fcbga package weight
Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749
Text: Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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EID-LPT-ALX-003
EID-LPT-ALX-004
EID-LPP3-ALX-001
fcbga package weight
Thermagon
PBGA-B495
shinetsu
fcBGA PACKAGE thermal resistance
Thermagon t pad
Intel Mobile Celeron Processor BGA
T-PCM27-94
shin-etsu
G-749
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fcBGA PACKAGE thermal resistance
Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5
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C13902EJ1V0PF00
fcBGA PACKAGE thermal resistance
FCBGA
676 BGA package tray
QFP PACKAGE thermal resistance
FC-BGA
1mm pitch BGA socket
PEAK tray drawing
nec shipping method
reball
tray sunrise
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INTEL fcBGA PACKAGE thermal resistance
Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
Text: Ultra Low Voltage Intel Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide October 2002 Order Number: 273802-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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PL1664-65)
INTEL fcBGA PACKAGE thermal resistance
fcBGA PACKAGE thermal resistance
273804
PCB design guide
T725
intel 830 "design guide"
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FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution
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1000-pin
FDH-BGA352
15MHz)
TR6878
H1/1999
fcBGA PACKAGE thermal resistance
EBGA672
FCBGA-160
BGA PACKAGE thermal profile
FR4 GLASS EPOXY stiffener
fbga 12 x 12 thermal resistance
BGA-560P-M01
fine BGA thermal profile
BGA-576
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mPGA479M
Abstract: fcBGA PACKAGE thermal resistance pioneer corporation T725 479-pin heat sink
Text: Low Voltage Intel Pentium® III Processor 512K Thermal Design Guide September 2002 Order Number: 273675-002 Low Voltage Intel® Pentium® III Processor 512K INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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PL1664-65)
mPGA479M
fcBGA PACKAGE thermal resistance
pioneer corporation
T725
479-pin
heat sink
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QFN PACKAGE thermal resistance
Abstract: transistor tip 1050 BGA 31 x 31 tray BGA PACKAGE TOP MARK sg 421 PEAK TRAY bga PEAK TRAY qfn 4 x 4 PEAK TRAY QFN 4x4 NBSG11BAR2 BGA package tray 40 x 40
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11
NBSG11/D
QFN PACKAGE thermal resistance
transistor tip 1050
BGA 31 x 31 tray
BGA PACKAGE TOP MARK
sg 421
PEAK TRAY bga
PEAK TRAY qfn 4 x 4
PEAK TRAY QFN 4x4
NBSG11BAR2
BGA package tray 40 x 40
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Untitled
Abstract: No abstract text available
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11
FCBGA-16
NBSG11/D
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485G
Abstract: NBSG11 NBSG11BAHTBG NBSG11BAR2 NBSG11MN
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11
FCBGA-16
NBSG11/D
485G
NBSG11BAHTBG
NBSG11BAR2
NBSG11MN
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Untitled
Abstract: No abstract text available
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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Untitled
Abstract: No abstract text available
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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NBSG14
FCBGA-16
NBSG14/D
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Untitled
Abstract: No abstract text available
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11/D
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FCBGA-16
Abstract: tip 410 transistor 485G NBSG11 NBSG11BA NBSG11BAHTBG NBSG11BAR2 98AON04795D AND802
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11
NBSG11
FCBGA-16
12DUCTOR
NBSG11/D
FCBGA-16
tip 410 transistor
485G
NBSG11BA
NBSG11BAHTBG
NBSG11BAR2
98AON04795D
AND802
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485G
Abstract: NBSG14 NBSG14BAHTBG NBSG14BAR2
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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FCBGA-16
NBSG14/D
485G
NBSG14BAHTBG
NBSG14BAR2
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qfn 3x3 tray dimension
Abstract: PEAK TRAY QFN 4x4 QFN tray qfn 4x4 PEAK TRAY bga QFN tray PEAK TRAY qfn 4 x 4 qfn 4x4 tray dimension QFN tray 3x3 485G NBSG14
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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NBSG14
NBSG14
FCBGA-16
NBSG14/D
qfn 3x3 tray dimension
PEAK TRAY QFN 4x4
QFN tray qfn 4x4
PEAK TRAY bga
QFN tray
PEAK TRAY qfn 4 x 4
qfn 4x4 tray dimension
QFN tray 3x3
485G
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485G
Abstract: NBSG11 NBSG11BA NBSG11BAR2
Text: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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485G
NBSG11
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NBSG11BAR2
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485G
Abstract: NBSG14 NBSG14BA SG14
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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NBSG14
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485G
NBSG14
NBSG14BA
SG14
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Untitled
Abstract: No abstract text available
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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NBSG14/D
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NBSG14
Abstract: No abstract text available
Text: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept
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FCBGA-16
NBSG14/D
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Untitled
Abstract: No abstract text available
Text: NBSG16 2.5V/3.3VĄSiGe Differential Receiver/Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The SG16 is a Silicon Germanium differential receiver/driver. The device is functionally equivalent to the EP16 and LVEP16 devices with much higher bandwidth and lower EMI capabilities.
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LVEP16
r14525
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AND8020
Abstract: NBSG11 NBSG11BA NBSG11BAR2
Text: NBSG11 Product Preview 2.5V/3.3VĄSiGe 1:2 Differential Clock Driver with RSECL* Outputs http://onsemi.com *Reduced Swing ECL The SG11 is a Silicon Germanium 1–to–2 differential fanout buffer, optimized for low skew and ultra–low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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NBSG11
r14525
NBSG11/D
AND8020
NBSG11
NBSG11BA
NBSG11BAR2
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fcBGA PACKAGE thermal resistance
Abstract: AND8020 NBSG14 NBSG14BA NBSG14BAR2 SG14 SG14 marking FCBGA
Text: NBSG14 Product Preview 2.5V/3.3VĄSiGe 1:4 Differential Clock Driver with RSECL* Outputs http://onsemi.com *Reduced Swing ECL The SG14 is a Silicon Germanium 1–to–4 clock distribution chip, optimized for low skew and ultra–low JITTER. Inputs incorporate internal 50 W termination resistors and accept
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r14525
NBSG14/D
fcBGA PACKAGE thermal resistance
AND8020
NBSG14
NBSG14BA
NBSG14BAR2
SG14
SG14 marking
FCBGA
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NBSG16
Abstract: NBSG16BA NBSG16BA100 NBSG16BA500R2 NBSG16BAR2 SG16
Text: NBSG16 2.5V/3.3VĄSiGe Differential Receiver/Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The SG16 is a Silicon Germanium differential receiver/driver. The device is functionally equivalent to the EP16 and LVEP16 devices with much higher bandwidth and lower EMI capabilities.
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LVEP16
r14525
NBSG16/D
NBSG16
NBSG16BA
NBSG16BA100
NBSG16BA500R2
NBSG16BAR2
SG16
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fcBGA PACKAGE thermal resistance
Abstract: 485G NBSG53A NBSG53ABAHTBG
Text: NBSG53A 2.5V/3.3V SiGe Selectable Differential Clock and Data D Flip-Flop/Clock Divider with Reset and OLS* The NBSG53A is a multi−function differential D flip−flop DFF or fixed divide by two (DIV/2) clock generator. This is a part of the GigaComm family of high performance Silicon Germanium
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FCBGA-16
QFN-16
NBSG53A
16-pin
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fcBGA PACKAGE thermal resistance
485G
NBSG53ABAHTBG
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