM5364003CK/CKG
KMM5364103CK/CKG
4Mx36
KMM5364103CK/CKG
KMM53640
KMM5364003CK
KMM5364003CKG
KMM5364103CK
KMM5364103CKG
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KMM53616000CK
Abstract: KMM53616000CKG
Text: DRAM MODULE KMM53616000CK/CKG 4Byte 16Mx36 SIMM 16Mx4 & 16Mx1 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53616000CK/CKG DRAM MODULE KMM53616000CK/CKG
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KMM53616000CK/CKG
16Mx36
16Mx4
16Mx1
KMM53616000CK/CKG
16Mx1,
KMM53616000C
KMM53616000CK
KMM53616000CKG
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE M53611601CE0/CJ0-C 4Byte 16Mx36 SIMM 16Mx4 & 16Mx1 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. M53611601CE0/CJ0-C DRAM MODULE M53611601CE0/CJ0-C
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M53611601CE0/CJ0-C
16Mx36
16Mx4
16Mx1
M53611601CE0/CJ0
16Mx1,
M53611601CE0/CJ0-C
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KMM53232000CK
Abstract: KMM53232000CKG
Text: DRAM MODULE KMM53232000CK/CKG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53232000CK/CKG DRAM MODULE KMM53232000CK/CKG
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KMM53232000CK/CKG
32Mx32
16Mx4
KMM53232000CK/CKG
16Mx4,
KMM53232000C
32Mx32bits
KMM53232000CK
KMM53232000CKG
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM53216000CV/CVG 4Byte 16Mx32 SIMM 16Mx4 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53216000CV/CVG DRAM MODULE KMM53216000CV/CVG
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KMM53216000CV/CVG
16Mx32
16Mx4
KMM53216000CV/CVG
16Mx4,
KMM53216000C
16Mx32bits
16Mx4bits
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"32Mx32" DRAM 72-pin simm
Abstract: No abstract text available
Text: DRAM MODULE M53213200CE0/CJ0-C 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. M53213200CE0/CJ0-C DRAM MODULE M53213200CE0/CJ0-C
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M53213200CE0/CJ0-C
32Mx32
16Mx4
M53213200CE0/CJ0-C
16Mx4,
32Mx32bits
"32Mx32" DRAM 72-pin simm
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KMM5368003CK
Abstract: KMM5368003CKG KMM5368103CK KMM5368103CKG R/TPC 828
Text: KMM5368003CK/CKG KMM5368103CK/CKG DRAM MODULE 4Byte 8Mx36 SIMM 4Mx4 & 16M Quad CAS base Revision 0.1 Nov. 1997 DRAM MODULE KMM5368003CK/CKG KMM5368103CK/CKG Revision History Version 0.1 (Nov. 1997) • Changed the mode of parity check component from EDO to FP, refer to
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KMM5368003CK/CKG
KMM5368103CK/CKG
8Mx36
KMM5368103CK/CKG
KMM53680
KMM5368003CK
KMM5368003CKG
KMM5368103CK
KMM5368103CKG
R/TPC 828
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dram simm memory module samsung 30-pin 16M
Abstract: No abstract text available
Text: KMM5916100/T DRAM MODULES 16Mx9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM59161QG/T is a 16M bit x 9 Dynamic RAM high density memory module. The Samsung «1^5916100^ consist of nine KM41C16100/T DRAMs in 24-pin SOJ/TSOP II packages mounted on a 30-pin
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KMM5916100/T
16Mx9
KMM59161QG/T
KM41C16100/T
24-pin
30-pin
KMM5916100/T
KMM5916100-6
KMM5916100-7
dram simm memory module samsung 30-pin 16M
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Untitled
Abstract: No abstract text available
Text: KMM594000A DRAM MODULES 4 M X 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM594000A is a 4M bit X 9 Dynamic RAM high density memory module. The Samsung KMM594000A consist of nine KM41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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OCR Scan
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KMM594000A
130ns
150ns
180ns
KMM594000A
30-pin
KM41C4000AJ
20-pin
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Untitled
Abstract: No abstract text available
Text: DRAM MODULES KMM584000A 4 M X 8 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION The Samsung KM M 584000A is a 4M bit X 8 Dynamic RAM high density memory module. The Samsung KM M 584000A consist of eight KM 41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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KMM584000A
84000A-
84000A-10
100ns
130ns
150ns
180ns
84000A
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KMM584000
Abstract: KM41C4000J
Text: KM M584000 DRAM MODULES 4 M x 8 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM584000 is a 4M b itx 8 Dynamic RAM high density memory module. The Samsung KMM584000 consist of eight KM41C4000J DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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M584000
KMM584000-8
KMM584000-10
100ns
150ns
180ns
KMM584000
KM41C4000J
20-pin
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594000A
Abstract: No abstract text available
Text: KMM594000A DRAM MODULES 4 M X 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KM M 594000A is a 4M bit X 9 Dynamic RAM high density memory module. The Samsung KM M 594000A consist of nine KM 41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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OCR Scan
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KMM594000A
94000A
41C4000AJ
20-pin
30-pin
94000A-
594000A
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Untitled
Abstract: No abstract text available
Text: DRAM MODULES KMM584000A 4 M X 8 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KM M 584000A is a 4M bit X 8 Dynamic RAM high density memory module. The Samsung KM M 584000A consist of eight KM 41C4000AJ DRAMs in 20-pin SOJ package mounted on a 30-pin glass-epoxy
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KMM584000A
84000A
41C4000AJ
20-pin
30-pin
130ns
84000A-
150ns
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Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM53232000BK/BKG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 Sept. 1997 DRAM MODULE KMM53232000BK/BKG Revision History Version 0.0 (Sept, 1997) • Removed two AC parameters t CACP(access time from CAS) and tAAP(access time from col. addr.) in A C CHARACTERISTICS.
