EL132C Search Results

EL132C Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
EL132C		National Semiconductor	132 Lead Ceramic Quad Flatpack, Non-Conductive Tie bar		Original	PDF

EL132C Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
EL132C Abstract: No abstract text available Text: 132 Lead Ceramic Quad Flatpack Non-Conductive Tie Bar NS Package Number EL132C All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL	Original	PDF	EL132C EL132C
SCX6B120 Abstract: 132ld Industry Part 883 MICROCIRCUIT Text: MICROCIRCUIT DATA SHEET Original Creation Date: 01/08/98 Last Update Date: 01/28/98 Last Major Revision Date: 01/08/98 MNXD12/EIW-X REV 0A0 CUSTOMER ASIC CMOS 1.5u General Description SCX6B120 CMOS 1.5u gate array technology of using 11904 gates equivalent.	Original	PDF	MNXD12/EIW-X SCX6B120 XD12E14EIW/-MSP SCX6B120 6174HRA2 132LD, EL132CRC 132ld Industry Part 883 MICROCIRCUIT
transistor BC 458 Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF	MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
SCX6B48 Abstract: 132ld Text: MICROCIRCUIT DATA SHEET Original Creation Date: 01/08/98 Last Update Date: 01/28/98 Last Major Revision Date: 01/08/98 MNXDD4/EBE-X REV 0A0 CUSTOMER ASIC CMOS 1.5u General Description SCX6B48 CMOS 1.5u gate array technology of using 4788 gates equivalent.	Original	PDF	SCX6B48 XDD4E14EBE/-MSP SCX6B48 6124HRA2 132LD, EL132CRC M0002744 132ld
iso 1043-1 Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
CERAMIC QUAD FLATPACK CQFP Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B Text: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A	Original	PDF	EL28B MS101107 EL64A EL100A EL116A EL116B EL128A CERAMIC QUAD FLATPACK CQFP CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
iso 1043-1 Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
transistor BC 458 Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF