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    FBGA PCB FOOTPRINT Search Results

    FBGA PCB FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    L77TWB5W5SEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L77TWA3W3SMP2V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Socket, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWP3W3PEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (40A) Contacts Only, Pin/Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWB5W5PMP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWA3W3PMP2V4F Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=9.52mm (0.375in), 4-40 Front Screwlock, With Bracket Without Boardlock Visit Amphenol Communications Solutions

    FBGA PCB FOOTPRINT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    bga rework

    Abstract: 39K200 39K100 39K165 39K30 39K50 WT2-56
    Text: Family, Package, and Density Migration in Delta39K and Quantum38K™ CPLDs Introduction I. Family Migration The Delta39K™ and Quantum38K™ family of Complex Programmable Logic Devices CPLDs combine dense logic, embedded memory, and configurable I/O standards. Further design flexibility is added by the easy migration options available


    Original     		Delta39KTM Quantum38KTM bga rework 39K200 39K100 39K165 39K30 39K50 WT2-56 PDF

    MCP market

    Abstract: No abstract text available
    Text: Multi Chip Package MCP Flash Memory and SRAM Solutions Small footprint consistent packaging Succeed with Flash technology leadership from AMD Succeed with AMD’s industry-leading family of multi-chip package (MCP) Flash and SRAM memory solutions. AMD’s MCP solutions feature high-performance AMD Flash and the highest quality SRAM, in a single convenient


    Original     		5451A MCP market PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm PDF

    BCM4750

    Abstract: Broadcom bcm4750 broadcom sensitivity GPS broadcom Broadcom 4750 broadcom gps broadcom sensitivity BCM4750 Block diagram on gps receiver GPS receiver bcm4750
    Text: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 mm2 PCB area for a complete AGPS solution


    Original     		BCM4750 157-dBm 162-dBm 4750-PB02-R BCM4750 Broadcom bcm4750 broadcom sensitivity GPS broadcom Broadcom 4750 broadcom gps broadcom sensitivity BCM4750 Block diagram on gps receiver GPS receiver bcm4750 PDF

    BCM84752

    Abstract: BCM84846 BROADCOM 100-pin FBGA BCM8475 BCM84846A0KFSBG
    Text: Broadcom B CM8 48 46 Dua l 10G BA SE-T Trans ce i ve r DUAL-PORT 10GBASE-T TRANSCEIVER Overview Highlights • The BCM84846 offers low power in this second-generation 40 nm 10GBASE-T device. • The small 21 mm package size reduces the footprint for 10GBASE-T, ideal for servers and


    Original     		10GBASE-T BCM84846 10GBASE-T, RJ-45 84846-PB01-R BCM84752 BROADCOM 100-pin FBGA BCM8475 BCM84846A0KFSBG PDF

    ADA17

    Abstract: No abstract text available
    Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold


    OCR Scan     		AS7C3256K36Z AS7C3256K32Z 100-pin 00000DID1DDDD 5M-1982. IPC-SM-782 ADA17 PDF

    Untitled

    Abstract: No abstract text available
    Text: Migration from 16 Megabit to 64 Megabit Flash Memory Devices Application Note This document will assist board-designers in creating a seamless migration path from AMD 16 Mb or 32 Mb low voltage LV flash and Simultaneous Read/Write (DL) devices to higher densities.


    Original     		LV320 LV640U PDF

    understanding test option

    Abstract: TN-00-20
    Text: TN-00-20: Understanding the Value of SI Testing Introduction Technical Note Understanding the Value of Signal Integrity Testing Introduction Historically, design engineers have used signal integrity SI testing as a key part of the design and development of new systems and for sustaining qualifications. While SI


    Original     		TN-00-20: 09005aef8172701b/Source: 09005aef81726ffc TN0020 understanding test option TN-00-20 PDF

    OF4337

    Abstract: 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD
    Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.


    Original     		DS90CR287/DS90CR288A 28-Bit Link-85 DS90CR287 DS90CR288A DS90CR288ASLC 5-Dec-2000] OF4337 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD PDF

    BCM4750

    Abstract: Broadcom bcm4750 GPS chip BCM4750 Broadcom 4750 Broadcom broadcom gps Broadcom RECEIVER broadcom sensitivity AGPS receiver spi GPS broadcom
    Text: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 sq mm 2 PCB area for a complete AGPS


    Original     		BCM4750 157-dBm 4750-PB01-R BCM4750 Broadcom bcm4750 GPS chip BCM4750 Broadcom 4750 Broadcom broadcom gps Broadcom RECEIVER broadcom sensitivity AGPS receiver spi GPS broadcom PDF

    NET2272REV1A-LF

    Abstract: pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s
    Text: Issue No. 29 PEX 8114 Key Features Application: ♦ Transparent and NonTransparent Modes ♦ Forward and Reverse Modes ♦ Low Power Consumption 2W ♦ Small Footprint 17 x 17 mm BGA Package ♦ Lead Free Available ♦ Supports PCI and PCI-X 33MHz thru 133MHz


    Original     		33MHz 133MHz 9056-BA66BI 9054-AC NET2272REV1A-LF; NET2272REV1A-LF pex8311 edge connector 8114BA 8524BB Rapid Development Kit PEX8311-AA66BC PEX8114BA PEX8114-AA13BI 8114s PDF

    Untitled

    Abstract: No abstract text available
    Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.


    Original     		DS90CR287/DS90CR288A 28-Bit Link-85 DS90CR287 DS90CR288A DS90CR287MTD PDF

    NATIONAL RX F2

    Abstract: No abstract text available
    Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data


    Original     		DS90C383/DS90CF384 24-Bit-Color 24-Bit DS90C383 DS90CF384 DS90CF384SLC DS90CF384SLCX AN-1085: NATIONAL RX F2 PDF

    Untitled

    Abstract: No abstract text available
    Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data


    Original     		DS90C383/DS90CF384 24-Bit-Color 24-Bit DS90C383 DS90CF384 AN-1085: 11-Sep-2000] 24-Jun-99 PDF

    Untitled

    Abstract: No abstract text available
    Text: DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec


    Original     		DS90CF384A/DS90CF364A 24-Bit-Color Link--65 18-Bit-Color 24-Bit 18-Bit PDF

    90CF386

    Abstract: No abstract text available
    Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/


    Original     		DS90CF386/DS90CF366 24-Bit-Color Link--85 18-Bit-Color 24-Bit 18-Bit 90CF386 PDF

    Untitled

    Abstract: No abstract text available
    Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/


    Original     		DS90CF386/DS90CF366 24-Bit-Color Link--85 18-Bit-Color 24-Bit 18-Bit PDF

    S71WS256PC0HH3

    Abstract: S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3
    Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S71WS-P S71WS256PC0HH3 S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3 PDF

    DS90C365MTD

    Abstract: DS90C385
    Text: DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz General Description The DS90C385 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.


    Original     		DS90C385/DS90C365 24-Bit Link-85 18-Bit DS90C365MTD DS90C385 PDF

    sx08a

    Abstract: ATQ100 SX32a RTSX16
    Text: A p p l i c a t i on N o t e SX to SX-A Design Migration In t ro d u c t i o n • Configurable Output State During Power-Up: All outputs can be programmed to either weak resistor pull-up or weak resistor pull-down for output tri-state. Actel’s newest line of antifuse FPGAs, SX-A, is fabricated


    Original     		PDF