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KMM53232000BK/BKG
32Mx32
16Mx4
KMM53232000BK/BKG
16Mx4,
KMM53232000B
32Mx32bits
KMM53232000B
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"24 pin" DRAM
Abstract: No abstract text available
Text: DRAM MODULE KM M53232000B K/B KG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 Sept. 1997 ELECTRONICS DRAM MODULE KM M53232000B K/B KG Revision History Version 0.0 (Sept, 1997) • Removed two AC parameters t ELECTRONICS c acp (access time from CAS) and tAAP (access time from col. addr.) in A C CHARACTERISTICS.
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M53232000B
32Mx32
16Mx4
KMM53232000BK/BKG
16Mx4,
KMM53232000B
32Mx32bits
16Mx4bits
"24 pin" DRAM
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64mb 72-pin simm
Abstract: No abstract text available
Text: DRAM MODULE KMM53232004BK/BKG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 Sept. 1997 DRAM MODULE KMM53232004BK/BKG Revision History Version 0.0 (Sept, 1997) • Removed two AC parameters t CACP(access time from CAS) and tAAP(access time from col. addr.) in A C CHARACTERISTICS.
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OCR Scan
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KMM53232004BK/BKG
32Mx32
16Mx4
KMM53232004BK/BKG
16Mx4,
16Mx4bits
KMM53232004BK
cycles/64ms
64mb 72-pin simm
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dram simm memory module samsung 30-pin 16M
Abstract: 16M 30-pin SIMM
Text: KMM5816100/T DRAM MODULES 1 6 M x 8 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION • Performance range: The Samsung KMM5816100/T is a 16M bit x 8 Dynamic RAM high density memory module. The Samsung KMM5816100/T consist of eight KM41C16000J/T DRAMs
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KMM5816100/T
KMM5816100-6
KMM5816100-7
KMM5816100-8
110ns
130ns
150ns
KMM5816100/T
KM41C16000J/T
dram simm memory module samsung 30-pin 16M
16M 30-pin SIMM
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D0310
Abstract: No abstract text available
Text: KMM5321200BW DRAM Module ELECTRONICS KMM5321200BW/BWG Fast Page Mode 1Mx32 DRAM SIMM, 1K Refresh, 5V, using 1Mx16 DRAM FEATURES GENERAL DESCRIPTION • Part Identification The Samsung KMM5321200BW is a 1M bit x 32 - KMM5321200BW 1024 cycles/16ms Ref, SOJ, Solder
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KMM5321200BW
KMM5321200BW/BWG
1Mx32
1Mx16
KMM5321200BW
cycles/16ms
KMM5321200BWG
D0310
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Untitled
Abstract: No abstract text available
Text: SAMSUNG ELECTRONICS INC b7E » • V'ìbMmE GD1SE3T E74 KMM5916000/T DRAM MODULES 1 6 M x 9 CMOS DRAM SIMM Memory Module FEATURES GENERAL DESCRIPTION * Performance range: The Samsung KMM5916000/T is a 16M b itx 8 Dynamic RAM high density memory module. The Samsung
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KMM5916000/T
KMM5916000/T
KM41C16000/T
24-pin
30-pin
22/uF
KMM5916000-6
110ns
KMM5916000-7
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