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    FBGA HEAT SLUG Search Results

    FBGA HEAT SLUG Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UE36C2620005011 Amphenol Communications Solutions 1x2 QSFP-DD cage with open top and heat sink clip, no heat sink Visit Amphenol Communications Solutions
    N0436N-ZK-E1-AY Renesas Electronics Corporation Power MOSFETs with Support for High-efficiency Drive and Low Heat Design Visit Renesas Electronics Corporation
    N0605N-S19-AY Renesas Electronics Corporation Power MOSFETs with Support for High-efficiency Drive and Low Heat Design Visit Renesas Electronics Corporation
    U77E112J2001 Amphenol Communications Solutions SFP CAGE WITH HEAT SINK Visit Amphenol Communications Solutions
    U79A1113001 Amphenol Communications Solutions XFP CAGE WITHOUT HEAT SINK Visit Amphenol Communications Solutions

    FBGA HEAT SLUG Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm PDF

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA PDF

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1 PDF

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1 PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Text: Table of Contents Introduction . 2 Package Overview . 3


    Original     		AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement PDF

    TMPRFE2G5

    Abstract: MARS2G5 bey34 DIODE BA40 LVTTL25
    Text: Hardware Design Guide September 8, 2004 MARS2G5 P-VC-XTRM TMPRFE2G5 Datamapper 2488/622/155 Mbits/s SONET/SDH x 10/100/1000 Mbits/s Ethernet 1 Introduction The documentation package for the Datamapper device consists of the following documents, available on a password protected website:


    Original     		DS04-011MPIC TMPRFE2G5 MARS2G5 bey34 DIODE BA40 LVTTL25 PDF

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


    Original     		XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100 PDF

    Texas Instruments Power Management Guide

    Abstract: TPS53312 TPS65168 Samsung Exynos 5 TPS65178 ips 500w circuit diagram 500w push-pull power tl598 schematic diagram Acid Battery charger 48 volt circuit tl494 UCC25600 application note Buck-boost TL494
    Text: Power Management Guide www.ti.com/power 2013 Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solu­tions with a full line of highperformance products. These products, which range from standard linear regulators to highly efficient DC/DC


    Original     		com/power2013 Texas Instruments Power Management Guide TPS53312 TPS65168 Samsung Exynos 5 TPS65178 ips 500w circuit diagram 500w push-pull power tl598 schematic diagram Acid Battery charger 48 volt circuit tl494 UCC25600 application note Buck-boost TL494 PDF

    BQ24153

    Abstract: schematic diagram TCON lcd samsung tps51631 LG 21 color tv Circuit Diagram schematics ultraslim UCD90120 TPS65175 tps65642 LM2740 INA230 QFN 10 2x2 footprint
    Text: Power Management Guide Power Management Guide 2014 2014 www.ti.com/power www.ti.com/power Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solu­tions with a full line of highperformance products. These products, which range from standard linear


    Original     		PDF

    2057 LED dot matrix display 5x7

    Abstract: BQ24153 TPS65175 tps59620 TPS51624 LM2585 36 V - 72 V to 24 V LM5045 lm3630 lm5160 schematic diagram TCON lcd samsung
    Text: Power Management Guide Power Management Guide 2015 www.ti.com/power www.ti.com/power 2015 Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solu­tions with a full line of highperformance products. These products, which range from standard linear


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K PDF

    S25FL164K

    Abstract: S25FL164 S25FL116K S25FL132K S25FL132 S25FL116 S25FL-P FAC024 S25FL-K footprint USON-8
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K S25FL164K S25FL164 S25FL132K S25FL132 S25FL116 S25FL-P FAC024 S25FL-K footprint USON-8 PDF

    S25FL116K

    Abstract: No abstract text available
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K PDF

    JESD216

    Abstract: No abstract text available
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial and Automotive Temperature Data Sheet (Preliminary) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K JESD216 PDF

    JESD21

    Abstract: No abstract text available
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Preliminary) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K JESD21 PDF

    S25FL164

    Abstract: S25FL164K S25FL116K S25FL132 S25FL132K JESD94 FL116K WND008 S25FL1-K S25FL116
    Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S25FL116K 16-Mbit S25FL116K S25FL164 S25FL164K S25FL132 S25FL132K JESD94 FL116K WND008 S25FL1-K S25FL116 PDF

    Untitled

    Abstract: No abstract text available
    Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)


    Original     		S25FL132K S25FL164K S25FL132K S25FL164K PDF

    S25FL164K

    Abstract: JESD21 SOIC 8 208mils pcb pattern
    Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)


    Original     		S25FL132K S25FL164K S25FL132K S25FL164K JESD21 SOIC 8 208mils pcb pattern PDF

    S25FL164K

    Abstract: No abstract text available
    Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)


    Original     		S25FL132K S25FL164K S25FL132K S25FL164K PDF

    SOIC 8 208mils pcb pattern

    Abstract: No abstract text available
    Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)


    Original     		S25FL132K S25FL164K S25FL132K S25FL164K SOIC 8 208mils pcb pattern PDF

    Untitled

    Abstract: No abstract text available
    Text: S25FL132K and S25FL164K S25FL132K - 32 Mbit 4 Mbyte S25FL164K - 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Advance Information)


    Original     		S25FL132K S25FL164K S25FL164K PDF

    Untitled

    Abstract: No abstract text available
    Text: S25FL1-K S25FL116K — 16 Mbit 2 Mbyte S25FL132K — 32 Mbit (4 Mbyte) S25FL164K — 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Extended Temperature S25FL1-K Cover Sheet Data Sheet


    Original     		S25FL1-K S25FL116K S25FL132K S25FL164K S25FL1-K PDF