Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
XX-651000-10
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18065
Abstract: No abstract text available
Text: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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Original
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PDF
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36-Pin
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
24-651000-10-P
18065
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Untitled
Abstract: No abstract text available
Text: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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Original
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PDF
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36-Pin
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
24-651000-10-P
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enthone
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
enthone
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Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
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Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
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Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
XX-651000-10
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ASTM-B16-85
Abstract: No abstract text available
Text: 1111687 36 PIN SSOP TO .6 DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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PDF
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
ASTM-B16-85
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transistor smd c5c
Abstract: transistor SMD R4d SMD diode C5C smd transistor r4D smd transistor R2C smd diode r4a MLQP48 smd transistor r4c r2d SMD Transistor IRS2093
Text: IRAUDAMP8 120W x 4 Channel Class D Audio Power Amplifier Using the IRS2093M and IRF6665 By Jun Honda, Yasushi Nishimura and Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of IRAUDAMP8 Demo board;
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PDF
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IRS2093M
IRF6665
transistor smd c5c
transistor SMD R4d
SMD diode C5C
smd transistor r4D
smd transistor R2C
smd diode r4a
MLQP48
smd transistor r4c
r2d SMD Transistor
IRS2093
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IRAUDAMP7D
Abstract: IRAUDAMP7D-150 SCHEMATIC 300w power amplifier stereo IRS2092 power amplifier circuit diagram with pcb
Text: IRAUDAMP7D 25W-500W Scalable Output Power Class D Audio Power Amplifier Reference Design Using the IRS2092 Protected Digital Audio Driver By Jun Honda, Manuel Rodríguez, Wenduo Liu CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of
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5W-500W
IRS2092
IRAUDAMP7D
IRAUDAMP7D-150
SCHEMATIC 300w power amplifier stereo
IRS2092 power amplifier circuit diagram with pcb
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95-132I25
Abstract: AMS-QQ-N-290
Text: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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95-132I25
132-Position
13x13
C36000,
995132125-P
13x13
132PGM13072-30
AMS-QQ-N-290
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AMP7S-100
Abstract: diode z104 IRAUDAMP7S-150 7G17A-220MR IRAUDAMP7S-100 inverter 12v to 220 ac mosfet based
Text: IRAUDAMP7S 25W-500W Scalable Output Power Class D Audio Power Amplifier Reference Design Using the IRS2092S Protected Digital Audio Driver By Jun Honda, Manuel Rodríguez, Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of
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Original
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PDF
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5W-500W
IRS2092S
AMP7S-100
diode z104
IRAUDAMP7S-150
7G17A-220MR
IRAUDAMP7S-100
inverter 12v to 220 ac mosfet based
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SMD TRANSISTOR R59
Abstract: 1N4148 equivalent SMD
Text: IRAUDAMP19 75W/4 x 2 Channel Class D Audio Power Amplifier Using the IR4301 By Jun Honda, Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of IRAUDAMP19 Demo board; • Always wear safety glasses whenever operating Demo Board
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IRAUDAMP19
IR4301
IRAUDAMP19
AN1170
SMD TRANSISTOR R59
1N4148 equivalent SMD
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diode z104
Abstract: 3.1v 0.5w ZENER DIODE 1N4148 equivalent SMD
Text: IRAUDAMP12 130W/4 x 2 Channel Class D Audio Power Amplifier Using the IR4301 By Jun Honda, Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of IRAUDAMP12 Demo board; • Always wear safety glasses whenever operating Demo Board
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PDF
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IRAUDAMP12
30W/4
IR4301
IRAUDAMP12
diode z104
3.1v 0.5w ZENER DIODE
1N4148 equivalent SMD
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Untitled
Abstract: No abstract text available
Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Original
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PDF
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95-100I25
Allr95-100I25-P
100-PGM13069-30
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BY 028
Abstract: 132 pin PGA socket
Text: Part No. 97-68302 QFP to PGA Adapter for Motorola MC68302 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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PDF
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MC68302
C360-68302
-or97-68302-P
132-PGM13065-30
BY 028
132 pin PGA socket
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Untitled
Abstract: No abstract text available
Text: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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Original
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PDF
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DSP56000/001
-or97-56001-P
100-PGM13069-30
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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Original
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97-AQ132D
-or97-AQ132D-P
132 pin PGA socket
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Untitled
Abstract: No abstract text available
Text: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: Convert surface mount QFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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Original
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PDF
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DSP56000/001
QQ-B-626.
-or97-56001-P
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Untitled
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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Original
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PDF
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96-144M65
-or96-144M65-P
144-PGM15048-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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Original
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PDF
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96-160M65
360M65
-or96-160M65-P
160-PGM15043-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Original
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PDF
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96-128M80
-or96-128M80-P
128-PGM15047-30
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100-PGM13069-30
Abstract: No abstract text available
Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Original
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95-100I25
UNr95-100I25-P
100-PGM13069-30
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Indium Tac Flux 020
Abstract: CU-106A CU-106A shelf life of BGAS DALE SOMC k type thermocouple utl USR(pet) gold embrittlement
Text: APPENDIX A Surface Tension and the Self-Centering of BGAs ITS PHYSICS ARE REVIEWED T O G E TH E R W I T H SOLDER TYPE, TEM PERATURE A N D THE PRESENCE OF C O N T A M I N A T E S A N D H O W THEY IN F LU E N C E By Steve G r e a t h o u s e THE S E L F - A L I G N I N G M O V E M E N T OF DEVICES D U R I N G
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OCR Scan
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PDF
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