EL68B Search Results

EL68B Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
EL68B		National Semiconductor	68 Lead Ceramic Quad J-Bend, Dual Cavity		Original	PDF

EL68B Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
EL68B Abstract: No abstract text available Text: 68 Lead Ceramic Quad J-Bend Dual Cavity NS Package Number EL68B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL	Original	PDF	EL68B EL68B
transistor BC 458 Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF	MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
ceramic package Abstract: EL28A EL44A EL44B EL44C EL52A EL68A EL68B EL68C EL84A Text: Ceramic Quad J-Bend CQJB 28 Lead Ceramic Quad J-Bend NS Package Number EL28A 2000 National Semiconductor Corporation MS101106 www.national.com Ceramic Quad J-Bend (CQJB) August 1999 Ceramic Quad J-Bend (CQJB) 44 Lead Ceramic Quad J-Bend NS Package Number EL44A	Original	PDF	EL28A MS101106 EL44A EL44B EL44C EL52A EL68A ceramic package EL28A EL44A EL44B EL44C EL52A EL68A EL68B EL68C EL84A
iso 1043-1 Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
iso 1043-1 Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
transistor BC 458 Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF