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    Untitled

    Abstract: No abstract text available
    Text: Bulletin I0533J rev. A 04/06 FD080H02A5F FRED Die in Wafer Form z z z 200V VF = 0.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request) Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VFM


    Original     		PDF I0533J FD080H02A5F

    Untitled

    Abstract: No abstract text available
    Text: Bulletin I0533J 12/05 FD080H02A5F FRED Die in Wafer Form z z z 200V VF = 0.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VFM VFM VRRM


    Original     		PDF I0533J FD080H02A5F 25life.

    MIL-HDBK-263

    Abstract: S1025 FD080H02A5F
    Text: Bulletin I0533J rev. A 04/06 FD080H02A5F FRED Die in Wafer Form z z z 200V VF = 0.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request) Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VFM


    Original     		PDF I0533J FD080H02A5F 12-Mar-07 MIL-HDBK-263 S1025 FD080H02A5F