F942B Search Results

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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging	Original	PDF	FDZ7064N FDZ7064N
Untitled Abstract: No abstract text available Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a	Original	PDF	FDZ206P FDZ206P
F63TNR Abstract: FDZ6966 F942B Text: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled	Original	PDF	FC-36A 330cm F63TNR FDZ6966 F942B
AT 30B Abstract: F63TNR FC-30B FDZ6966 D9942 Text: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled	Original	PDF	FC-30B 330cm AT 30B F63TNR FDZ6966 D9942
AT 30B Abstract: FC-30B 942b F942B Text: FC-30B 3.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-30B MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: FC-30B MOSFET BGA parts are shipped in tape. The carrier tape if made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film	Original	PDF	FC-30B F63TNR 330cm AT 30B 942b F942B