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    Micron Technology Inc PC28F00AP30BFA/REBALL/NGC

    NOR Flash Parallel 1.8V 1G-bit 64M x 16 100ns 64-Pin BGA Tray - Trays (Alt: PC28F00AP30BFA/REBALL/NGC)
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    Avnet Americas PC28F00AP30BFA/REBALL/NGC Tray 1
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    Micron Technology Inc MT29F1G01AAADDH4-IT:D/REBALL/S

    NAND Flash 3.3V 1Gbit 1G X 1bit 63-Ball VFBGA - Trays (Alt: MT29F1G01AAADDH4-I)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas MT29F1G01AAADDH4-IT:D/REBALL/S Tray 1
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    REBALL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reballing

    Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
    Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.


    Original     		PDF

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		PDF TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS

    PPC405D4

    Abstract: IBM powerpc 405gp NP4GS3 PVA c17 13n07 LP1 K09 marking a00b TDA 2040 XC5 539 405GP
    Text:  IBM PowerNP NP2G Network Processor Preliminary February 12, 2003  0.1 Copyright and Disclaimer  Copyright International Business Machines Corporation 2003 All Rights Reserved US Government Users Restricted Rights - Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.


    Original     		PDF IBM32NP160EPXCAA133. PPC405D4 IBM powerpc 405gp NP4GS3 PVA c17 13n07 LP1 K09 marking a00b TDA 2040 XC5 539 405GP

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


    Original     		PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    CSMV Access Processor Software Interface

    Abstract: MT48LC1M16A1TG-7SE KDS 40.000 MHZ crystal pcm motherboard circuit diagram mitsubishi 4x1mx16 basic c programming k56plus CRYSTAL 20 MHZ datasheet kds SMD CODE HBA RL56CSMV
    Text: 5/&609DQG5/&60 $Q\3RUW%0XOWL6HUYLFH$FFHVV3URFHVVRU +DUGZDUH,QWHUIDFH'HVFULSWLRQ Doc. No. 1137, Rev. 6 September 16, 1999 RL56CSMV/3 and RL56CSM/3 Hardware Interface Description Information provided by Conexant Systems, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by Conexant


    Original     		PDF 609DQG5/ RL56CSMV/3 RL56CSM/3 SO990810 CSMV Access Processor Software Interface MT48LC1M16A1TG-7SE KDS 40.000 MHZ crystal pcm motherboard circuit diagram mitsubishi 4x1mx16 basic c programming k56plus CRYSTAL 20 MHZ datasheet kds SMD CODE HBA RL56CSMV

    pcb warpage in ipc standard

    Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
    Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.


    Original     		PDF

    Iontophoresis

    Abstract: ASME-14 HF RFID loop antenna design injection molding military switch automobile drawings Calculator Keypad cheetah wedc reballing membrane key
    Text: Electronic Keypads and System Integration About White Electronic Designs Corporation WEDC White Electronic Designs Corporation (NASDAQ: WEDC) provides advanced technology solutions that help our customers leverage the evolution of technology. Each product and service within our diverse


    Original     		PDF IED001 Iontophoresis ASME-14 HF RFID loop antenna design injection molding military switch automobile drawings Calculator Keypad cheetah wedc reballing membrane key

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    Strain gage report

    Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
    Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.


    Original     		PDF SPRAA55 Strain gage report with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG

    GR-78-CORE

    Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
    Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with


    Original     		PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    rev 1.5 ibm crb

    Abstract: epc 535 TDA 820 m 7333 A 405 t14 n03 ppc jtag powerpc Core Databook IBM powerpc 405gp
    Text:  IBM PowerNP NP2G Network Processor Preliminary April 9, 2002  0.1 Copyright and Disclaimer  Copyright International Business Machines Corporation 2002 All Rights Reserved US Government Users Restricted Rights - Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.


    Original     		PDF IBM32NP160EPXCAA133 rev 1.5 ibm crb epc 535 TDA 820 m 7333 A 405 t14 n03 ppc jtag powerpc Core Databook IBM powerpc 405gp

    INTEL FLASH MEMORY

    Abstract: Intel flash memory 210830 reballing Intel SO Package guide intel flash intel sram INTEL ELECTRONIC COMPONENTS 2977763 intel nor flash Intel Stacked CSP
    Text: D 6.0 CSP TOOLS AND SOFTWARE SUPPORT 6.1 Tools and Software Support Overview Today’s competitive flash memory market demands more than just the best products to be successful. Development tools and software that help you design your product using Intel Flash Memory products are a


    Original     		PDF

    MT46H32M32LFCM-6

    Abstract: MICRON Cross Reference AS4MDDR32M32PBG-6/ET AS4MDDR32M32PBG-6
    Text: 1Gb MOBILE DDR SRAM AS4MDDR32M32PBG Micross Components Data Sheet Addendum 32Mx32 mobile DDR SDRAM Micross Device part# AS4MDDR32M32PBG-6/ET Base OEM part# MT46H32M32LFCM-6 L IT:A OEM vendor: Micron About this Addendum: Micross Components sources the plastic encapsulated part from the


    Original     		PDF AS4MDDR32M32PBG 32Mx32 AS4MDDR32M32PBG-6/ET MT46H32M32LFCM-6 -46oC 105oC -40oC 105oC MICRON Cross Reference AS4MDDR32M32PBG-6/ET AS4MDDR32M32PBG-6

    Teradyne connector

    Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
    Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight


    Original     		PDF TB-2082 Teradyne connector 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    Loctite 3567

    Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
    Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile


    Original     		PDF

    CM16C550P

    Abstract: 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP
    Text: Rev. 2.1 i960 Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF 74ALS245A 74ALS245AD-T 74AS244 SN74AS244DWR 74F07 N74F07AD 74F04 74F04D 74F32 SN74F32DR CM16C550P 4.7 uf/50v smd capacitor sad1 diode smd NPN CD100 transistor SPER 1A1 C4 0.1 uf/50v smd capacitor DIALCO C01100 cm16c550pe TRAY DAEWON TSOP

    BGA Solder Ball 0.35mm collapse

    Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
    Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table


    Original     		PDF TB-2241 S1647 S1884 BGA Solder Ball 0.35mm collapse TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm

    SAC405

    Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
    Text: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent


    Original     		PDF countrieESD51 JESD5112, SAC405 IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station

    BGA reflow guide

    Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
    Text: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		PDF TN1076 1-800-LATTICE BGA reflow guide pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga