astm D150
Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™
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D5470
IPC-TM-650
astm D150
D412
ASTM D412
ASTM D5470
ASTM D2240, D412
ASTM D2240
T-Flex 200
Outgassing
CVCM
ASTM
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9707K
Abstract: No abstract text available
Text: Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9707 is a pressure sensitive adhesive (PSA) transfer tape with isotropic electrical conductivity. The PSA matrix is filled with conductive fillers that allow interconnection
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9707K
225-3S-06
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High-Speed Cable
Abstract: 963-013
Text: High-Speed Cable SATA / eSATA 963-013 Ordering Information 963-013: 100 ohm SATA/eSATA cable with polyurethane jacket Wrap Data Pair V F F Overall Shield Filler Overall Jacket Construction Details Conductors Insulation Drain Wire Braid Tape Jacket Wire Colors
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Thermal Gap Filler
Abstract: D149 D2240 D257 D412 E595
Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this
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A14175-00
Thermal Gap Filler
D149
D2240
D257
D412
E595
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HG-2
Abstract: 3060A 7471A AES chips E.04
Text: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04
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6010B
HG-2
3060A
7471A
AES chips
E.04
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Untitled
Abstract: No abstract text available
Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing
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50psi,
300-H
A15293-00
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Untitled
Abstract: No abstract text available
Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR200
A16503-00
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D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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A568
Abstract: 3W3P
Text: REV ECR 8833 2. MATERIAL SPECIFICATIONS: SHELL: STEEL PER ASTM A568 INSULATOR: GLASS FILLER POLYESTER BY APPD DATE RDG A DESCRIPTION PSM 03/15/06 NOTES: UNLESS OTHERWISE SPECIFIED 1. FOR GENERAL SERIES SPECIFICATIONS, SEE SD10-0000. 3. FINISH SPECIFICATIONS:
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SD10-0000.
ASTM-B633
5M-1994
SD3W3P-00-BD
A568
3W3P
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D2240
Abstract: D257 E595
Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component
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A15955-00
D2240
D257
E595
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Untitled
Abstract: No abstract text available
Text: ACCESSORIES Model HD-FP2L Filler Panel with Lens Installation/Operation EN55103-1 E1-E5; EN55103-2 E1-E4 Typical Performance reflects product at publication time exclusive of EMC data, if any, supplied with product. Specifications are subject to change without notice.
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EN55103-1
EN55103-2
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Untitled
Abstract: No abstract text available
Text: Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.20 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.65 mm 0.0063W/cm°C Charts enclosed :
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063W/cm
Res65
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Untitled
Abstract: No abstract text available
Text: TRS Rack System N + 1 REDUNDANT POWER RACK SYSTEMS Features: • N+1 redundancy • Front access • Hot pluggability • Up to 6 KW in one 3U 5 1/4" rack • Field configurable • Single phase or 3 phase input • Blank filler panels available Consult factory for Value Added
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SLR-56
Abstract: No abstract text available
Text: Attention Points In Handling Through-hole LEDs SLR-56 Series Visual light emitting diode does not contain reinforcement materials such as glass fillers. Therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous intensity may occur. Please take care of the handling.
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SLR-56
125MAX,
120secMAX)
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SLR-322
Abstract: No abstract text available
Text: Attention Points In Handling Through-hole LEDs SLR-322 Series Visual light emitting diode does not contain reinforcement materials such as glass fillers. Therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous intensity may occur. Please take care of the handling.
