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FD040H02A5P Abstract: MIL-HDBK-263 S1025 for IR hexfet die Text: Bulletin I0164J FD040H02A5F FRED Die in Wafer Form z z z 200V VF = 1.0V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VRRM IRM trr RthJC	Original	PDF	I0164J FD040H02A5F 12-Mar-07 FD040H02A5P MIL-HDBK-263 S1025 for IR hexfet die

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Abstract: MIL-HDBK-263 S1025 for IR hexfet die
Text: Bulletin I0164J FD040H02A5F FRED Die in Wafer Form z z z 200V VF = 1.0V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VRRM IRM trr RthJC

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I0164J FD040H02A5F 12-Mar-07 FD040H02A5P MIL-HDBK-263 S1025 for IR hexfet die