BX5519
Abstract: FP5519 TM5519 TN5519
Text: RF AMPLIFIER MODEL TM5519 Available as: TM5519, 4 Pin TO-8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +43 dBm (Typ.)
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TM5519
TM5519,
TN5519,
FP5519,
BX5519,
BX5519
FP5519
TM5519
TN5519
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BX5519
Abstract: FP5519 TM5519 TN5519
Text: Available as: RF AMPLIFIER MODEL TM5519, 4 Pin TO-8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C • ■ ■ Operating Temp. - 55 ºC to +85 ºC
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PDF
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TM5519,
TN5519,
FP5519,
BX5519,
BX5519
FP5519
TM5519
TN5519
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SP5519
Abstract: No abstract text available
Text: Cross Reference Guide FP5519 / SP5519* * Part number for additional environmental screening. Performance Data Package Drawing Frequency 5.0 - 500.0 MHz Gain 15.0 dB Typical 14.0 dB Min Noise Figure 2.2 dB Typical 3.0 dB Max P1dB 14.5 dBm Typical 11.5 dBm Min
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FP5519
SP5519*
SP5519
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Untitled
Abstract: No abstract text available
Text: Available as: RF AMPLIFIER MODEL TM5519 TM 5519, 4 Pin TO -8 T4 TN5519, 4 Pin Surface Mount (SM3) FP5519, 4 Pin Flatpack (FP4) BX5519, Connectorized Housing (H1) Features Typical Intermodulation Performance at 2 5 0 C • ■ ■ ■ Second Order Harmonic Intercept P oint
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OCR Scan
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PDF
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TM5519
TN5519,
FP5519,
BX5519,
S11--------Deg
S21---------Deg
S12---------Deg
S22----Deg
215-464-400J/13/03
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