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SLR-322
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EMI gaskets
Abstract: filler
Text: CATALOG 126:CATALOG 126.qxd 6/9/2008 10:01 AM Page 33 DIN-Based VectorPaktm Subracks ELECTRONICS & TECHNOLOGY, INC. A FINE TECHNOLOGY GROUP EMC Gasketed Filler Panels Filler Panel Profiles - 4,8 or 12 HP Widths EMC Filler Panels/ Blank-off Plates
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95000002B
FP52A4HP
FP10A4HP
FP15A4HP
FP52A8HP
FP10A8HP
FP15A8HP
FP52A12HP
FP10A12HP
FP15A12HP
EMI gaskets
filler
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Untitled
Abstract: No abstract text available
Text: Quality Products. Service Excellence. Audio/Visual Cabinet RB-AV Series The RB-AV Series is a cost-effective and fully assembled enclosed rack system designed for A/V and Security applications. Fully assembled, the RB-AV Series includes pre-installed shelves, filler panels, casters and leveling feet.
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16-gauge
EIA-310-D
1421CNABK
RB-AV18
RB-AV27
RB-AV42
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Untitled
Abstract: No abstract text available
Text: Thermal Data DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:
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063W/cm
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6B495
Abstract: 32F8101 Si684
Text: SSI 3 2 F 8 1 01/8102/8103/8104 ¿ m m S iis h n Low-Power Programmable Filter s ' A TDK Group/Company Advance Information December 1993 DESCRIPTION FEATURES The 32F81 OX is a high performance, low power, digitally programmable low-pass filler for applications re
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32F81
32F8101,
32F8102,
32F8103,
32F8104,
6B495
32F8101
Si684
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op 30MHZ
Abstract: 2B55 XF-200
Text: 1. M e c h a n ic a l D im e n s io n a : 0.815 Max • XF20064C Transm it Seven Pale Filter -I ^ XFM RS WWW 2. S c h e m a t i c : in x m iJ a U 2 rn 1 o- x 2 o- Ö D -0.120i0.020 Receive Five Pole Filler 6 o- O 11 8 o7 o- o 10 Notes: 3. E l e c t r i c a l S p e c i f i c a t i o n s : 25°C
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XF20064C
120i0
10MHz
-15dB
5-10MHz
-30dB
1-10MHz
30MHz
17MHz
op 30MHZ
2B55
XF-200
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Untitled
Abstract: No abstract text available
Text: 19-4526; Rtv2 6/96 /U I/JX I/U I 8th-Order, Lowpass, S w itched-C apacitor Fitters The MAX291 /MAX295 Butterworth filters provide maxi mally flat passband response, and the MAX292/MAX296 Bessel fillers provide low overshoot and fast settling. All four filters have fixed responses, so the design task is
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MAX291
/MAX295
MAX292/MAX296
16-pin
00132Gfl
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slimline sata to usb diagram
Abstract: AXXBASICRAIL AXXSASIOMOD AXXGBIOMOD S5000PAL F chassis connector AXXRACKCARM SLIMLINE SATA S5000P vga to component break out cable
Text: o \J CD in Install Optical Device (optional 1. Remove the Empty Tray "O Q A 2. Install the Interposer Board Plug the interposer board connector i nto the m atching connector on the back of the optical device. r < © CAUTION: To maintain proper system cooling, a filler blank
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Untitled
Abstract: No abstract text available
Text: L i n t A B TECHNOLOGY ¡_ow N0jse, Fast, Quad Universal Filter Building Block FC A TU R C S D € S C R IP T IO n • 4 Fillers in a 0.3" Wide Package The LTC1064 consists of four high speed, low noise
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LTC1064
140kHz
24-Lead
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MCI455
Abstract: mc145502m 145502-M 145502 MC14404 MC 2871
Text: MOTOROLA • SEMICONDUCTOR TECHNICAL DATA MC145500 MC145501 MC145502 MC145503 MC145505 Advance Information PCM C o d e c -F ilte r M o n o -C ircu it The MC145500, MC145501, M C 145502, MC145503, and MC145505 are all per channel PCM codec-filler mono-circuits These devices perform the voice
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MC145500,
MC145501,
MC145503,
MC145505
MC145500
MC145503
16-pin
MC145501
18-pin
MCI455
mc145502m
145502-M
145502
MC14404
MC 2871
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